CN102005434B - 印刷线路板及其制造方法 - Google Patents

印刷线路板及其制造方法 Download PDF

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Publication number
CN102005434B
CN102005434B CN2010102690380A CN201010269038A CN102005434B CN 102005434 B CN102005434 B CN 102005434B CN 2010102690380 A CN2010102690380 A CN 2010102690380A CN 201010269038 A CN201010269038 A CN 201010269038A CN 102005434 B CN102005434 B CN 102005434B
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conductive layer
via conductor
printed substrate
insulating layers
interlayer resin
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CN102005434A (zh
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金子昌弘
小濑觉
东广和
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Ibiden Co Ltd
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Ibiden Co Ltd
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
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Abstract

本发明涉及印刷线路板及其制造方法。该印刷线路板包括：层间树脂绝缘层，其具有通路导体用的贯通孔；导电电路，其形成在所述层间树脂绝缘层的一个表面上；通路导体，其形成于所述贯通孔中，并且具有相对于所述层间树脂绝缘层的另一表面而突出的突出部；以及表面处理涂布物，其形成在所述通路导体的所述突出部的表面上。该通路导体连接至导电电路，并且具有形成在贯通孔的侧壁上的第一导电层以及填充该贯通孔的镀层。

Description

印刷线路板及其制造方法
技术领域
本发明涉及一种可优选在SSD等中使用以安装多个闪速存储器的超薄印刷线路板以及这种印刷线路板的制造方法。
背景技术
例如，日本特开2006-19433号公报说明了一种目的在于提供薄型线路板的制造方法。在该制造方法中，在硅基板上形成绝缘层，并且在该绝缘层中形成通路导体(via conductor)。之后，在通路导体上形成布线层，并且在该布线层上安装半导体元件，并利用树脂封装该半导体元件。然后，通过去除硅基板来获得线路板。这里通过引用包含该公报的全部内容。
发明内容
根据本发明的一个方面，一种印刷线路板包括：层间树脂绝缘层，其具有通路导体用的贯通孔；导电电路，其形成在所述层间树脂绝缘层的一个表面上；通路导体，其形成于所述贯通孔中，并且具有相对于所述层间树脂绝缘层的另一表面而突出的突出部；以及表面处理涂布物，其形成在所述通路导体的所述突出部的表面上。该通路导体连接至所述导电电路，并且具有形成在所述贯通孔的侧壁上的第一导电层以及填充所述贯通孔的镀层。
