JP2011091301A - 液冷式冷却装置 - Google Patents

液冷式冷却装置 Download PDF

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Publication number
JP2011091301A
JP2011091301A JP2009245319A JP2009245319A JP2011091301A JP 2011091301 A JP2011091301 A JP 2011091301A JP 2009245319 A JP2009245319 A JP 2009245319A JP 2009245319 A JP2009245319 A JP 2009245319A JP 2011091301 A JP2011091301 A JP 2011091301A
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JP
Japan
Prior art keywords
fin
wave
portions
horizontal plane
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009245319A
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English (en)
Japanese (ja)
Other versions
JP2011091301A5 (enExample
Inventor
Shogo Mori
昌吾 森
Masaru Ito
賢 伊藤
Seiji Matsushima
誠二 松島
Taizo Kuribayashi
泰造 栗林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Resonac Holdings Corp
Original Assignee
Toyota Industries Corp
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Industries Corp, Showa Denko KK filed Critical Toyota Industries Corp
Priority to JP2009245319A priority Critical patent/JP2011091301A/ja
Priority to US12/911,357 priority patent/US20110094722A1/en
Priority to CN201010523955.7A priority patent/CN102054808B/zh
Priority to EP10188781.8A priority patent/EP2315244B1/en
Publication of JP2011091301A publication Critical patent/JP2011091301A/ja
Publication of JP2011091301A5 publication Critical patent/JP2011091301A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2009245319A 2009-10-26 2009-10-26 液冷式冷却装置 Pending JP2011091301A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009245319A JP2011091301A (ja) 2009-10-26 2009-10-26 液冷式冷却装置
US12/911,357 US20110094722A1 (en) 2009-10-26 2010-10-25 Liquid-cooled-type cooling device
CN201010523955.7A CN102054808B (zh) 2009-10-26 2010-10-26 液冷式冷却装置
EP10188781.8A EP2315244B1 (en) 2009-10-26 2010-10-26 Liquid-cooled-type cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009245319A JP2011091301A (ja) 2009-10-26 2009-10-26 液冷式冷却装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013104653A Division JP5608787B2 (ja) 2013-05-17 2013-05-17 液冷式冷却装置

Publications (2)

Publication Number Publication Date
JP2011091301A true JP2011091301A (ja) 2011-05-06
JP2011091301A5 JP2011091301A5 (enExample) 2012-08-02

Family

ID=43530992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009245319A Pending JP2011091301A (ja) 2009-10-26 2009-10-26 液冷式冷却装置

Country Status (4)

Country Link
US (1) US20110094722A1 (enExample)
EP (1) EP2315244B1 (enExample)
JP (1) JP2011091301A (enExample)
CN (1) CN102054808B (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012169012A1 (ja) * 2011-06-07 2012-12-13 トヨタ自動車株式会社 冷却器
JP2013030713A (ja) * 2011-07-29 2013-02-07 T Rad Co Ltd 液冷ヒートシンク
JP2015126050A (ja) * 2013-12-26 2015-07-06 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
JP2015225953A (ja) * 2014-05-28 2015-12-14 昭和電工株式会社 液冷式冷却装置
JP2017108045A (ja) * 2015-12-11 2017-06-15 昭和電工株式会社 液冷式冷却装置
JP2018107365A (ja) * 2016-12-28 2018-07-05 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
CN112601926A (zh) * 2018-08-10 2021-04-02 埃伯哈德·保罗 伸入彼此的尖角形-尖顶式换热器片
JPWO2022054963A1 (enExample) * 2020-09-14 2022-03-17
JP2022090834A (ja) * 2020-12-08 2022-06-20 日立Astemo株式会社 波型伝熱フィン
KR102462316B1 (ko) * 2022-07-19 2022-11-03 한화시스템 주식회사 열전소자를 이용한 전시기의 온도 제어 장치

