CN102054808B - 液冷式冷却装置 - Google Patents

液冷式冷却装置 Download PDF

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Publication number
CN102054808B
CN102054808B CN201010523955.7A CN201010523955A CN102054808B CN 102054808 B CN102054808 B CN 102054808B CN 201010523955 A CN201010523955 A CN 201010523955A CN 102054808 B CN102054808 B CN 102054808B
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CN
China
Prior art keywords
cooling
heat sink
straight line
adjacent
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010523955.7A
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English (en)
Chinese (zh)
Other versions
CN102054808A (zh
Inventor
森昌吾
伊藤贤
松岛诚二
栗林泰造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Resonac Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN102054808A publication Critical patent/CN102054808A/zh
Application granted granted Critical
Publication of CN102054808B publication Critical patent/CN102054808B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201010523955.7A 2009-10-26 2010-10-26 液冷式冷却装置 Expired - Fee Related CN102054808B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP245319/2009 2009-10-26
JP2009245319A JP2011091301A (ja) 2009-10-26 2009-10-26 液冷式冷却装置

Publications (2)

Publication Number Publication Date
CN102054808A CN102054808A (zh) 2011-05-11
CN102054808B true CN102054808B (zh) 2016-01-20

Family

ID=43530992

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010523955.7A Expired - Fee Related CN102054808B (zh) 2009-10-26 2010-10-26 液冷式冷却装置

Country Status (4)