根据本发明的另一方面，一种印刷线路板的制造方法包括：在支撑基板上形成可去除层；在所述可去除层上形成层间树脂绝缘层；在所述层间树脂绝缘层中形成贯通孔；在所述层间树脂绝缘层上和所述贯通孔的侧壁上形成第一导电层；在所述层间树脂绝缘层上形成导电电路；在所述贯通孔中形成通路导体；通过使用所述可去除层从所述层间树脂绝缘层去除所述支撑基板；形成所述通路导体相对于所述层间树脂绝缘层的表面而突出的突出部；以及在所述通路导体的所述突出部的表面上形成表面处理涂布物。
附图说明
通过参考以下结合附图所进行的详细说明，随着理解的深入能够容易地获得对本发明更完整的评价以及本发明许多随之而来的优点，其中：
图1是用于制造根据本发明第一实施例的印刷线路板的步骤的图；
图2是用于制造根据第一实施例的印刷线路板的步骤的图；
图3是用于制造根据第一实施例的印刷线路板的步骤的图；
图4是用于制造根据第一实施例的印刷线路板的步骤的图；
图5是用于制造根据第一实施例的印刷线路板的步骤的图；
图6是用于制造根据第一实施例的印刷线路板的步骤的图；
图7是示出第一实施例的印刷线路板的断面图；
图8是示出第一实施例的印刷线路板的断面图；
图9是通过放大第一实施例的印刷线路板中的通路导体和凸块(bump)所示出的制造步骤的图；
图10是示出第一实施例的印刷线路板中的通路导体的图；
图11是用于制造根据本发明第二实施例的印刷线路板的步骤的图；
图12是示出第二实施例的印刷线路板的断面图；
图13是示出第二实施例的印刷线路板的断面图；
图14是通过放大第二实施例的印刷线路板中的通路导体和凸块所示出的制造步骤的图；以及
图15是通过放大第三实施例的印刷线路板中的通路导体和凸块所示出的制造步骤的图。
具体实施方式
现在将参考附图说明这些实施例，其中，在各附图中，相同的附图标记表示相应或相同的元件。
第一实施例
参考图1～图9来说明根据本发明第一实施例的印刷线路板以及这种印刷线路板的制造方法。
图7是示出印刷线路板10的一部分的断面图。在印刷线路板10中，安装有通过层压多片存储器(100A、100B、100C)所制成的存储器层压体(memory laminate)100。存储器层压体100利用粘合层110固定至印刷线路板10。例如，存储器层压体100的各存储器通过引线106彼此连接。这些存储器还可以经由通过喷墨所形成的布线彼此连接。
印刷线路板10具有第一层间树脂绝缘层40和第二层间树脂绝缘层60的双层结构。在第一层间树脂绝缘层40中所形成的开口42中，形成通路导体50。在第一层间树脂绝缘层上，形成导电电路52和通路连接层(via land)51。在第二层间树脂绝缘层60中形成开口62，并且在开口62中形成表面处理涂布物70。印刷线路板10和存储器层压体100通过横跨印刷线路板10的表面处理涂布物70和存储器层压体100的焊盘102之间的引线106相连接。在通路导体50的下表面侧(第一表面侧)，形成外部连接用的表面处理涂布物80以具有能够进行引线接合(wire bonding)的结构。利用成型树脂120来封装存储器层压体100。
图9的(C)示出图7的通路导体50周围的区域的放大图。通路导体50上的表面处理涂布物70形成有填充在第二层间树脂绝缘层60的开口62中的镀镍(Ni)层64、镀镍层64上的钯(Pd)膜66以及钯膜66上的金(Au)膜68。为了防止导电电路的腐蚀并使得由金线制成的引线106容易进行接合的目的而涂布金膜68。
在第一层间树脂绝缘层40中的开口42的侧壁上，按顺序依次形成氮化钛(TiN)溅射膜44a(第一导电层)、钛(Ti)溅射膜44b(第一导电层)和铜(Cu)溅射膜44c(第二导电层)。即，通路导体50形成有氮化钛溅射膜44a、钛溅射膜44b、铜溅射膜44c以及形成在铜溅射膜44c的内侧上的电解镀铜膜48。从通路导体50的下表面侧(第一表面侧)去除氮化钛溅射膜44a和钛溅射膜44b，并且在铜溅射膜44c的表面上形成表面处理涂布物80。表面处理涂布物80形成有在通路导体50的第一表面上形成的镍膜82、镍膜82上的钯膜84以及钯膜84上的金膜86。
各层的膜厚如图10的(A)所示。第一层间树脂绝缘层和第二层间树脂绝缘层被形成为约3μm厚。形成表面处理涂布物70的镀镍层被形成为约10μm厚。镀镍层上的钯膜被形成为约0.05μm，并且钯膜上的金膜被形成为约0.3μm。同时，通路导体开口的侧壁上形成的铜溅射膜被形成为约100nm，钛溅射膜被形成为约35nm，并且氮化钛溅射膜被形成为约15nm。形成表面处理涂布物80的镍溅射层被形成为约6μm，钯层被形成为约0.05μm，并且金层被形成为约0.3μm。
如上所述，从通路导体50的下表面侧去除钛溅射膜44b和氮化钛溅射膜44a，并且铜溅射膜44c的表面相对于第一层间树脂绝缘层40的第二表面突出了距离d(50μm)(参见图10的(B))。
在根据第一实施例的印刷线路板中，由于通路导体50的下表面相对于第一层间树脂绝缘层40的下表面突出了d(50μm)，因此利用在通路导体50上形成的表面处理涂布物80来实现锚固效果，并且提高了通路导体50和表面处理涂布物80之间的粘合性。
这里，当用于形成表面处理涂布物80的基体(通路导体50的第一表面侧)是溅射膜时，这种膜由于其细结晶(finecrystallization)而展现出阻挡作用(barrier function)，并且抑制形成通路导体的铜离子扩散到表面处理涂布物80中。因此，确保了表面处理涂布物80的粘合强度。然而，即使通过电解电镀所形成的表面处理涂布物80由与溅射膜(铜溅射膜44c)相同的金属制成，它们的结晶结构也不相同。另外，由于与镀膜相比较，溅射膜(铜溅射膜44c)具有平坦表面，因此，例如在引线接合时或当在模块中生成热时，可以从通路导体50去除表面处理涂布物80。因此，在本实施例中，使通路导体50的第一表面侧相对于第一层间树脂绝缘层40的第二表面突出。因此，即使用于形成表面处理涂布物80的基体(通路导体50的第一表面侧)是溅射膜，也确保了通路导体50和表面处理涂布物80之间的粘合性。
以下说明用于制造根据第一实施例的印刷线路板的方法。
首先，在图1的(A)所示的支撑基板30上，层压3μm厚的热塑性树脂(HT250，由Nissan Chemical Industries，Ltd.制造)32(图1的(B))。然后，在热塑性树脂32上层压4μm厚的层间树脂绝缘层(商品名：WPR，由JSR Corp.制造)40(图1的(C))。
使用光刻技术，在预定部位形成直径约为200μm的通路开口42(图2的(A))。在层间树脂绝缘层40的包括通路开口42的内部的表面上，通过溅射形成三层遮挡层44(图2的(B))。通过参考图8的(A)中的开口42的放大图，进一步详细说明这种遮挡层的结构。遮挡层44由氮化钛溅射膜44a、钛溅射膜44b和铜溅射膜44c构成。由于通过溅射形成氮化钛溅射膜44a、钛溅射膜44b和铜溅射膜44c，因此这些膜均平而薄，并且彼此高度粘合。
通过在涂布有遮挡层44的层间树脂绝缘层40上施加市场上可获得的抗蚀剂，然后通过进行曝光和显影，形成具有预定图案的抗镀层(plating resist)46(图2的(C))。然后，通过进行电解电镀，在没有形成抗镀层的区域上形成电解镀铜膜48(图3的(A))。这里，由于同样使用铜在铜溅射膜44c上形成电解镀铜膜48，因此遮挡层44和电解镀铜膜48之间的粘合性高。通过去除抗镀层(图3的(B))，并且通过使用快速蚀刻去除位于抗镀层下方的遮挡层44，在开口42中形成通路导体50，并且在层间树脂绝缘层40上形成导电电路52和通路连接层51(图3的(C))。当形成两个以上的布线层时，通路导体50优选为填充的通路。通过将通路导体50形成为填充的通路，通路导体50的表面变得大致平坦。在印刷线路板具有多层布线结构的情况下，可以将通路导体直接布置在通路导体50上。因而，可以实现高度集成的布线。
