CN102089398B - 各向异性导电粘合剂 - Google Patents
各向异性导电粘合剂 Download PDFInfo
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract
在含有环氧化合物和固化剂的环氧系粘合剂中分散有导电颗粒而成的各向异性导电粘合剂,其固化物在35℃、55℃、95℃和150℃下的弹性模量分别为EM35、EM55、EM95和EM150,55℃和95℃之间的弹性模量变化率为ΔEM55-95,95℃和150℃之间的弹性模量变化率为ΔEM95-150时,满足数学式(1)-(5)。700MPa≤EM35≤3000Mpa(1),EM150<EM95<EM55<EM35(2),ΔEM55-95<ΔEM95-150(3),20%≤ΔEM55-95(4),40%≤ΔEM95-150(5)。
Description
技术领域
本发明涉及各向异性导电粘合剂。
背景技术
作为将驱动器IC或LED元件等的芯片部件组装在电路基板上的方法,广泛采用倒装组装的方法,该方法使用使导电颗粒分散于环氧系粘合剂、成型为薄膜状的各向异性导电薄膜(专利文献1)。该方法通过各向异性导电薄膜中的导电颗粒实现芯片部件与电路基板之间的电连接,同时通过环氧系粘合剂实现芯片部件在电路基板上的固定,因此连接工序短,可实现高生产效率。
现有技术文献
专利文献
专利文献1:日本特许第3342703号
发明内容
但是,若通过使用环氧系粘合剂的各向异性导电薄膜在电路基板上组装芯片部件,对所得的组装品进行对应无铅焊料的回流试验、热冲击试验(TCT)、高温高湿试验、压力锅试验(PCT)等可靠性试验,则出现下述问题的可能性增大:产生基于电路基板与芯片之间的热膨胀系数差的内部应力,芯片与电路基板之间的导通电阻值增大;以及芯片部件由电路基板剥落。这些问题在最近作为节能照明材料而备受关注的LED装置中也不例外。
本发明的目的在于解决上述现有技术的课题,即使在对使用各向异性导电粘合剂将芯片部件组装在电路基板上得到的组装品进行对应无铅焊料的回流试验、热冲击试验(TCT)、高温高湿试验、压力锅试验(PCT)等伴随组装品的加热的可靠性试验时,仍可保持电路基板与芯片部件之间有高的导通可靠性,且可以使它们与固化的各向异性导电粘合剂之间的粘合性保持良好的状态。
本发明人在进行回流焊试验等伴随加热的可靠性试验时,为了缓和在电路基板、芯片部件以及各向异性导电粘合剂的固化物中分别产生的内部应力,尝试了降低各向异性导电粘合剂的固化物的弹性模量,结果发现,虽然单纯地降低弹性模量对于内部应力的缓和有效,但存在导通可靠性大幅降低的问题。上述状况中,意外地发现,将弹性模量相对于温度制图,所得曲线的弹性模量分布与各向异性导电粘合剂的可靠性评价结果之间有密切的关系,该关系落入几个关系式中,从而完成了本发明。
即,本发明是在含有环氧化合物和固化剂的环氧系粘合剂中分散有导电颗粒的各向异性导电粘合剂,在其固化物在35℃、55℃、95℃和150℃下的弹性模量分别为EM35、EM55、EM95和EM150,55℃和95℃之间的弹性模量变化率为ΔEM55-95,95℃和150℃之间的弹性模量变化率为ΔEM95-150时,满足以下的数学式(1)-(5)。这里,弹性模量变化率ΔEM55-95和ΔEM95-150具体分别用以下数学式(6)和(7)定义。
需说明的是,本发明的弹性模量是按照JIS K7244-4测定的数值。具体来说,是使用动态粘弹性测定仪(例如DDV-01FP-W,エ一アンドデ一公司),在拉伸模式、频率11Hz、升温速度5℃/分钟的条件下测定的。
700MPa≤EM35≤3000MPa (1)
EM150<EM95<EM55<EM35 (2)
ΔEM55-95<ΔEM95-150 (3)
20%≤ΔEM55-95 (4)
40%≤ΔEM95-150 (5)
ΔEM55-95(%)={(EM55-EM95)/EM55}×100(6)
ΔEM95-150(%)={(EM95-EM150)/EM95}×100(7)
本发明还提供使用上述的各向异性导电粘合剂将芯片部件倒装组装在电路基板上得到的连接结构体。本发明的各向异性导电粘合剂的固化物的弹性模量满足式(1)-(5)。因此,即使在对用本发明的各向异性导电粘合剂将芯片部件组装在电路基板上得到的组装品进行对应无铅焊料的回流试验、热冲击试验(TCT)、高温高湿试验、压力锅试验(PCT)等伴随组装品的加热的可靠性试验时,仍可保持电路基板与芯片部件之间有高的导通可靠性,并且可以使它们与固化的各向异性导电粘合剂之间的粘合性保持良好的状态。
附图简述
图1显示本发明的各向异性导电粘合剂的固化物相对于温度的弹性模量分布曲线。
图2显示以往的各向异性导电粘合剂的固化物相对于温度的弹性模量分布曲线。
实施发明的方式
本发明的各向异性导电粘合剂是在含有环氧化合物和固化剂的环氧系粘合剂中分散有导电颗粒的粘合剂,在其固化物在35℃、55℃、95℃和150℃下的弹性模量分别为EM35、EM55、EM95和EM150,55℃和95℃之间的弹性模量变化率为ΔEM55-95,95℃和150℃之间的弹性模量变化率为ΔEM95-150时,满足上述数学式(1)-(5)。
满足这些式(1)-(5)的弹性模量分布的一个例子如图1(纵轴为弹性模量,横轴为温度)所示。以往的各向异性导电粘合剂的弹性模量分布的一个例子如图2所示。图2的以往的各向异性导电粘合剂不含规定的高分子化合物,因此即使某种程度上升高温度,弹性模量也难以变化,但超过某一温度,则由于超过玻璃化转变温度,弹性模量有急剧大幅降低的倾向。
以下详细说明规定了本发明的各向异性导电粘合剂的以上数学式(1)-(5)的意义。
式(1)表示各向异性导电粘合剂的固化物在35℃下的弹性模量在700MPa-3000Mpa的范围。这里,采用“35℃”这个温度的理由是:通常环氧树脂固化物的弹性模量变化在低于35℃时变化比较小,可以忽略,因此,以35℃为基准温度是有意义的。另外,35℃下的弹性模量EM35低于700Mpa,则初期导通可靠性发生问题,而超过3000Mpa,则吸湿回流试验后的导通可靠性发生问题的倾向增强。
式(2)表示各向异性导电粘合剂的固化物的弹性模量随着35℃、55℃、95℃、150℃温度的升高而降低。随着温度的升高而弹性模量不降低时,由于温度升高粘合剂(固化物)的内部应力增大,结果,发生粘合强度降低、导通可靠性降低这些问题的倾向增强。这里,150℃的温度有如下意义:相当于LED装置发光时的温度,并且是回流焊时各向异性导电粘合剂被加热的温度。在35℃-150℃之间,在55℃和95℃这两点测定弹性模量的理由是:着眼于本发明的效果与弹性模量减少率的关系时,可知使用在55℃和95℃这两点测定的弹性模量数值在实验中是妥当的。
式(3)表示95℃和150℃之间的弹性模量变化率ΔEM95-150大于55℃和95℃之间的弹性模量变化率ΔEM55-95。两者相等时,内部应力缓和不充分,如果该关系相反,则无法保持导通可靠性的倾向增强。
式(4)表示55℃和95℃之间的弹性模量变化率ΔEM55-95为20%以上。低于20%,则无法保持导通可靠性的倾向增强。式(5)表示95℃和150℃之间的弹性模量变化率ΔEM95-150为40%以上。低于40%,则无法保持导通可靠性的倾向增强。需说明的是,ΔEM55-95和ΔEM95-150的优选范围为下式(4’)和(5’)。
20%≤ΔEM55-95≤35% (4′)
40%≤ΔEM95-150≤70% (5′)
接着,对具有以上说明的固化物的弹性模量特征的本发明的各向异性导电粘合剂的具体成分进行说明。如上所述,本发明的各向异性导电粘合剂是在含有环氧化合物和固化剂的环氧系粘合剂中分散有导电颗粒的粘合剂。
环氧化合物优选分子内具有2个以上环氧基的化合物或树脂。它们可以是液状,也可以是固体状。具体有:双酚A、双酚F、双酚S、六氢双酚A、四甲基双酚A、二芳基双酚A、氢醌、儿茶酚、间苯二酚、甲酚、四溴双酚A、三羟基联苯、二苯甲酮、双间苯二酚、双酚六氟丙酮、四甲基双酚A、四甲基双酚F、三(羟苯基)甲烷、双二甲苯酚、可溶可熔酚醛树脂、甲酚可溶酚醛树脂等多元酚与表氯醇反应得到的缩水甘油基醚;甘油、新戊二醇、乙二醇、丙二醇、丁二醇、己二醇、聚乙二醇、聚丙二醇等脂族多元醇与表氯醇反应得到的聚缩水甘油基醚;对羟基苯甲酸、β-羟基萘甲酸等羟基羧酸与表氯醇反应得到的缩水甘油基醚酯;由邻苯二甲酸、甲基邻苯二甲酸、间苯二甲酸、对苯二甲酸、四氢邻苯二甲酸、六氢邻苯二甲酸、内亚甲基四氢邻苯二甲酸、内亚甲基六氢邻苯二甲酸、偏苯三酸、聚合脂肪酸等聚羧酸得到的聚缩水甘油基酯;由氨基苯酚、氨基烷基苯酚得到的缩水甘油基氨基缩水甘油基醚;由氨基苯甲酸得到的缩水甘油基氨基缩水甘油基酯;由苯胺、甲苯胺、三溴苯胺、苯二甲胺、二氨基环己烷、双氨基甲基环己烷、4,4’-二氨基二苯基甲烷、4,4’-二氨基二苯基砜等得到的缩水甘油基胺;环氧化聚烯烃等公知的环氧树脂类。
其中,可优选使用可确保适合在固化物上组装LED元件等的透光性的脂环式环氧化合物。具体有:缩水甘油基双酚A的氢化物(缩水甘油基六氢双酚A)、3,4-环氧基环己烯基甲基-3’,4’-环氧基环己烯羧酸酯、三(2,3-环氧基丙基)异氰脲酸酯(TEPIC)。
固化剂可使用作为环氧化合物的固化剂公知的试剂,可以具有潜在性。例如可以使用酸酐系固化剂、胺系固化剂、咪唑系固化剂等。其中,可优选使用可确保适合固化物的LED元件组装等的透光性的脂环式酸酐系固化剂。具体可举出甲基六氢邻苯二甲酸酐。
环氧系粘合剂中的环氧化合物与固化剂各自的使用量是:固化剂过少,则未固化环氧化合物成分增多,而固化剂过多,则由于剩余的固化剂的影响,有促进被粘物材料腐蚀的倾向,因此,相对于100质量份环氧化合物,优选以80-120质量份、更优选95-105质量份的比例使用固化剂。
本发明中,环氧系粘合剂中除含有环氧化合物和固化剂之外,为了缓和内部应力,优选还含有高分子化合物。作为上述高分子化合物,重均分子量过小或过大,内部应力缓和效果均减小,因此优选使用5000-200000,更优选使用10000-100000的高分子化合物。除此之外,玻璃化转变温度过高,则内部应力缓和效果减小,因此优选使用玻璃化转变温度为50℃以下、更优选-30至10℃的高分子化合物。
上述高分子化合物的具体例子有丙烯酸类树脂、橡胶(NBR、SBR、NR、SIS或它们的氢化物)、烯烃树脂等。这些高分子化合物优选具有缩水甘油基或氨基等官能基。从显示良好的耐热性的角度考虑,优选的高分子化合物有丙烯酸类树脂。丙烯酸类树脂的具体例子可举出:使10-100质量份、优选10-40质量份甲基丙烯酸缩水甘油酯或丙烯酸二乙基氨基乙酯与100质量份丙烯酸乙酯共聚所得的树脂。
环氧系粘合剂中上述高分子化合物的使用量过少,则内部应力缓和效果减小,过多,则有无法维持导通可靠性的倾向,因此,相对于合计100质量份的环氧化合物、固化剂和高分子化合物,优选10-50质量份,更优选10-30质量份。
环氧系粘合剂中可进一步根据需要配合咪唑化合物作为固化促进剂。咪唑化合物的具体例子可举出2-甲基-4-乙基咪唑。上述咪唑化合物的使用量过少,则未固化成分增多,过多,则由于剩余固化促进剂的影响,有促进被粘物材料腐蚀的倾向,因此,相对于100质量份固化剂,优选0.01-10质量份,更优选0.1-5质量份。
构成环氧系粘合剂的导电颗粒可使用以往在各向异性导电粘合剂中使用的导电颗粒。例如,可适当使用金、镍、焊剂等的金属颗粒,树脂颗粒的镀金属被覆颗粒,在其上被覆了绝缘薄膜的颗粒等。导电颗粒的粒径与以往的导电颗粒同样,通常为3-10μm。为了良好地确保各向异性导电性和导通可靠性,上述导电颗粒相对于100质量份环氧系粘合剂,优选使用1-100质量份,更优选10-50质量份。
本发明的各向异性导电粘合剂中可以根据需要配合以往的各向异性导电粘合剂中使用的各种添加剂。例如,可以配合硅烷偶联剂、填料、紫外线吸收剂、抗氧化剂等。
本发明的各向异性导电粘合剂可按照常规方法,将导电颗粒均匀地分散于环氧系粘合剂中来制备。此时,可按照常规方法加工成糊、薄膜、高粘性液体等形态。该各向异性导电粘合剂为热固化型,通常可通过加热至150-250℃来使其固化。
本发明的各向异性导电粘合剂可以在将芯片部件或各种模块与电路基板连接时优选使用。特别是,使用本发明的各向异性导电粘合剂在电路基板上倒装组装IC芯片或LED元件等芯片部件得到的连接结构体,即使在进行对应无铅焊剂的回流试验、热冲击试验(TCT)、高温高湿试验、压力锅试验(PCT)等伴随组装品的加热的可靠性试验时,仍在电路基板和芯片部件之间保持高的导通可靠性,并且它们与固化的各向异性导电粘合剂之间的粘合性保持良好的状态。
实施例
以下,通过实施例更具体地说明本发明。
参考例1(丙烯酸类树脂A的制备)
在装有搅拌机、冷凝管的四颈烧瓶中加入100g丙烯酸乙酯(EA)、10g甲基丙烯酸缩水甘油基酯(GMA)、0.2g偶氮二丁腈、300g乙酸乙酯以及5g丙酮,边搅拌边在70℃下进行8小时聚合反应。滤取沉淀的颗粒,用乙醇洗涤、干燥,得到丙烯酸类树脂A。所得丙烯酸类树脂A的重均分子量为80000,玻璃化转变温度为-40℃。
参考例2(丙烯酸类树脂B的制备)
在装有搅拌机、冷凝管的四颈烧瓶中加入100g丙烯酸乙酯(EA)、10g丙烯酸二甲基氨基乙酯(DMAEA)、0.2g偶氮二丁腈、300g乙酸乙酯和5g丙酮,边搅拌边在70℃下进行8小时的聚合反应。滤取沉淀的颗粒,用乙醇洗涤、干燥,得到丙烯酸类树脂B。所得的丙烯酸类树脂B的重均分子量为80000,玻璃化转变温度为18℃。
实施例1-4、比较例1-5
用行星型搅拌器将表1所示的配合成分均匀混合,制备各向异性导电粘合剂。
评价试验
如以下说明,测定实施例1-4和比较例1-5得到的糊状各向异性导电粘合剂的粘合力、弹性模量、导通可靠性。
<粘合力试验>
于在Cu布线部分实施了Au闪镀的玻璃环氧电路基板上涂布糊状各向异性导电粘合剂,使厚度为25μm(干燥厚度),在其上载置1.5mm见方的IC芯片,通过用倒装焊接机在180℃下加热30秒进行热压,得到连接结构体。在刚得到后(初期)、回流后(260℃)、150℃时,对于放置100小时后的连接结构体的IC芯片,使用芯片剪切实验仪(粘合力实验仪PTR1100,レスカ公司)测定粘合强度(N/芯片)。所得结果如表1所示。以本粘合力试验的条件为前提时,实际应用上希望粘合力为50M芯片以上。
<弹性模量测定>
在剥离处理PET上涂布各向异性导电粘合剂,使干燥厚度为80μm,通过放入150℃的炉中使其固化。从剥离处理PET上剥离固化物,切成长3.5cm、宽0.4cm的长方形状,作为试样。使用动态粘弹性测定器(DDV-01FP-W,エ一アンドデ一公司:拉伸模式,频率11Hz,升温速度5℃/分钟)测定该试样在35℃、55℃、95℃、150℃下的弹性模量(EM35,EM55、EM95、EM150)。再由所得结果,根据式(6)、(7)计算弹性模量变化率(ΔEM55-95、ΔEM95-150)。所得结果如表1所示。
<导通可靠性试验>
于在Cu布线部分实施了Au闪镀的玻璃环氧电路基板上涂布糊状各向异性导电粘合剂,使厚度为25μm(干燥厚度),在其上载置6.3mm见方的IC芯片,通过用倒装焊接机在180℃下加热30秒进行热压。通过四端子法测定刚得到的连接结构体的导通电阻。然后对该连接结构体进行4级的吸湿回流试验(吸湿条件:在30℃、60%RH的环境下放置96小时,回流条件:回流峰温度260℃)或2级的吸湿回流试验(吸湿条件:在85℃、60%RH的环境下放置168小时,回流条件:回流峰温度260℃),测定导通电阻。该测定后,对连接结构体进行热冲击试验(TCT:-55℃、0.5小时←→125℃、0.5小时,500个循环),再次测定导通电阻。导通电阻值低于1Ω时,评价为良好(G),为1Ω以上时评价为不良(NG)。所得结果如表1所示。
[表1]
*1缩水甘油基六氢双酚A(YX8000,JER公司)
*2参考例1
*3参考例2
*4重均分子量3700,玻璃化转变温度70℃(YP70,东都化成公司)
*5甲基六氢邻苯二甲酸酐
*62-乙基-4-甲基咪唑(四国化成公司)
*7在5μm直径的交联聚苯乙烯颗粒表面实施Ni/Au镀所得颗粒
由表1可知,弹性模量满足以下数学式(1)-(5)的实施例1-5的各向异性导电粘合剂,其粘合力在初期、回流后、150℃经过100小时后均显示良好的结果。导通可靠性在初期、4级的吸湿回流后、2级的吸湿回流后、以及热冲击500个循环后也显示良好的结果。
700Mpa≤EM35≤3000MPa (1)
EM150<EM95<EM55<EM35 (2)
ΔEM55-95<ΔEM95-150 (3)
20%≤ΔEM55-95 (4)
40%≤ΔEM95-150 (5)
与此相对,比较例1中,EM35超过3000Mpa,未满足式(1),并且也未满足式(3)-(5),因此,不仅是粘合力,导通可靠性在更为严苛条件的吸湿回流试验后,也未实现所需的导通可靠性。
比较例2中,EM35低于700Mpa,未满足式(1),因此,粘合力在150℃放置100小时后未得到所需的特性,导通可靠性自连接结构体刚制成即未得到所需的特性。
比较例3中,弹性模量变化率ΔEM55-95低于20%,未满足式(4),因此粘合力在回流后以及150℃下放置100小时后未得到所需的特性。关于导通可靠性,在更严苛条件的吸湿回流试验后,未能实现所需的导通可靠性。
比较例4中,弹性模量变化率ΔEM55-95低于20%、ΔEM95-150也低于40%,未满足式(4)和(5),因此粘合力在回流后和150℃下放置100小时后未得到所需的特性。关于导通可靠性,在更严苛条件的吸湿回流试验后,未能实现所需的导通可靠性。
比较例5中,弹性模量变化率ΔEM95-150低于40,未满足式(5),因此,粘合力在回流后和150℃下放置100小时后未得到所需的特性。关于导通可靠性,在更严苛条件的吸湿回流试验后,未能实现所需的导通可靠性。
产业实用性
