CN102083278A - 制造印刷电路板的方法 - Google Patents

制造印刷电路板的方法 Download PDF

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CN102083278A
CN102083278A CN2010101464664A CN201010146466A CN102083278A CN 102083278 A CN102083278 A CN 102083278A CN 2010101464664 A CN2010101464664 A CN 2010101464664A CN 201010146466 A CN201010146466 A CN 201010146466A CN 102083278 A CN102083278 A CN 102083278A
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substrate
circuit board
printed circuit
pcb
soldered ball
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CN102083278B (zh
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金镇洙
崔硕文
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Samsung Electro Mechanics Co Ltd
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Abstract

本发明公开了一种制造印刷电路板的方法，该方法包括以下步骤：在固定元件上安装条状基片；通过进行单元化加工将所述条状基片分隔成单元基片；利用导板将焊球连接到所述单元基片上；和通过进行回流焊工艺将所述焊球固定到所述单元基片上。上述制造印刷电路板的方法的优点在于焊球可以精确地形成在条状基片的预定位置，因为所述焊球在通过单元化加工减轻了条状基片的弯曲之后再连接到单元基片。

Description

制造印刷电路板的方法
相关申请的交叉引用
本申请要求于2009年11月30日提交的、名称为“Fabricating Method OfPrinted Circuit Board”的韩国专利申请No.10-2009-0117251的优先权，其在此全部通过引用合并到本申请中。
技术领域
本发明涉及制造印刷电路板的方法。
背景技术
因为半导体封装要求密封、薄化、小型化和电的改进，所以基片变得更薄，并且安装有电子元件并保护电子元件的电子元件嵌入式基片(electronic component-embedded substrate)的应用更为广泛。然而，当基片变得更薄时，存在的问题是基片的支撑力减小，由此增加了它的弯曲。特别地，电子元件嵌入式基片存在的问题是，在它利用环氧塑封料(epoxymolding compound)(EMC)封装后，由于热膨胀系数的差异产生了弯曲。因此，由于基片的弯曲较为严重，很难精确地将焊球连接在基片的预定位置。
图1A到1E是显示了制造印刷电路板的传统方法的剖面图。在下文中，将参照附图1A到1E描述传统的问题。
首先，如图1A所示，显示了条状基片1。在此，条状基片1可以是电子元件嵌入式基片，电子元件利用环氧塑封料(EMC)5封装在该基片上。该条状基片1由于基片与环氧塑封料5之间的热膨胀系数的差异而弯曲。
其次，如图1B所示，将焊剂2设置在条状基片1上。在此，因为条状基片1是弯曲的，所以存在的问题是焊剂2不能精确地设置在条状基片1的预定位置。
再次，如图1C所示，将焊球3连接到条状基片1。在此，焊球3利用导板连接。在这种情况下，因为条状基片1是弯曲的，所以存在的问题是焊球3不能精确地连接到条状基片1的预定位置，而是集中在条状基片1的特定部分。