在具有导电电路52的第一层间树脂绝缘层40上，层压4μm厚的层间树脂绝缘层(商品名：WPR，由JSR Corp.制造)60(图3的(D))。使用光刻技术，在预定的通路导体上形成直径为200μm的开口62(图4的(A))。然后，在经由开口62而暴露的通路导体50上，通过无电电镀(electroless plating)，按顺序依次形成镀镍层64、镀钯层66和镀金层68(图4的(B))。
在层间树脂绝缘层60上，利用粘合层110来安装通过层压存储器(100A、100B和100C)所构成的存储器层压体100，并且使用引线106来连接存储器层压体100的焊盘102和表面处理涂布物70(通路导体50)(图4的(C))。
由成型树脂120封装层间树脂绝缘层60和存储器层压体100(图5的(A))。之后，进行加热，并且通过使用热塑性树脂32滑动支撑基板30来去除该支撑基板30(图5的(B))。图8的(B)示出支撑基板30被去除之后通路导体50的放大图。通过抛光(ashing)去除热塑性树脂32(图6的(A)以及作为图6的(A)的放大图的图8的(C))。使用包含氢氧化钾(K0H)的蚀刻剂进行蚀刻，以去除经由层间树脂绝缘层40中的开口42而暴露的钛溅射膜44b和氮化钛溅射膜44a。这里，钛容易被氢氧化钾溶解，但铜难以溶解。图9的(A)示出在去除了经由开口42而暴露的钛溅射膜44b和氮化钛溅射膜44a之后通路导体50的放大图。
然后，通过喷砂(sandblasting)对第一层间树脂绝缘层40的表面进行研磨，以使厚度减小了d(50μm)(图6的(B)以及作为图6的(B)的放大图的图9的(B))。如以上参考图10的(B)所述，铜溅射膜44c的表面相对于第一层间树脂绝缘层40的第二表面突出了距离d(50μm)。
然后，在位于通路导体50的底部的铜溅射膜44c上通过无电电镀形成镍膜82之后，通过无电电镀按顺序依次形成钯膜84和金膜86，并且形成表面处理涂布物80(图7)。图9的(C)示出图7中的表面处理涂布物80的放大图。
利用引线或焊料凸块将如上制造出的半导体设备安装在母板上。这里，可以层压多个这种半导体设备，然后将这些半导体设备安装在母板上。这样，例如，当将16层存储器安装在母板上时，仅使用通过将4层存储器安装在如上的印刷线路板上所获得的好半导体设备是可行的，并且将提高生产率。
第二实施例
参考图11～14来说明根据本发明第二实施例的印刷线路板以及这种印刷线路板的制造方法。
图12是示出印刷线路板10的一部分的断面图。第二实施例的印刷线路板10被构造成与以上通过参考图7所述的第一实施例中的印刷线路板相同。然而，在第一实施例中，将铜溅射膜44c、钛溅射膜44b和氮化钛溅射膜44a这三层形成在层间树脂绝缘层40中的开口42的侧壁上。相比之下，在第二实施例中，如作为图12中的通路导体50的放大图的图14的(C)所示，采用如下的双层结构：在该双层结构中，将由氮化钛溅射膜44a(第一导电层)和铜溅射膜44c(第二导电层)构成的两层形成在开口42的侧壁上。
在第二实施例的印刷线路板中，由于通路导体50的下表面相对于第一层间树脂绝缘层40的第二表面突出了50μm(d2)，因此利用形成在通路导体50上的表面处理涂布物80来实现锚固效果，并且提高了通路导体50和表面处理涂布物80之间的粘合性。
以下说明用于制造第二实施例的印刷线路板的方法。
如以上通过参考图1至图2的(A)所述，在硅基板30上形成热塑性树脂32，并且在热塑性树脂32上层压层间树脂绝缘层40(图11的(A))。在预定部位形成直径为200μm的通路开口42(图11的(B))。在层间树脂绝缘层40的包括通路开口42的内部的表面上，通过溅射形成双层遮挡层44(图11的(C))。通过参考图13的(A)所示的开口42的放大图，进一步详细说明这种遮挡层的结构。遮挡层44由氮化钛溅射膜44a和铜溅射膜44c构成。
