CN101969742A - 印刷线路板、空调机、印刷线路板的钎焊方法 - Google Patents

印刷线路板、空调机、印刷线路板的钎焊方法 Download PDF

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Publication number
CN101969742A
CN101969742A CN2010105207306A CN201010520730A CN101969742A CN 101969742 A CN101969742 A CN 101969742A CN 2010105207306 A CN2010105207306 A CN 2010105207306A CN 201010520730 A CN201010520730 A CN 201010520730A CN 101969742 A CN101969742 A CN 101969742A
Authority
CN
China
Prior art keywords
solder
wiring board
printed wiring
soldering
surface mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105207306A
Other languages
English (en)
Chinese (zh)
Inventor
三浦刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN101969742A publication Critical patent/CN101969742A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2010105207306A 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法 Pending CN101969742A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-315713 2007-12-06
JP2007315713A JP2009141106A (ja) 2007-12-06 2007-12-06 プリント配線基板、空気調和機、プリント配線基板の半田付け方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008101334790A Division CN101453836B (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Publications (1)

Publication Number Publication Date
CN101969742A true CN101969742A (zh) 2011-02-09

Family

ID=40720450

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010105207306A Pending CN101969742A (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法
CN2008101334790A Expired - Fee Related CN101453836B (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008101334790A Expired - Fee Related CN101453836B (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Country Status (3)

Country Link
US (1) US20090145644A1 (https=)
JP (1) JP2009141106A (https=)
CN (2) CN101969742A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6921244B2 (ja) * 2018-01-15 2021-08-18 本田技研工業株式会社 ブレーズ装置及び方法
WO2019211998A1 (ja) * 2018-05-01 2019-11-07 三菱電機株式会社 はんだ付けノズル、はんだ付け装置、はんだ付け方法およびプリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5679929A (en) * 1995-07-28 1997-10-21 Solectron Corporqtion Anti-bridging pads for printed circuit boards and interconnecting substrates
JPH10173329A (ja) 1996-12-10 1998-06-26 Matsushita Electric Works Ltd 噴流式半田付け装置
US5877033A (en) * 1997-03-10 1999-03-02 The Foxboro Company System for detection of unsoldered components
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法
EP1466514B1 (en) * 2001-12-18 2005-03-23 Marconi Communications GmbH Apparatus and method for assembling electronic circuits
JP2006313792A (ja) * 2005-05-06 2006-11-16 Sony Corp プリント配線基板
JP4207934B2 (ja) * 2005-08-09 2009-01-14 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法、空気調和機。
CN1852638B (zh) * 2006-01-24 2010-05-12 华为技术有限公司 一种印刷焊膏的方法及印锡钢网

Also Published As

Publication number Publication date
US20090145644A1 (en) 2009-06-11
CN101453836A (zh) 2009-06-10
JP2009141106A (ja) 2009-06-25
CN101453836B (zh) 2011-03-30

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SE01 Entry into force of request for substantive examination
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Application publication date: 20110209