接下来，如图1D和1E所示，进行回流焊工艺(reflow process)和单元化(singulation)加工。在回流焊工艺中，焊球3通过热处理固定，并且在该步骤中，所述条状基片1的弯曲加大了。因此，因为焊球3没有精确地连接在条状基片1的预定位置，并且该条状基片1通过回流焊工艺变得更加弯曲，所以当条状基片1通过单元化加工分割成单元基片(unitsubstrate)4时，存在的问题是焊球3没有精确地连接到每个单元基片4的预定位置，并且每个单元基片4也是相当弯曲的。
进一步地，制造印刷电路板的传统方法是不经济的，因为需要昂贵的设备，并且每当条状基片1的种类变换时都必须提供适合于所述条状基片1的设备。尽管利用丝网印刷工艺来连接焊球的技术已经发展起来了，但是这样的技术也在条状基片1弯曲时难以在实践中应用，因为丝网印刷工艺的前提为所述条状基片是平坦的。
因此，已经提出了用于减轻条状基片1的弯曲的多种解决方案，但是大部分的解决方案的问题在于他们要求较高的生产成本且因为基片的原料和设计的改变而难以应用到实践中。
发明内容
因此，做出了本发明以解决上述问题，本发明提供了一种制造印刷电路板的方法，其中可以通过在进行单元化加工之后连接焊球而将焊球精确地形成在预定位置。
本发明的一个方面提供了一种制造印刷电路板的方法，该方法包括以下步骤：在固定元件上安装条状基片；通过进行单元化加工将所述条状基片分割成单元基片；利用导板将焊球连接到所述单元基片上；和通过进行回流焊工艺将所述焊球固定到所述单元基片上。
在此，在所述条状基片的安装步骤中，所述固定元件可以是切割胶带(dicing tape)。
该制造印刷电路板的方法还可以包括：在连接所述焊球之前将所述单元基片整体地安装在支撑板上。
所述支撑板可以通过真空吸附所述单元基片来固定所述单元基片。
该制造印刷电路板的方法还可以包括：在连接所述焊球之前利用导板将焊剂设置到所述单元基片上。
该制造印刷电路板的方法还可以包括：在连接所述焊球之前将焊剂设置到所述焊球上。
该制造印刷电路板的方法还可以包括：在固定所述焊球之前将所述单元基片安装在用于回流的托盘上。
本发明的另一个方面提供了一种制造印刷电路板的方法，该方法包括以下步骤：在固定元件上安装条状基片；通过进行单元化加工将所述条状基片分割成单元基片；利用设置在所述单元基片上的蒙片(mask)将焊球连接到所述单元基片上；和通过进行回流焊工艺将所述焊球固定到所述单元基片上。
在此，在所述条状基片的安装步骤中，所述固定元件可以是切割胶带。
该制造印刷电路板的方法还可以包括：在连接所述焊球之前将所述单元基片整体地安装在支撑板上。
所述支撑板可以通过真空吸附所述单元基片来固定所述单元基片。
该制造印刷电路板的方法还可以包括：在连接所述焊球之前利用设置在所述单元基片上的蒙片将焊剂设置到所述单元基片上。
该制造印刷电路板的方法还可以包括：在固定所述焊球之前将所述单元基片安装在用于回流的托盘上。
通过下列的结合附图的具体实施方式的描述，本发明的多个目的、优点和特征将变得显而易见。
应用在本说明书和权利要求书中的术语和措词不应当解释为限制于一般的含义或者词典上的定义，而是应当解释为具有与根据一定规则的本发明的技术范围相关的含义和概念，根据该规则，发明者可以适当地限定术语的概念，以描述他或她所知的用于实现本发明的最好方式。
附图说明
通过下列结合附图的详细说明，将对本发明的上述和其他目的、特征和优点有更加清楚的理解，其中：
图1A到1E顺序地显示了制造印刷电路板的传统方法的剖面图。
图2到6是剖面图，顺序地显示了根据本发明的一个具体实施方式的制造印刷电路板的方法；和
图7到11是剖面图，顺序地显示了根据本发明的另一个具体实施方式的制造印刷电路板的方法。
具体实施方式
通过下列结合附图的详细说明和优选实施方式，将对本发明的目的、特征和优点有更加清楚的理解。在所有的附图中，相同的附图标记用于表示相同的或者类似的部件，同时省略了多余的描述。进一步地，在本发明的描述中，如果认定相关技术的详细描述会蒙蔽本发明的主旨，这样的描述将被省略。