本发明的各向异性导电粘合剂的固化物的弹性模量满足式(1)-(5)。因此,对于用本发明的各向异性导电粘合剂在电路基板上组装芯片部件得到的组装品,即使在进行对应无铅焊料的回流试验、热冲击试验(TCT)、高温高湿试验、压力锅试验(PCT)等伴随组装品的加热的可靠性试验时,仍可保持电路基板与芯片部件之间有高的导通可靠性,且可以使它们与固化的各向异性导电粘合剂之间的粘合性保持良好的状态。因此,本发明的各向异性导电粘合剂对于电路基板与各种芯片部件或模块、柔性电路基板等电子部件的连接有用。
Claims (1)
1.各向异性导电粘合剂,它是在含有丙烯酸类树脂、环氧化合物和作为固化剂的脂环式酸酐系固化剂的环氧系粘合剂中分散有导电颗粒而成的,
所述丙烯酸类树脂是使10-100质量份甲基丙烯酸缩水甘油基酯或丙烯酸二乙基氨基乙酯与100质量份丙烯酸乙酯共聚得到的,重均分子量为5000-200000且玻璃化转变温度为50℃以下,
在各向异性导电粘合剂的固化物在35℃、55℃、95℃和150℃下的弹性模量分别为EM35、EM55、EM95和EM150,55℃和95℃之间的弹性模量变化率为ΔEM55-95,95℃和150℃之间的弹性模量变化率为ΔEM95-150时,满足以下的数学式(1)-(5),弹性模量变化率?EM55-95和?EM95-150分别用以下数学式(6)和(7)定义,弹性模量是按照JIS K7244-4测定的数值,
环氧系粘合剂是相对于100质量份环氧化合物,含有80-120质量份固化剂,
环氧系粘合剂中丙烯酸类树脂的使用量是相对于合计100质量份的环氧化合物、固化剂和丙烯酸类树脂,为10-50质量份。
2.权利要求1的各向异性导电粘合剂,其中,弹性模量变化率ΔEM55-95和ΔEM95-150分别满足式(4′)和(5′),
3.权利要求1的各向异性导电粘合剂,其中,环氧化合物是脂环式环氧化合物。
4.权利要求3的各向异性导电粘合剂,其中,脂环式环氧化合物是缩水甘油基双酚A的氢化物或3,4-环氧基环己烯基甲基-3’,4’-环氧基环己烯甲酸酯,脂环式酸酐系固化剂是甲基六氢邻苯二甲酸酐。
5.权利要求1-4中任一项的各向异性导电粘合剂,其进一步相对于100质量份固化剂含有0.01-10质量份2-甲基-4-乙基咪唑作为固化促进剂。
6.各向异性导电粘合剂,它是在含有丙烯酸类树脂、环氧化合物和固化剂的环氧系粘合剂中分散有导电颗粒而成的,
所述丙烯酸类树脂是使10-100质量份丙烯酸二乙基氨基乙酯与100质量份丙烯酸乙酯共聚得到的,重均分子量为5000-200000且玻璃化转变温度为50℃以下,
在各向异性导电粘合剂的固化物在35℃、55℃、95℃和150℃下的弹性模量分别为EM35、EM55、EM95和EM150,55℃和95℃之间的弹性模量变化率为ΔEM55-95,95℃和150℃之间的弹性模量变化率为ΔEM95-150时,满足以下的数学式(1)-(5) ,弹性模量变化率?EM55-95和?EM95-150分别用以下数学式(6)和(7)定义,弹性模量是按照JIS K7244-4测定的数值,
环氧系粘合剂是相对于100质量份环氧化合物,含有80-120质量份固化剂,
环氧系粘合剂中丙烯酸类树脂的使用量是相对于合计100质量份的环氧化合物、固化剂和丙烯酸类树脂,为10-50质量份。
7.连接结构体,它是使用权利要求1-6中任一项的各向异性导电粘合剂在电路基板上倒装组装芯片部件得到的。
8.权利要求7的连接结构体,其中,芯片部件是LED元件。
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