CN102047402A - 一种电子器件制造方法 - Google Patents
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Abstract
在用于制造电子器件的方法中,将集成电路(1)设置在衬底的两层(2,3)之间,所述集成电路包括至少一个接触面、在所述至少一个接触面(3)上方的至少一个衬底层上形成的孔洞(4),在所述至少一个衬底层(3)的背离所述集成电路(1)的表面上形成导电结构(5),并且通过所述孔洞(4)将所述导电结构(5)与所述接触面相连。
Description
技术领域
本发明涉及一种制造电子器件的方法。
背景技术
在本发明范围内的电子器件,特别是用于RFID应用的智能卡通常包括封装在模块中的集成电路,然后与天线相连,再集成于卡体中。对于标准卡,通常所述模块与衬底箔粘合,绝缘导线天线嵌入在所述衬底箔中,且通过焊接工艺与所述模块粘合。该衬底箔被称作嵌体,在单一步骤中层压到最终的RFID卡中。
另一种生产嵌体的替代方法采用所谓的直接芯片粘合工艺。在这种情况下,天线包括导电材料形成的结构层,例如薄金属箔、导电油墨、电镀镀层等,所述集成电路通经由如倒装芯片工艺与天线直接连接。
例如,WO 2007/075352A2公开了一种用于组装电子器件的方法,特别是用于RFID插入物和/或器件的组装。该已知方法包括将带有键合焊盘(例如隆起焊盘)的芯片热嵌入在衬底中并将芯片与所述衬底上表面上的天线元件相连。在该过程中,在衬底层表面上设置天线结构的步骤与将天线结构与芯片相连的步骤彼此独立,因而造成了程序上的不便。
为了使芯片与天线结构相连,压缩了组装。在压缩期间,芯片的隆起焊盘穿透衬底,以便与衬底上表面上的天线结构建立接触。在压缩期间,将相当大的应力施加于芯片的键合焊盘或隆起焊盘区域,以便在隆起焊盘邻近区域不设置精细结构,通常芯片应该具有足以提供必要强度的厚度。
在所有描述的方法中,实际收发机嵌体都不是平坦的,因此需要增加附加层以补偿厚度上的差异,提供镶嵌标签(prelam),随后再次层压或胶粘在最终的卡中。采用模块的结构目前能够达到的最小厚度约为300μm。采用直接芯片粘合的结构也有缺点,即在层压工艺期间集成电路或多或少未被保护,限制集成电路厚度在100μm左右,以便给出合理的管芯强度值。假如是倒装芯片工艺,则要求附加的隆起焊盘,这也被视为影响成品机械可靠性的关键,因为隆起焊盘下方的应力集中很高。
因此,本发明的目的旨在提供一种用于制造电子器件的方法,可以克服上述现有技术下各种方法的缺点。
发明内容
本发明的目的是通过一种如权利要求1中阐述的制造电子器件的方法来实现的。本发明的其他优点通过在从属权利要求中阐述的特征来实现。
根据本发明,制造电子器件的方法包括以下步骤:
-将集成电路设置在衬底的两层之间,所述电路具有至少一个接触面;
-在所述至少一个接触面上方的至少一个衬底层中形成孔洞;以及
-在所述至少一个衬底层的背离所述集成电路的表面上形成导电结构,且通过所述孔洞将所述导电结构与所述接触面相连,所述形成导电结构的步骤和连接所述导电结构的步骤有利地在单一的工艺步骤中有利地执行。
根据本发明的方法可以用于制造电子器件,特别是用于RFID应用的智能卡,其中在导电结构与集成电路接触面相连的步骤器件,在所述芯片上所施加的机械应力降至最低。通过在至少一个衬底层中的孔洞实现了连接,所述孔洞在连接步骤之前就已经形成在衬底层上,使得连接步骤本身不受任何材料替换和任何相关的机械应力的影响。
由于在与天线接触过程中芯片没有受到压缩,能够将形成裂缝的风险降至最低。由于芯片没有受到机械应力,其可以将其设计得比现有技术已知的必要厚度更薄,并且根据具体情况,也可以将芯片的精细结构设置在接触面区域中。这样可以实现更小的芯片整体设计。
在单一的工艺步骤中既在衬底层表面上形成例如天线结构的导电结构又使该导电结构与芯片相连提供了一种高效、经济的工艺方法。