Country Link
US (1) US20110094722A1 (enExample)
EP (1) EP2315244B1 (enExample)
JP (1) JP2011091301A (enExample)
CN (1) CN102054808B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8472193B2 (en) 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
KR101459204B1 (ko) * 2011-06-07 2014-11-07 도요타지도샤가부시키가이샤 냉각기
JP6006480B2 (ja) * 2011-07-29 2016-10-12 株式会社ティラド 液冷ヒートシンク
CN102878829B (zh) * 2012-10-24 2014-01-15 深圳市日上光电股份有限公司 热羽流发生器
JP6247090B2 (ja) * 2013-12-26 2017-12-13 昭和電工株式会社 液冷式冷却装置および液冷式冷却装置用放熱器の製造方法
JP2015144196A (ja) * 2014-01-31 2015-08-06 三桜工業株式会社 冷却装置及び冷却装置の製造方法
DE102014202293A1 (de) * 2014-02-07 2015-08-13 Siemens Aktiengesellschaft Kühlkörper
US9960100B2 (en) * 2014-03-20 2018-05-01 Fuji Electric Co., Ltd Cooler and semiconductor module using same
JP6316096B2 (ja) * 2014-05-28 2018-04-25 昭和電工株式会社 液冷式冷却装置
FR3030708B1 (fr) * 2014-12-22 2018-02-16 Airbus Operations Sas Plaque froide, formant notamment partie structurale d'un equipement a composants generateurs de chaleur
CN104684368A (zh) * 2015-04-01 2015-06-03 昆山固德利金属制品有限公司 一种水冷散热器
JP6548324B2 (ja) * 2015-06-30 2019-07-24 東京ラヂエーター製造株式会社 熱交換器のインナーフィン
JP6546521B2 (ja) * 2015-12-11 2019-07-17 昭和電工株式会社 液冷式冷却装置
JPWO2017115436A1 (ja) * 2015-12-28 2018-10-18 国立大学法人 東京大学 熱交換器
CN107872942B (zh) * 2016-09-27 2019-09-20 技嘉科技股份有限公司 热交换装置及其制造方法
JP6735664B2 (ja) * 2016-12-28 2020-08-05 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
JP7159617B2 (ja) * 2018-05-25 2022-10-25 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
WO2020031753A1 (ja) * 2018-08-09 2020-02-13 富士電機株式会社 冷却器、半導体モジュール
DE102018006461B4 (de) * 2018-08-10 2024-01-25 Eberhard Paul Wärmetauscher mit ineinanderragenden spitzwinkligen oder spitzdachartigen Platinen
CN109378352A (zh) * 2018-09-06 2019-02-22 山东航天电子技术研究所 一种光电池用微流通道散热器
DE102019133238B4 (de) * 2019-12-05 2024-08-29 Infineon Technologies Ag Fluidkanal, leistungshalbleitermodul und verfahren zur herstellung eines fluidkanals
DE102020200110A1 (de) * 2020-01-08 2021-07-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlvorrichtung
CN212084987U (zh) * 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
US12092399B2 (en) * 2020-07-14 2024-09-17 Raytheon Company Chimney cooler design for rugged maximum free convection heat transfer with minimum footprint
CN114206063B (zh) * 2020-09-02 2024-12-17 春鸿电子科技(重庆)有限公司 液冷头与液冷式散热装置
CN115997097A (zh) * 2020-09-14 2023-04-21 株式会社T.Rad 热交换器
JP7499689B2 (ja) * 2020-12-08 2024-06-14 日立Astemo株式会社 波型伝熱フィン
DE102021128634A1 (de) 2021-11-03 2023-05-04 BAB-Bildungsgesellschaft für angewandte Betriebswirtschaft mbH Wärmeübertragungsvorrichtung
CN113991927B (zh) * 2021-12-10 2022-12-06 无锡天宝电机有限公司 一种电机的机壳结构
KR102462316B1 (ko) * 2022-07-19 2022-11-03 한화시스템 주식회사 열전소자를 이용한 전시기의 온도 제어 장치
DE102022211780A1 (de) * 2022-11-08 2024-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlstruktur eines fluiddurchströmbaren Kühlers
CN119550601B (zh) * 2025-01-23 2025-04-01 长春超维科技产业有限责任公司 一种汽车用隔音隔热材料的热挤出冷却定型设备及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3907032A (en) * 1971-04-27 1975-09-23 United Aircraft Prod Tube and fin heat exchanger
JP3158983B2 (ja) * 1994-10-03 2001-04-23 住友精密工業株式会社 Ｌｓｉパッケージ冷却用コルゲート型放熱フィン
JP4143966B2 (ja) * 2003-02-28 2008-09-03 株式会社ティラド Ｅｇｒクーラ用の偏平チューブ
DE10349150A1 (de) * 2003-10-17 2005-05-19 Behr Gmbh & Co. Kg Wärmeübertrager, insbesondere für Kraftfahrzeuge
JP4027353B2 (ja) * 2004-09-28 2007-12-26 三菱電機株式会社 冷却構造
JP2006125767A (ja) * 2004-10-29 2006-05-18 Tokyo Institute Of Technology 熱交換器
DE202005009948U1 (de) * 2005-06-23 2006-11-16 Autokühler GmbH & Co. KG Wärmeaustauschelement und damit hergestellter Wärmeaustauscher
JP4756585B2 (ja) * 2005-09-09 2011-08-24 臼井国際産業株式会社 熱交換器用伝熱管
JP4715529B2 (ja) 2006-01-26 2011-07-06 トヨタ自動車株式会社 パワー半導体素子の冷却構造
JP4876123B2 (ja) * 2006-12-11 2012-02-15 国立大学法人三重大学 イオン電極用応答ガラス膜の製造方法、イオン電極用応答ガラス膜及びイオン電極
JP4861840B2 (ja) * 2007-01-26 2012-01-25 アイシン・エィ・ダブリュ株式会社 発熱体冷却構造及び駆動装置
JP2009081220A (ja) * 2007-09-26 2009-04-16 Sumitomo Electric Ind Ltd 放熱部品および放熱構造体
US9190344B2 (en) * 2007-11-26 2015-11-17 Kabushiki Kaisha Toyota Jidoshokki Liquid-cooled-type cooling device
DE202007017501U1 (de) * 2007-12-13 2009-04-23 Autokühler GmbH & Co. KG Wärmeaustauschelement und damit hergestellter Wärmeaustauscher
JP2009147107A (ja) * 2007-12-14 2009-07-02 Toyota Motor Corp 冷却フィンおよび冷却フィンの製造方法
US9671179B2 (en) * 2008-01-15 2017-06-06 Showa Denko K.K. Liquid-cooled-type cooling device
JP5023020B2 (ja) * 2008-08-26 2012-09-12 株式会社豊田自動織機 液冷式冷却装置
DE102008044986A1 (de) * 2008-08-29 2010-03-04 Advanced Micro Devices, Inc., Sunnyvale Ein 3-D-integriertes Schaltungsbauelement mit einer internen Wärmeverteilungsfunktion

Also Published As

Publication number Publication date
EP2315244A1 (en) 2011-04-27
US20110094722A1 (en) 2011-04-28
CN102054808A (zh) 2011-05-11
EP2315244B1 (en) 2020-02-26
JP2011091301A (ja) 2011-05-06

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20151203

Address after: Tokyo, Japan

Applicant after: SHOWA DENKO Kabushiki Kaisha

Address before: Aichi Prefecture, Japan

Applicant before: Kabushiki Kaisha TOYOTA JIDOSHOKKI

Applicant before: SHOWA DENKO Kabushiki Kaisha

C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Showa electrical materials Co.,Ltd.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20230421

Address after: Tokyo, Japan

Patentee after: Showa electrical materials Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: SHOWA DENKO Kabushiki Kaisha

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160120

CF01 Termination of patent right due to non-payment of annual fee