下面，形成与以上通过参考图2的(C)～图5的(B)所述的第一实施例中的印刷线路板相同的印刷线路板，并且由成型树脂120封装层间树脂绝缘层60和存储器层压体100。之后，进行加热，并且使用热塑性树脂32去除硅基板30(图13的(B))，然后通过抛光去除热塑性树脂32(图13的(C))。使用氢氧化钾进行蚀刻，以去除经由层间树脂绝缘层40中的开口42而暴露的氮化钛溅射膜44a(图14的(A))。
通过喷砂对第一层间树脂绝缘层40的表面进行研磨，以使厚度减小了d2(50μm)(图14的(B))。如以上参考图14的(C)所述，铜溅射膜44c的表面相对于第一层间树脂绝缘层40的第二表面突出了距离d2(50μm)。
然后，在位于通路导体50的底部的铜溅射膜44c上，通过溅射形成镍膜82。之后，通过利用无电电镀涂布钯膜84和金膜86，来形成由镍膜82、钯膜84和金膜86构成的表面处理涂布物80(图12)。图14的(C)示出图12中的表面处理涂布物80的放大图。
第三实施例
参考图15来说明用于制造根据第三实施例的印刷线路板的方法。
在第一实施例中，在去除热塑性树脂之后，进行蚀刻，以去除经由层间树脂绝缘层40中的开口42而暴露的钛溅射膜44b和氮化钛溅射膜44a。然后，通过喷砂对第一层间树脂绝缘层40的表面进行研磨。相比之下，在第三实施例中，在如第一实施例中的图8的(C)所示去除热塑性树脂之后，通过喷砂对第一层间树脂绝缘层40的表面进行研磨(图15的(A))。之后，去除经由层间树脂绝缘层40中的开口42而暴露的钛溅射膜44b和氮化钛溅射膜44a(图15的(B))。
然后，在位于通路导体50的底部的铜溅射膜44c上通过无电电镀形成镍膜82之后，通过无电电镀按顺序依次形成钯膜84和金膜86，并且形成表面处理涂布物80(图15的(C))。
在第三实施例中，如图15的(B)所示，在开口42和铜溅射膜44c之间，去除钛溅射膜44b和氮化钛溅射膜44a直到深入其内部为止，并且如图15的(C)所示，表面处理涂布物80的镍膜82进入通过这种去除所形成的空间。因此，可以增强通路导体50和表面处理涂布物80之间的粘合性。
第四实施例
在第四实施例中，使用无电电镀铜膜作为第一导电层。即，通路导体50包括形成在层间树脂绝缘层40中的开口42的侧壁上的无电电镀铜膜以及填充在开口42中的电解电镀膜。这里，例如，在去除通路导体的下侧(第一表面侧)的无电电镀铜膜时，作为选择可考虑喷射蚀刻剂。然而，没有特别限制为该去除方法。在本实施例中，可以实现与第一实施例的功能和效果相同的功能和效果。
第五实施例
在第五实施例中，使用非感光性层间树脂绝缘层。在这种情况下，利用激光形成通路导体开口。在此期间，优选形成开口，直至位于层间树脂绝缘层下方的去除层的中间为止。这样，当通过在开口内部形成通路导体来形成布线层之后去除支撑基板时，与第一实施例相同，通路导体的第一表面将相对于层间树脂绝缘层的第二表面而突出。在第五实施例中，也可以实现与上述第一实施例的效果相同的效果。
在经由贯通孔而暴露的通路导体的表面上形成有表面处理涂布物的印刷线路板中，通路导体形成有相对于层间树脂绝缘层的一个表面而突出的表面，利用形成在通路导体的该表面上的表面处理涂布物来实现锚固效果，并且提高了通路导体和表面处理涂布物之间的粘合性。通路导体可以包括形成在贯通孔的侧壁上的第一导电层以及填充贯通孔的镀层。
显然，根据以上教导，可以得出本发明的许多变形和变化。因此，应该理解，除了如这里具体说明的以外，可以在所附权利要求书的范围内实施本发明。
相关申请的交叉引用
本申请要求2009年8月28目提交的美国申请61/237,808的优先权。在此通过引用包含该美国申请的全部内容。

Claims (19)

1.一种印刷线路板，包括：
层间树脂绝缘层，其具有第一表面、位于所述第一表面的相对侧的第二表面以及通路导体用的贯通孔；
导电电路，其形成在所述层间树脂绝缘层的所述第一表面上；
通路导体，其形成于所述贯通孔中，并且具有相对于所述层间树脂绝缘层的所述第二表面而突出的突出部；以及
外部连接用的表面处理涂布物，其形成在所述通路导体的所述突出部的表面上，以具有能够进行引线接合的结构；
其中，所述通路导体连接至所述导电电路，并且包括形成在所述贯通孔的侧壁上的第一导电层以及填充所述贯通孔的镀层。
2.根据权利要求1所述的印刷线路板，其特征在于，所述通路导体具有位于所述第一导电层和所述镀层之间的第二导电层。
3.根据权利要求2所述的印刷线路板，其特征在于，所述第二导电层形成于所述镀层和所述表面处理涂布物之间。
4.根据权利要求2所述的印刷线路板，其特征在于，所述第二导电层和所述镀层由相同的金属制成。
5.根据权利要求2所述的印刷线路板，其特征在于，所述第二导电层和所述镀层由铜制成。
6.根据权利要求1所述的印刷线路板，其特征在于，所述贯通孔的侧壁上的所述第一导电层相对于所述通路导体的所述突出部而凹进。
7.根据权利要求2所述的印刷线路板，其特征在于，所述第一导电层的厚度比所述第二导电层的厚度大。
8.根据权利要求2所述的印刷线路板，其特征在于，通过溅射形成所述第一导电层和所述第二导电层。
9.根据权利要求1所述的印刷线路板，其特征在于，所述表面处理涂布物用于涂布所述贯通孔的外周部分。
10.根据权利要求1所述的印刷线路板，其特征在于，所述第一导电层包括形成在所述层间树脂绝缘层上的氮化钛膜和位于所述氮化钛膜上的钛膜。
11.一种印刷线路板的制造方法，包括：
在支撑基板上形成可去除层；
在所述可去除层上形成层间树脂绝缘层；
在所述层间树脂绝缘层中形成贯通孔；
在所述层间树脂绝缘层上和所述贯通孔的侧壁上形成第一导电层；
在所述层间树脂绝缘层上形成导电电路；
在所述贯通孔中形成通路导体；
通过使用所述可去除层从所述层间树脂绝缘层去除所述支撑基板；
减小所述层间树脂绝缘层的厚度，形成所述通路导体相对于所述层间树脂绝缘层的表面而突出的突出部；以及
在所述通路导体的所述突出部的表面上形成外部连接用的表面处理涂布物以具有能够进行引线接合的结构。
12.根据权利要求11所述的印刷线路板的制造方法，其特征在于，所述通路导体的形成包括：在位于所述贯通孔中的所述第一导电层上形成第二导电层。
13.根据权利要求11所述的印刷线路板的制造方法，其特征在于，所述通路导体的形成包括：在位于所述贯通孔中的所述第一导电层上形成第二导电层并在所述第二导电层上形成镀层，并且所述第二导电层和所述镀层由相同的金属制成。
14.根据权利要求11所述的印刷线路板的制造方法，其特征在于，所述通路导体的形成包括：在位于所述贯通孔中的所述第一导电层上形成第二导电层并在所述第二导电层上形成镀层，并且所述第二导电层和所述镀层由铜制成。
15.根据权利要求11所述的印刷线路板的制造方法，其特征在于，所述通路导体的所述突出部的形成包括：在形成所述表面处理涂布物之前，去除所述第一导电层相对于所述层间树脂绝缘层的表面而突出的部分。
16.根据权利要求11所述的印刷线路板的制造方法，其特征在于，所述可去除层由热塑性树脂制成。
17.根据权利要求11所述的印刷线路板的制造方法，其特征在于，所述第一导电层的形成包括：在所述层间树脂绝缘层上溅射氮化钛膜，并在溅射所述氮化钛膜之后溅射钛膜。
18.根据权利要求11所述的印刷线路板的制造方法，其特征在于，同时形成所述导电电路和所述通路导体。
19.根据权利要求18所述的印刷线路板的制造方法，其特征在于，利用半添加法来执行所述导电电路的形成和所述通路导体的形成。
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