根据本发明所述方法的优选实施例,所述在至少一个衬底层的表面上形成导电结构以及将所述导电结构与所述接触面相连的步骤包括用导电油墨印制所述结构,并且在印制过程期间用导电油墨填充所述孔洞,从而将导电结构与连接面相连。这一工艺特别容易利用在衬底层上印制天线结构已经使用的已知器件来执行。当作用在接触面上形成的孔洞区域时,导电油墨自然地流入孔洞中,从而与接触面建立了接触。这样,所述形成导电结构的步骤与所述将导电结构与集成电路的连接面相连的步骤可以很容易地在单一的工艺步骤中完成。
根据本发明的另一个实施例,所述在至少一个衬底层表面上形成导电结构的步骤包括构建并刻蚀衬底以形成金属导电路径。
在本发明较优实施例的这种连接中,所述将导电结构与所述接触面相连的步骤包括在孔洞中涂覆导电膏或导电胶,从而实现了在导电天线结构和芯片接触面之间建立接触的特别简单模式,同时可以保证连接的安全与持久接触。
在本发明较优实施例中,通过焊接或电镀沉积实现所述将导电结构与接触面相连。
根据本发明方法的优选实施例,所述孔洞形成步骤包括激光钻孔。激光钻孔公知为一种高精确度、低成本的材料处理方法,常用于本发明所属领域。
根据本发明的优选实施例,在所述衬底两层之间设置集成电路的步骤之前执行所述孔洞形成步骤。这样,便于处理,并且在应用激光辐射期间,能够将对集成电路造成负面影响的风险降至最低。
根据本发明优选实施例,所述导电结构形成天线,例如用于RFID应用的天线。
在本发明较优实施例中,所述衬底由热塑性材料制造。
在本发明的优选实施例中,层压其间设置有集成电路的所述衬底层,以形成用于智能卡的嵌体。
结合下文所述实施例来阐述本发明的上述及其他方面,并且本发明的上述和其他方面据此将是清楚明白的。
附图说明
下文将结合附图所示的实施例,作为非限制性示例,更为详细地描述本发明。
图1示出了衬底层和集成电路的总体结构;
图2示出了层压后的衬底层和集成电路;
图3示出了层压在衬底层之间的集成电路,其中已经钻孔形成了用于将集成电路和导电结构相连的孔洞;
图4示出了层压在衬底中的集成电路,衬底上表面上的导电结构已经与芯片相连。
具体实施方式
在图1中,集成电路(IC)1设置在第一衬底层2和第二衬底层3之间。IC 1既可以用胶水粘合在衬底材料上,也可以通过使用热处理或者超声处理的方式直接粘合在衬底材料上。随后层压此结构得到如图2所示的结构。由于IC 1厚度较小,衬底层2、3几乎平行,衬底层2、3很好地密封和保护了IC 1。
然后,在IC 1接触面上方的衬底层(3)中形成孔洞(4),得到如图3所示的结构。IC 1的接触面,例如键合焊盘或隆起焊盘,现在与环境开放连通。
随后,用导电油墨将导电结构5印制在第二表面层3的表面上,使得导电结构例如天线的形成以及通过孔洞4中的导电材料与IC 1相连均可在单一的工艺步骤中完成。
在替代方法中,通过构建并刻蚀衬底3形成导电结构5,并且通过在孔洞4中涂覆导电膏或导电胶实现与IC 1的连接。
考虑到随后的工艺步骤,值得注意的是,可以在钻孔甚至层压之前就已经在第二表面层3的表面形成导电结构5。
最后需要注意,上述实施例阐述但不限制本发明,本领域普通技术人员可以在不脱离所附权利要求所限定的本发明范围下设计出许多替代实施例。在权利要求中,括号内的参考数字不得理解为对权利要求的限制。单词“包括”及其变形不排除未在权利要求或说明中罗列的其他元件或步骤的存在。某一元件的单数参考不排除该元件的复数参考,反之亦然。在罗列了若干装置的关于器件的权利要求中,若干装置可以用同一个软件或硬件项目表示。在不同的从属权利要求中引用的方法并不表示这些方法的组合不能加以利用。
Claims (10)
1.一种用于制造电子器件的方法,所述方法包括以下步骤:
-将集成电路(1)设置在衬底的两层(2,3)之间,所述集成电路(1)具有至少一个接触面;
-在所述至少一个接触面上方的至少一个衬底层(3)中形成孔洞(4);以及
-在所述至少一个衬底层(3)的背离所述集成电路(1)的表面上形成导电结构(5),并且通过所述空洞(4)将所述导电结构(5)与所述接触面相连,所述形成导电结构(5)的步骤和连接所述导电结构(5)的步骤有利地在单一的工艺步骤中执行。
2.根据权利要求1中所述的方法,其中所述在至少一个衬底层(3)的表面上形成导电结构(5)以及将所述导电结构(5)与所述连接面相连的步骤包括用导电油墨印制所述结构(5),以及在所述印制期间用油墨填充所述孔洞(4),从而将导电结构(5)与接触面相连。
