CN102107241B - 用于从封装带分离半导体封装的装置 - Google Patents
用于从封装带分离半导体封装的装置 Download PDFInfo
- Publication number
- CN102107241B CN102107241B CN201010170778.9A CN201010170778A CN102107241B CN 102107241 B CN102107241 B CN 102107241B CN 201010170778 A CN201010170778 A CN 201010170778A CN 102107241 B CN102107241 B CN 102107241B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090131595A KR101675782B1 (ko) | 2009-12-28 | 2009-12-28 | 반도체 패키지 절단 장치 |
KR10-2009-0131595 | 2009-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102107241A CN102107241A (zh) | 2011-06-29 |
CN102107241B true CN102107241B (zh) | 2014-05-14 |
Family
ID=44171587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010170778.9A Active CN102107241B (zh) | 2009-12-28 | 2010-04-23 | 用于从封装带分离半导体封装的装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101675782B1 (ko) |
CN (1) | CN102107241B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105098098B (zh) | 2015-06-11 | 2017-06-09 | 京东方科技集团股份有限公司 | 一种封装设备及其使用方法 |
KR102484237B1 (ko) * | 2020-11-06 | 2023-01-04 | ㈜토니텍 | 반도체 패키지용 마운터 커팅장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101241839A (zh) * | 2007-02-09 | 2008-08-13 | 韩美半导体株式会社 | 用于制造半导体封装的系统和用于制造半导体封装的方法 |
CN201265119Y (zh) * | 2008-08-08 | 2009-07-01 | 天津市宝嘉服装机械有限公司 | 条带自动切断装置 |
CN101523556A (zh) * | 2006-10-09 | 2009-09-02 | 韩美半导体株式会社 | 加工装置以及使用该加工装置的半导体条带加工系统 |
CN201346604Y (zh) * | 2008-12-22 | 2009-11-18 | 上海通彩自动化设备有限公司 | 单台多工位移送机械手 |
CN201389669Y (zh) * | 2009-04-07 | 2010-01-27 | 珠海比昂电子设备有限公司 | 卷材冲切开料机 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62163386A (ja) * | 1986-01-13 | 1987-07-20 | Daito Seiki Kogyo Kk | レ−ザ−ダイオ−ド用ポイントスクライブ装置 |
JPH0355468A (ja) * | 1989-07-20 | 1991-03-11 | Sanyo Electric Co Ltd | 温風機 |
JPH09155468A (ja) * | 1995-12-04 | 1997-06-17 | Amada Co Ltd | パンチプレス |
KR100244087B1 (ko) * | 1997-08-28 | 2000-02-01 | 김규현 | 반도체패키지 제조용 싱귤레이션 장비의 다이 |
KR100244082B1 (ko) * | 1997-08-28 | 2000-02-01 | 김규현 | 반도체패키지 제조용 싱귤레이션 장비의 반도체패키지 배출 장치 |
JP3880170B2 (ja) * | 1997-11-28 | 2007-02-14 | アピックヤマダ株式会社 | 半導体装置切断収納装置 |
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2009
- 2009-12-28 KR KR1020090131595A patent/KR101675782B1/ko active IP Right Grant
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2010
- 2010-04-23 CN CN201010170778.9A patent/CN102107241B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101523556A (zh) * | 2006-10-09 | 2009-09-02 | 韩美半导体株式会社 | 加工装置以及使用该加工装置的半导体条带加工系统 |
CN101241839A (zh) * | 2007-02-09 | 2008-08-13 | 韩美半导体株式会社 | 用于制造半导体封装的系统和用于制造半导体封装的方法 |
CN201265119Y (zh) * | 2008-08-08 | 2009-07-01 | 天津市宝嘉服装机械有限公司 | 条带自动切断装置 |
CN201346604Y (zh) * | 2008-12-22 | 2009-11-18 | 上海通彩自动化设备有限公司 | 单台多工位移送机械手 |
CN201389669Y (zh) * | 2009-04-07 | 2010-01-27 | 珠海比昂电子设备有限公司 | 卷材冲切开料机 |
Also Published As
Publication number | Publication date |
---|---|
KR101675782B1 (ko) | 2016-11-14 |
CN102107241A (zh) | 2011-06-29 |
KR20110075213A (ko) | 2011-07-06 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEMES CO., LTD. Free format text: FORMER OWNER: SAIKELOON LTD. Effective date: 20130416 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130416 Address after: South Korea Chungnam Cheonan City Applicant after: SEMES Co., Ltd. Address before: Chungnam Cheonan City, northwest cave N3 4-4 car Applicant before: Saikeloon Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant |