CN102015921A - 用于对传导性特征进行丝网印刷的方法和组合物 - Google Patents
用于对传导性特征进行丝网印刷的方法和组合物 Download PDFInfo
- Publication number
- CN102015921A CN102015921A CN2009801148126A CN200980114812A CN102015921A CN 102015921 A CN102015921 A CN 102015921A CN 2009801148126 A CN2009801148126 A CN 2009801148126A CN 200980114812 A CN200980114812 A CN 200980114812A CN 102015921 A CN102015921 A CN 102015921A
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- nanostructure
- conductive features
- coating composition
- substrate
- composition according
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Conductive Materials (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Electric Cables (AREA)
- Photovoltaic Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3152808P | 2008-02-26 | 2008-02-26 | |
US61/031,528 | 2008-02-26 | ||
PCT/US2009/001175 WO2009108306A1 (en) | 2008-02-26 | 2009-02-25 | Method and composition for screen printing of conductive features |
Publications (2)
Publication Number | Publication Date |
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CN102015921A true CN102015921A (zh) | 2011-04-13 |
CN102015921B CN102015921B (zh) | 2014-08-27 |
Family
ID=40613077
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801148130A Pending CN102015922A (zh) | 2008-02-26 | 2009-02-25 | 用于喷墨沉积传导性特征的方法和组合物 |
CN200980114812.6A Active CN102015921B (zh) | 2008-02-26 | 2009-02-25 | 用于对传导性特征进行丝网印刷的方法和组合物 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801148130A Pending CN102015922A (zh) | 2008-02-26 | 2009-02-25 | 用于喷墨沉积传导性特征的方法和组合物 |
Country Status (8)
Country | Link |
---|---|
US (2) | US8632700B2 (zh) |
EP (2) | EP2252662A1 (zh) |
JP (3) | JP2011513534A (zh) |
KR (2) | KR20100116680A (zh) |
CN (2) | CN102015922A (zh) |
SG (2) | SG188158A1 (zh) |
TW (2) | TWI500713B (zh) |
WO (2) | WO2009108306A1 (zh) |
Cited By (8)
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CN103021533A (zh) * | 2011-09-27 | 2013-04-03 | 株式会社东芝 | 透明电极层积体 |
CN103493149A (zh) * | 2011-04-28 | 2014-01-01 | 富士胶片株式会社 | 含有金属纳米线的分散液以及导电膜 |
CN103804995A (zh) * | 2012-11-09 | 2014-05-21 | 财团法人工业技术研究院 | 导电油墨组合物及透明导电薄膜 |
CN103827984A (zh) * | 2011-07-28 | 2014-05-28 | Lg伊诺特有限公司 | 电极结构和用于制造电极的方法 |
CN104159985A (zh) * | 2012-03-08 | 2014-11-19 | 东进世美肯株式会社 | 透明电极形成用导电性油墨组合物 |
CN104766646A (zh) * | 2015-03-04 | 2015-07-08 | 江苏大学 | 一种高耐弯折透明导电膜及其制备方法 |
CN105086632A (zh) * | 2015-10-09 | 2015-11-25 | 重庆文理学院 | 一种尺寸均匀的银导电墨水 |
CN108690404A (zh) * | 2015-10-09 | 2018-10-23 | 重庆文理学院 | 一种高导电性及透光率的水基银纳米线导电薄膜制备方法 |
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US8199044B2 (en) * | 2009-03-31 | 2012-06-12 | The United States Of America, As Represented By The Secretary Of The Navy | Artificial dielectric composites by a direct-write method |
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JP5561714B2 (ja) * | 2009-10-13 | 2014-07-30 | 日本写真印刷株式会社 | ディスプレイ電極用透明導電膜 |
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CN103021533A (zh) * | 2011-09-27 | 2013-04-03 | 株式会社东芝 | 透明电极层积体 |
CN104159985A (zh) * | 2012-03-08 | 2014-11-19 | 东进世美肯株式会社 | 透明电极形成用导电性油墨组合物 |
CN104159985B (zh) * | 2012-03-08 | 2016-11-09 | 东进世美肯株式会社 | 透明电极形成用导电性油墨组合物 |
CN103804995A (zh) * | 2012-11-09 | 2014-05-21 | 财团法人工业技术研究院 | 导电油墨组合物及透明导电薄膜 |
CN104766646A (zh) * | 2015-03-04 | 2015-07-08 | 江苏大学 | 一种高耐弯折透明导电膜及其制备方法 |
CN105086632A (zh) * | 2015-10-09 | 2015-11-25 | 重庆文理学院 | 一种尺寸均匀的银导电墨水 |
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Also Published As
Publication number | Publication date |
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KR20100116680A (ko) | 2010-11-01 |
CN102015921B (zh) | 2014-08-27 |
JP2011513534A (ja) | 2011-04-28 |
JP2015045006A (ja) | 2015-03-12 |
TW200946617A (en) | 2009-11-16 |
JP2011515510A (ja) | 2011-05-19 |
TWI500719B (zh) | 2015-09-21 |
EP2252662A1 (en) | 2010-11-24 |
EP2252663A1 (en) | 2010-11-24 |
SG188159A1 (en) | 2013-03-28 |
SG188158A1 (en) | 2013-03-28 |
US8632700B2 (en) | 2014-01-21 |
KR20100125315A (ko) | 2010-11-30 |
US8815126B2 (en) | 2014-08-26 |
TW200946608A (en) | 2009-11-16 |
WO2009108304A1 (en) | 2009-09-03 |
WO2009108306A1 (en) | 2009-09-03 |
TWI500713B (zh) | 2015-09-21 |
US20090283304A1 (en) | 2009-11-19 |
CN102015922A (zh) | 2011-04-13 |
US20090223703A1 (en) | 2009-09-10 |
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