在下文中，将结合附图对本发明的优选实施方式进行详细描述。
图2到6是剖面图，顺序地显示了根据本发明的一种具体实施方式的制造印刷电路板的方法。
根据所述实施方式制造印刷电路板的方法包括下列步骤：(A)在固定元件110上安装条状基片100；(B)通过单元化加工将条状基片100分割成单元基片200；(C)利用导板140将焊球130连接到单元基片200上；和(D)通过回流焊工艺将焊球130固定到单元基片200上。
首先，如图2所示，将条状基片100安装在固定元件110上。在此，条状基片100处于这样的状态，即该基片100已经因为基片和环氧塑封料(EMC)105之间的热膨胀系数的差异以及印刷电路板的厚度的减小而弯曲了。因为单元化加工必须随后进行以拉伸弯曲的条状基片100，所以所述条状基片100安装在固定元件110上。对固定元件110没有特别的限制，只要它可以在单元化加工过程中稳固地支撑条状基片100即可。优选的是，切割胶带可以用作固定元件110。
其次，如图3所示，将条状基片100分割成单元基片200。通过一般的单元化加工将条状基片100分割成单元基片200。从条状基片100分割出的单元基片200保持在这样的状态，其中它们整体地安装在固定元件110例如切割胶带等上。在这个步骤中，因为条状基片100分割成单元基片200，所以减轻了条状基片100的弯曲。因此，在后继步骤中，焊剂150和焊球130可以精确地连接到条状基片100的预定位置。
接下来，如图4A和4B所示，将焊剂150设置到条状基片100上。在此，焊剂150是这样的材料，该材料将氧化膜从由铜或类似物制造的基片垫片(substrate pad)移除，并且化学活化基片垫片，因此焊球130能够容易地连接到基片垫片。焊剂150利用导板120设置到单元基片200的焊球所要连接的垫片上(参见图4A)，或者利用导板120直接地设置到焊球上(参见图4B)。同时，当焊剂150利用导板120设置到单元基片200上时，因为条状基片100的弯曲通过单元化加工被预先减轻了，所以焊剂150可以精确地设置到单元基片200的预定位置。然而，这样的步骤不是必须执行的，并且特别地，在不需要焊剂的焊接工艺中，这样的步骤可以省略。
其次，如图5所示，将焊球130连接到单元基片200上。在此，焊球130用于将单元基片200与外部电路例如主插件板等连接，并且利用导板140连接到单元基片200上。进一步地，焊球130通过焊剂150暂时连接到单元基片200上，并且通过稍后的回流焊工艺完全地固定到单元基片200上。因为条状基片100的弯曲通过单元化加工预先减轻了，所以焊球130可以精确地连接到单元基片200的预定位置。
同时，通过在一种状态(即从条状基片100分割出的单元基片150整体地安装在固定元件100上)下，进行将焊剂150设置到单元基片200上的步骤和将焊球130连接到单元基片200上的步骤，引导时间可以缩短。进一步地，在设置焊剂150和连接焊球130时，可以使用支撑板160以向单元基片200提供支承阻力。在此，支撑板160通过由抽吸孔165真空吸附单元基片200来固定单元基片200，使得单元基片200的剩余的弯曲可以进一步地减轻，并且能够防止单元基片200的移动，因此焊剂150可以精确地设置在单元基片200的预定位置，同时焊球130可以精确地连接在单元基片200的预定位置。进一步地，单元基片200可以以这样的状态安装在支撑板160上，其中它们整体地安装到固定元件110上。
随后，如图6A和6B所示，将焊球130通过回流焊工艺固定到单元基片200上。回流焊工艺是通过加热、熔化、之后冷却焊球130而将焊球130凝固的工艺。在这种情况下，因为单元基片200也被加热到高温，所以可以在回流过程中采用耐热的托盘170。也就是说，在预先用作固定元件110的切割胶带移除后，将单元基片200安装在用于回流的托盘170上，之后进行回流焊工艺。单元基片200可以利用吸附管口安装在用于回流的托盘170上。
