CN102091874B - 激光直接成型技术用治具 - Google Patents
激光直接成型技术用治具 Download PDFInfo
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- CN102091874B CN102091874B CN 201010610983 CN201010610983A CN102091874B CN 102091874 B CN102091874 B CN 102091874B CN 201010610983 CN201010610983 CN 201010610983 CN 201010610983 A CN201010610983 A CN 201010610983A CN 102091874 B CN102091874 B CN 102091874B
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- laser direct
- processed
- forming technology
- direct forming
- workpiece
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Priority Applications (1)
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CN 201010610983 CN102091874B (zh) | 2010-12-23 | 2010-12-23 | 激光直接成型技术用治具 |
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CN 201010610983 CN102091874B (zh) | 2010-12-23 | 2010-12-23 | 激光直接成型技术用治具 |
Publications (2)
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CN102091874A CN102091874A (zh) | 2011-06-15 |
CN102091874B true CN102091874B (zh) | 2013-06-19 |
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CN 201010610983 Active CN102091874B (zh) | 2010-12-23 | 2010-12-23 | 激光直接成型技术用治具 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593815A (en) * | 1989-07-31 | 1997-01-14 | Goldstar Co., Ltd. | Cleaving process in manufacturing a semiconductor laser |
CN201997851U (zh) * | 2010-12-23 | 2011-10-05 | 上海煜鹏通讯电子有限公司 | 激光直接成型技术用治具 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100814110B1 (ko) * | 2006-08-11 | 2008-03-14 | 한국원자력연구원 | I-125 시드 티타늄 튜브의 레이저 용접장치 및 그에 따른용접방법 |
KR100945669B1 (ko) * | 2008-02-21 | 2010-03-05 | 주식회사 이엠따블유 | 안테나 어레이 |
KR101034625B1 (ko) * | 2009-04-29 | 2011-05-16 | 나준연 | 자동용접장치용 지그 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593815A (en) * | 1989-07-31 | 1997-01-14 | Goldstar Co., Ltd. | Cleaving process in manufacturing a semiconductor laser |
CN201997851U (zh) * | 2010-12-23 | 2011-10-05 | 上海煜鹏通讯电子有限公司 | 激光直接成型技术用治具 |
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CN102091874A (zh) | 2011-06-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI RADIATE COMMUNCATION ELECTRONICS CO., LTD Free format text: FORMER NAME: SHANGHAI RADIATE COMMUNICATION ELECTRONICS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 201108 Shanghai City, Minhang District City Road, No. seventh, building 1835 Patentee after: SHANGHAI RADIATE COMMUNICATION ELECTRONICS Co.,Ltd. Address before: 201109 G building, No. 185, Minhang District Road, Shanghai, China Patentee before: SHANGHAI RADIATE COMMUNICATION ELECTRONICS Co.,Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Fixture for laser direct forming technology Effective date of registration: 20210926 Granted publication date: 20130619 Pledgee: Industrial Bank Co.,Ltd. Shanghai Zhangjiang sub branch Pledgor: SHANGHAI RADIATE COMMUNICATION ELECTRONICS Co.,Ltd. Registration number: Y2021310000081 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230321 Granted publication date: 20130619 Pledgee: Industrial Bank Co.,Ltd. Shanghai Zhangjiang sub branch Pledgor: SHANGHAI RADIATE COMMUNICATION ELECTRONICS Co.,Ltd. Registration number: Y2021310000081 |