3.根据权利要求1中所述的方法,其中所述在所述至少一个衬底层(3)的表面上形成导电结构(5)的步骤包括构建并刻蚀衬底以形成金属导电路径。
4.根据权利要求1或3中所述的方法,其中所述将所述导电结构(5)与所述接触面相连的步骤包括在孔洞(4)中涂覆导电膏或者导电胶。
5.根据权利要求1或3中所述的方法,其中通过焊接或电镀沉积实现将所述导电结构(5)与所述接触面相连。
6.根据权利要求1至5中任一项所述的方法,其中所述形成孔洞(4)的步骤包括激光钻孔。
7.根据权利要求1至6中任一项所述的方法,其中在所述衬底的两层(2,3)之间设置集成电路(1)的步骤之前执行所述形成孔洞的步骤。
8.根据权利要求1至7中任一项所述的方法,其中所述导电结构(5)形成天线,例如用于RFID应用的天线。
9.根据权利要求1至8中任一项所述的方法,其中所述衬底由热塑性材料制造。
10.根据权利要求1至9中任一项所述的方法,其中层压其间设置有集成电路(1)的所述衬底层(2,3)以形成用于智能卡的嵌体。
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EP08104215.2 | 2008-06-02 | ||
EP08104215 | 2008-06-02 | ||
PCT/IB2009/051964 WO2009147546A1 (en) | 2008-06-02 | 2009-05-13 | Method for manufacturing an electronic device |
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US (1) | US8695207B2 (zh) |
EP (1) | EP2286445A1 (zh) |
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WO (1) | WO2009147546A1 (zh) |
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CN106624387A (zh) * | 2016-12-07 | 2017-05-10 | 诺得卡(上海)微电子有限公司 | 一种用于智能卡模块制造的冲孔装置 |
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TWI505552B (zh) * | 2012-06-01 | 2015-10-21 | Wistron Neweb Corp | 天線結構之製造方法 |
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CN112154539A (zh) * | 2018-05-21 | 2020-12-29 | 3M创新有限公司 | 包括电路管芯的超薄且柔性的装置 |
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CN106624387A (zh) * | 2016-12-07 | 2017-05-10 | 诺得卡(上海)微电子有限公司 | 一种用于智能卡模块制造的冲孔装置 |
Also Published As
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WO2009147546A1 (en) | 2009-12-10 |
CN102047402B (zh) | 2017-11-03 |
EP2286445A1 (en) | 2011-02-23 |
US8695207B2 (en) | 2014-04-15 |
US20110189824A1 (en) | 2011-08-04 |
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