然而，当采用具有耐热性的切割胶带时，回流焊工艺可以在这样的状态下进行，其中单元基片200是安装在切割胶带上而不是安装在用于回流的托盘170上。
同时，在这个实施方式中，与传统的技术不同，因为回流焊工艺在这样的状态下进行，其中条状基片100分割成单元基片200，所以存在于回流焊工艺中的条状基片100的另外的弯曲可以减轻。
根据上述实施方式的制造印刷电路板的方法的优点在于焊球130可以精确地形成在条状基片100的预定位置，因为所述焊球130在通过单元化加工减轻了条状基片100的弯曲之后再连接到单元基片200。进一步地，根据上述实施方式的制造印刷电路板的方法的优点在于印刷电路板的制造成本可以降低，因为用于设置焊剂150或连接焊球130的导板120和140可以以与以前相同的方式使用。此外，根据这种实施方式的制造印刷电路板的方法的优点在于在这种方法中的引导时间与传统方法中的引导时间没有不同，所述传统方法是在这样的状态下进行的，其中条状基片100没有分割成单元基片200；因为本发明的方法是在这样的状态下进行的，其中分割出的单元基片200整体地安装在固定元件110或用于回流的托盘170上。
图7到11是剖面图，顺序地显示了根据本发明的另一个具体实施方式的制造印刷电路板的方法。
根据该实施方式制造印刷电路板的方法包括下列步骤：(A)在固定元件110上安装条状基片100；(B)通过单元化加工将条状基片100分隔成单元基片200；(C)利用设置在单元基片200上的蒙片145将焊球130连接到单元基片200上；和(D)通过回流焊工艺将焊球130固定到单元基片200上。
该实施方式在连接焊球的步骤中大大地不同于上述的实施方式。因此，将主要描述它们之间的差异，而多余的描述将省略。
首先，如图7和8所示，将条状基片100安装在固定元件110上，然后分割成单元基片200。具体地，将条状基片100安装在固定元件上，例如切割胶带等，然后利用单元化加工来将条状基片100分割成单元基片200，以拉伸弯曲的条状基片100。
接下来，如图9所示，将焊剂150设置到单元基片200上。在这个实施方式中，与上述的实施方式不同，在将蒙片125设置到单元基片200上之后，利用丝网印刷工艺将焊剂150设置到单元基片200上。更具体地说，通过将带有孔127的蒙片125设置在单元基片200的一侧上，然后利用涂刷器(squeegee)通过孔127将焊剂150压到单元基片200上而将焊剂150设置到单元基片200上。为了精确地将焊剂150设置到单元基片200的预定位置，优选的是适当地控制硬度、固定的角度、速度和涂刷器129施加到基片的压力。在本发明中，不同于传统的技术，可以进行基于这样的前提(即印刷电路板是平坦的)的丝网印刷工艺，因为印刷电路板的弯曲通过单元化加工减轻了。然而，与上述实施方式类似，这个步骤在不需要焊剂的焊接工艺中可以省略。
其次，如图10所示，将焊球130连接到单元基片200上。在此，与设置焊剂150的步骤类似，焊球130在蒙片145设置在单元基片200上之后，利用丝网印刷工艺设置到单元基片200上。更具体地说，通过将带有孔147的蒙片145设置在单元基片200的一侧上，然后利用涂刷器通过孔147将焊球130压到单元基片200上而将焊球130设置到单元基片200上。焊球130可以连接到单元基片200的预定位置，因为采用了能够减轻印刷电路板的弯曲的单元化加工。
同时，与上述的实施方式相同，通过在一种状态(即从条状基片100分割出的单元基片200整体地安装在固定元件110上)下，进行将焊剂150设置到单元基片200上的步骤和将焊球130连接到单元基片200上的步骤，引导时间可以缩短。进一步地，在设置焊剂150和连接焊球130时，可以利用支撑板160以向单元基片200提供支承阻力。支撑板160通过由抽吸孔165真空吸附单元基片200来固定单元基片200，使得单元基片200的剩余的弯曲可以进一步地减轻，并且能够防止单元基片200的移动，因此焊剂150可以精确地设置在单元基片200的预定位置，同时焊球130可以精确地连接在单元基片200的预定位置。
