CN102107241B - 用于从封装带分离半导体封装的装置 - Google Patents

用于从封装带分离半导体封装的装置 Download PDF

Info

Publication number
CN102107241B
CN102107241B CN201010170778.9A CN201010170778A CN102107241B CN 102107241 B CN102107241 B CN 102107241B CN 201010170778 A CN201010170778 A CN 201010170778A CN 102107241 B CN102107241 B CN 102107241B
Authority
CN
China
Prior art keywords
plate
along
vertical
packaging belt
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201010170778.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN102107241A (zh
Inventor
金正燮
金大焕
金焕彬
李志圣
崔震宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN102107241A publication Critical patent/CN102107241A/zh
Application granted granted Critical
Publication of CN102107241B publication Critical patent/CN102107241B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Dicing (AREA)
CN201010170778.9A 2009-12-28 2010-04-23 用于从封装带分离半导体封装的装置 Active CN102107241B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090131595A KR101675782B1 (ko) 2009-12-28 2009-12-28 반도체 패키지 절단 장치
KR10-2009-0131595 2009-12-28

Publications (2)

Publication Number Publication Date
CN102107241A CN102107241A (zh) 2011-06-29
CN102107241B true CN102107241B (zh) 2014-05-14

Family

ID=44171587

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010170778.9A Active CN102107241B (zh) 2009-12-28 2010-04-23 用于从封装带分离半导体封装的装置

Country Status (2)

Country Link
KR (1) KR101675782B1 (ko)
CN (1) CN102107241B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105098098B (zh) 2015-06-11 2017-06-09 京东方科技集团股份有限公司 一种封装设备及其使用方法
KR102484237B1 (ko) * 2020-11-06 2023-01-04 ㈜토니텍 반도체 패키지용 마운터 커팅장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101241839A (zh) * 2007-02-09 2008-08-13 韩美半导体株式会社 用于制造半导体封装的系统和用于制造半导体封装的方法
CN201265119Y (zh) * 2008-08-08 2009-07-01 天津市宝嘉服装机械有限公司 条带自动切断装置
CN101523556A (zh) * 2006-10-09 2009-09-02 韩美半导体株式会社 加工装置以及使用该加工装置的半导体条带加工系统
CN201346604Y (zh) * 2008-12-22 2009-11-18 上海通彩自动化设备有限公司 单台多工位移送机械手
CN201389669Y (zh) * 2009-04-07 2010-01-27 珠海比昂电子设备有限公司 卷材冲切开料机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163386A (ja) * 1986-01-13 1987-07-20 Daito Seiki Kogyo Kk レ−ザ−ダイオ−ド用ポイントスクライブ装置
JPH0355468A (ja) * 1989-07-20 1991-03-11 Sanyo Electric Co Ltd 温風機
JPH09155468A (ja) * 1995-12-04 1997-06-17 Amada Co Ltd パンチプレス
KR100244087B1 (ko) * 1997-08-28 2000-02-01 김규현 반도체패키지 제조용 싱귤레이션 장비의 다이
KR100244082B1 (ko) * 1997-08-28 2000-02-01 김규현 반도체패키지 제조용 싱귤레이션 장비의 반도체패키지 배출 장치
JP3880170B2 (ja) * 1997-11-28 2007-02-14 アピックヤマダ株式会社 半導体装置切断収納装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101523556A (zh) * 2006-10-09 2009-09-02 韩美半导体株式会社 加工装置以及使用该加工装置的半导体条带加工系统
CN101241839A (zh) * 2007-02-09 2008-08-13 韩美半导体株式会社 用于制造半导体封装的系统和用于制造半导体封装的方法
CN201265119Y (zh) * 2008-08-08 2009-07-01 天津市宝嘉服装机械有限公司 条带自动切断装置
CN201346604Y (zh) * 2008-12-22 2009-11-18 上海通彩自动化设备有限公司 单台多工位移送机械手
CN201389669Y (zh) * 2009-04-07 2010-01-27 珠海比昂电子设备有限公司 卷材冲切开料机

Also Published As

Publication number Publication date
KR101675782B1 (ko) 2016-11-14
CN102107241A (zh) 2011-06-29
KR20110075213A (ko) 2011-07-06

Similar Documents

Publication Publication Date Title
CN102107241B (zh) 用于从封装带分离半导体封装的装置
CN102414098B (zh) 具有改进的驱动装置设计的回转式运输装置
CN103022850A (zh) Btb连接器全自动生产线
CN101461035B (zh) 用于从基本平直的元件阵列中分离元件的顶料单元
CN107081371A (zh) 自动裁切系统
CN1926937B (zh) 线性驱动机构和采用该线性驱动机构的电子元件安装装置
WO2006056237A3 (en) Machine for the mechanical personalization of identification cards
CN111942849A (zh) 一种减速器齿轮轴上料装置和上料方法
KR102299699B1 (ko) 커넥터 조립용 터미널단자의 스티칭장치
CN207650850U (zh) 一种带有ocr字符检测装置的智能卡发卡装置
CN110480296A (zh) 一种排母壳体连接件的自动组装装置
CN101809829B (zh) 半导体插件用插座
CN101924050A (zh) 用于提供大键合力的晶粒键合机
CN110253664B (zh) 一种适用于切筋成型系统的移料装置
US7603835B2 (en) Device for feeding carton blanks to a packaging machine
CN103448151B (zh) 晶片切割装置以及半导体元件的制造方法
US20070178721A1 (en) Press-Fitting Head
JP2018187708A (ja) 部品組付装置
JP2000264437A (ja) 電子部品製造装置
KR101061039B1 (ko) 와이어링 하네스 검사 시스템
CN112027551A (zh) 一种减速器齿轮轴气体吹出机构和气体吹出方法
CN220278164U (zh) 一种联动装置及切筋设备
JP4705734B2 (ja) ガイド装置
CN113353719B (zh) 连接线转装机构
CN205595316U (zh) 一种硅片输送升降装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SEMES CO., LTD.

Free format text: FORMER OWNER: SAIKELOON LTD.

Effective date: 20130416

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20130416

Address after: South Korea Chungnam Cheonan City

Applicant after: SEMES Co., Ltd.

Address before: Chungnam Cheonan City, northwest cave N3 4-4 car

Applicant before: Saikeloon Ltd.

C14 Grant of patent or utility model
GR01 Patent grant