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8472193B2 (en) 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
CN102878829B (zh) * 2012-10-24 2014-01-15 深圳市日上光电股份有限公司 热羽流发生器
JP2015144196A (ja) * 2014-01-31 2015-08-06 三桜工業株式会社 冷却装置及び冷却装置の製造方法
DE102014202293A1 (de) * 2014-02-07 2015-08-13 Siemens Aktiengesellschaft Kühlkörper
WO2015141714A1 (ja) * 2014-03-20 2015-09-24 富士電機株式会社 冷却器およびそれを用いた半導体モジュール
FR3030708B1 (fr) * 2014-12-22 2018-02-16 Airbus Operations Sas Plaque froide, formant notamment partie structurale d'un equipement a composants generateurs de chaleur
CN104684368A (zh) * 2015-04-01 2015-06-03 昆山固德利金属制品有限公司 一种水冷散热器
JP6548324B2 (ja) * 2015-06-30 2019-07-24 東京ラヂエーター製造株式会社 熱交換器のインナーフィン
WO2017115436A1 (ja) * 2015-12-28 2017-07-06 国立大学法人東京大学 熱交換器
CN107872942B (zh) * 2016-09-27 2019-09-20 技嘉科技股份有限公司 热交换装置及其制造方法
JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
JP7159617B2 (ja) * 2018-05-25 2022-10-25 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
WO2020031753A1 (ja) * 2018-08-09 2020-02-13 富士電機株式会社 冷却器、半導体モジュール
CN109378352A (zh) * 2018-09-06 2019-02-22 山东航天电子技术研究所 一种光电池用微流通道散热器
DE102019133238B4 (de) * 2019-12-05 2024-08-29 Infineon Technologies Ag Fluidkanal, leistungshalbleitermodul und verfahren zur herstellung eines fluidkanals
DE102020200110A1 (de) * 2020-01-08 2021-07-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlvorrichtung
CN212084987U (zh) * 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
US12092399B2 (en) * 2020-07-14 2024-09-17 Raytheon Company Chimney cooler design for rugged maximum free convection heat transfer with minimum footprint
CN215773994U (zh) * 2020-09-02 2022-02-08 春鸿电子科技(重庆)有限公司 液冷头与液冷式散热装置
DE102021128634A1 (de) 2021-11-03 2023-05-04 BAB-Bildungsgesellschaft für angewandte Betriebswirtschaft mbH Wärmeübertragungsvorrichtung
CN113991927B (zh) * 2021-12-10 2022-12-06 无锡天宝电机有限公司 一种电机的机壳结构
DE102022211780A1 (de) * 2022-11-08 2024-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlstruktur eines fluiddurchströmbaren Kühlers
CN119550601B (zh) * 2025-01-23 2025-04-01 长春超维科技产业有限责任公司 一种汽车用隔音隔热材料的热挤出冷却定型设备及方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08320194A (ja) * 1994-10-03 1996-12-03 Sumitomo Metal Ind Ltd Ｌｓｉパッケージ冷却用コルゲート型放熱フィン
JP2006100293A (ja) * 2004-09-28 2006-04-13 Mitsubishi Electric Corp 冷却フィン及び冷却構造
JP2006125767A (ja) * 2004-10-29 2006-05-18 Tokyo Institute Of Technology 熱交換器
JP2007078194A (ja) * 2005-09-09 2007-03-29 Usui Kokusai Sangyo Kaisha Ltd 熱交換器用伝熱管
JP2008186820A (ja) * 2007-01-26 2008-08-14 Aisin Aw Co Ltd 発熱体冷却構造及び駆動装置
JP2009081220A (ja) * 2007-09-26 2009-04-16 Sumitomo Electric Ind Ltd 放熱部品および放熱構造体
JP2009147107A (ja) * 2007-12-14 2009-07-02 Toyota Motor Corp 冷却フィンおよび冷却フィンの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3907032A (en) * 1971-04-27 1975-09-23 United Aircraft Prod Tube and fin heat exchanger
JP4143966B2 (ja) * 2003-02-28 2008-09-03 株式会社ティラド Ｅｇｒクーラ用の偏平チューブ
DE10349150A1 (de) * 2003-10-17 2005-05-19 Behr Gmbh & Co. Kg Wärmeübertrager, insbesondere für Kraftfahrzeuge
DE202005009948U1 (de) * 2005-06-23 2006-11-16 Autokühler GmbH & Co. KG Wärmeaustauschelement und damit hergestellter Wärmeaustauscher
JP4715529B2 (ja) 2006-01-26 2011-07-06 トヨタ自動車株式会社 パワー半導体素子の冷却構造
WO2008072612A1 (ja) * 2006-12-11 2008-06-19 Horiba, Ltd. イオン電極用応答ガラス膜の製造方法、イオン電極用応答ガラス膜及びイオン電極
KR101496493B1 (ko) * 2007-11-26 2015-02-26 가부시키가이샤 도요다 지도숏키 액냉식 냉각 장치
DE202007017501U1 (de) * 2007-12-13 2009-04-23 Autokühler GmbH & Co. KG Wärmeaustauschelement und damit hergestellter Wärmeaustauscher
US9671179B2 (en) * 2008-01-15 2017-06-06 Showa Denko K.K. Liquid-cooled-type cooling device
JP5023020B2 (ja) * 2008-08-26 2012-09-12 株式会社豊田自動織機 液冷式冷却装置
DE102008044986A1 (de) * 2008-08-29 2010-03-04 Advanced Micro Devices, Inc., Sunnyvale Ein 3-D-integriertes Schaltungsbauelement mit einer internen Wärmeverteilungsfunktion