随后，如图11A和11B所示，将焊球130通过回流焊工艺固定到单元基片200上。在这个实施方式中，因为单元基片200要加热到高温，所以回流焊工艺可以通过将单元基片200安装到用于回流的耐热的托盘170上来进行。
根据该实施方式的制造印刷电路板的方法的优点在于预先进行单元化加工以减轻印刷电路板的弯曲，因此基于这样的前提(即印刷电路板是平整的)的丝网印刷工艺可以进行，从而降低了原本用于高价仪器(例如焊剂点胶头(flux dotting tool)等)的成本。
如上所述，根据本发明的制造印刷电路板的方法的优点在于焊球可以精确地形成在条状基片的预定位置，因为所述焊球在通过单元化加工减轻了条状基片的弯曲之后才连接到单元基片；和在回流焊工艺中出现的另外的条状基片的弯曲可以减轻，因为在通过进行单元化加工将条状基片分割成单元基片之后才进行回流焊工艺。
进一步地，根据本发明的制造印刷电路板的方法的优点在于焊球可以利用丝网印刷方法连接到单元基片，因为单元化加工减轻了条状基片的弯曲；和用于高价仪器(例如焊剂点胶头等)所必须的支出可以减少，因为使用了丝网印刷方法。
此外，根据本发明的制造印刷电路板的方法的优点在于它还可以应用于晶片整平工艺中。
尽管本发明的优选实施方式已经为了说明性的目的而公开了，但是本领域的技术人员可以意识到，在不脱离由所附的权利要求所公开的本发明的范围和精神的情况下，可以进行多种修改、添加和置换。对本发明作出的简单的修改、增加和置换属于本发明的范围，而本发明的具体范围将通过所附的权利要求清楚地限定。

Claims (13)

1.一种制造印刷电路板的方法，该方法包括以下步骤：
在固定元件上安装条状基片；
通过进行单元化加工将所述条状基片分隔成单元基片；
利用导板将焊球连接到所述单元基片上；和
通过进行回流焊工艺将所述焊球固定到所述单元基片上。
2.根据权利要求1所述的制造印刷电路板的方法，其中，在所述条状基片的安装步骤中，所述固定元件是切割胶带。
3.根据权利要求1所述的制造印刷电路板的方法，该方法还包括以下步骤：在连接所述焊球之前将所述单元基片整体地安装在支撑板上。
4.根据权利要求3所述的制造印刷电路板的方法，其中，所述支撑板通过真空吸附所述单元基片来固定所述单元基片。
5.根据权利要求1所述的制造印刷电路板的方法，该方法还包括以下步骤：在连接所述焊球之前利用导板将焊剂设置到所述单元基片上。
6.根据权利要求1所述的制造印刷电路板的方法，该方法还包括以下步骤：在连接所述焊球之前将焊剂设置到所述焊球上。
7.根据权利要求1所述的制造印刷电路板的方法，该方法还包括以下步骤：在固定所述焊球之前将所述单元基片安装在用于回流的托盘上。
8.一种制造印刷电路板的方法，该方法包括以下步骤：
在固定元件上安装条状基片；
通过进行单元化加工将所述条状基片分隔成单元基片；
利用设置在所述单元基片上的蒙片将焊球连接到所述单元基片上；和
通过进行回流焊工艺将所述焊球固定到所述单元基片上。
9.根据权利要求8所述的制造印刷电路板的方法，其中，在所述条状基片的安装步骤中，所述固定元件是切割胶带。
10.根据权利要求8所述的制造印刷电路板的方法，该方法还包括以下步骤：在连接所述焊球之前将所述单元基片整体地安装在支撑板上。
11.根据权利要求10所述的制造印刷电路板的方法，其中，所述支撑板通过真空吸附所述单元基片来固定所述单元基片。
12.根据权利要求8所述的制造印刷电路板的方法，该方法还包括以下步骤：在连接所述焊球之前利用设置在所述单元基片上的蒙片将焊剂设置到所述单元基片上。
13.根据权利要求8所述的制造印刷电路板的方法，该方法还包括以下步骤：在固定所述焊球之前将所述单元基片安装在用于回流的托盘上。
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