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08320194A (ja) * 1994-10-03 1996-12-03 Sumitomo Metal Ind Ltd Ｌｓｉパッケージ冷却用コルゲート型放熱フィン
JP2006100293A (ja) * 2004-09-28 2006-04-13 Mitsubishi Electric Corp 冷却フィン及び冷却構造
JP2006125767A (ja) * 2004-10-29 2006-05-18 Tokyo Institute Of Technology 熱交換器
JP2007078194A (ja) * 2005-09-09 2007-03-29 Usui Kokusai Sangyo Kaisha Ltd 熱交換器用伝熱管
JP2008186820A (ja) * 2007-01-26 2008-08-14 Aisin Aw Co Ltd 発熱体冷却構造及び駆動装置
JP2009081220A (ja) * 2007-09-26 2009-04-16 Sumitomo Electric Ind Ltd 放熱部品および放熱構造体
JP2009147107A (ja) * 2007-12-14 2009-07-02 Toyota Motor Corp 冷却フィンおよび冷却フィンの製造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012169012A1 (ja) * 2011-06-07 2012-12-13 トヨタ自動車株式会社 冷却器
JP5454586B2 (ja) * 2011-06-07 2014-03-26 トヨタ自動車株式会社 冷却器
KR101459204B1 (ko) * 2011-06-07 2014-11-07 도요타지도샤가부시키가이샤 냉각기
JP2013030713A (ja) * 2011-07-29 2013-02-07 T Rad Co Ltd 液冷ヒートシンク
JP2015126050A (ja) * 2013-12-26 2015-07-06 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
JP2015225953A (ja) * 2014-05-28 2015-12-14 昭和電工株式会社 液冷式冷却装置
JP2017108045A (ja) * 2015-12-11 2017-06-15 昭和電工株式会社 液冷式冷却装置
JP2018107365A (ja) * 2016-12-28 2018-07-05 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
WO2018123387A1 (ja) * 2016-12-28 2018-07-05 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
US10770373B2 (en) 2016-12-28 2020-09-08 Showa Denko K.K. Radiator for liquid cooling type cooling device and method of producing the same
CN112601926A (zh) * 2018-08-10 2021-04-02 埃伯哈德·保罗 伸入彼此的尖角形-尖顶式换热器片
JPWO2022054963A1 (enExample) * 2020-09-14 2022-03-17
JP2022090834A (ja) * 2020-12-08 2022-06-20 日立Astemo株式会社 波型伝熱フィン
JP7499689B2 (ja) 2020-12-08 2024-06-14 日立Astemo株式会社 波型伝熱フィン
KR102462316B1 (ko) * 2022-07-19 2022-11-03 한화시스템 주식회사 열전소자를 이용한 전시기의 온도 제어 장치

Also Published As

Publication number Publication date
CN102054808B (zh) 2016-01-20
EP2315244B1 (en) 2020-02-26
US20110094722A1 (en) 2011-04-28
EP2315244A1 (en) 2011-04-27
CN102054808A (zh) 2011-05-11

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