CN101960590B - 用于直接引线结合到可编程补偿集成电路管芯的压力感测管芯焊盘布局和方法 - Google Patents

用于直接引线结合到可编程补偿集成电路管芯的压力感测管芯焊盘布局和方法 Download PDF

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CN101960590B
CN101960590B CN2009801065072A CN200980106507A CN101960590B CN 101960590 B CN101960590 B CN 101960590B CN 2009801065072 A CN2009801065072 A CN 2009801065072A CN 200980106507 A CN200980106507 A CN 200980106507A CN 101960590 B CN101960590 B CN 101960590B
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tube core
bond pad
wire bond
pressure
compensation
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CN101960590A (zh
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I·本特利
A·D·布拉德利
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Honeywell International Inc
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Honeywell International Inc
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Abstract

一种用于直接管芯-管芯引线结合的方法合并了压力感测管芯和可编程补偿IC管芯，其可以安装在陶瓷衬底上。这两个管芯可以相互邻近放置，使得压力感测管芯上的引线结合焊盘和补偿IC管芯上的结合导线处于相同的顺序。压力感测管芯和补偿IC可以直接与引线结合连接以便减少引线结合的数量并且提高可靠性。压力感测管芯可以被设置成具有多个引线结合焊盘图案以便与不同的可编程补偿IC管芯一起利用。

Description

用于直接引线结合到可编程补偿集成电路管芯的压力感测管芯焊盘布局和方法
技术领域
实施例总体上涉及传感器器件和部件。实施例也涉及合并了IC(集成电路)部件的压力传感器。此外，实施例涉及用于直接管芯-管芯引线结合的方法。
背景技术
许多工艺和器件用在压力感测领域中。压力传感器通常用于和部署在对于监控和响应压力变化的需要是必须的任何地方。压力传感器通常用在各种各样的汽车、航天、商业、工业和消费应用中。
其中需要压力传感器以高精度和可重复性工作于这些应用中的工作环境可能是要求非常高的。例如，极端热条件包括从150C到-55C的范围内的热冲击，以及极端的冲击和振动条件。
压力传感器典型地可以包括衬底、具有可响应于压力可编程补偿IC管芯而运动的膜片的硅压力感测管芯、封闭膜片的盖以及延伸通过基底或盖的某个部分以便供电并测量压力信号的终端。可编程补偿IC管芯可以用于调节传感器管芯的输出以便获得压力信号。在这种配置中，引线结合可以用来提供硅感测管芯和补偿IC管芯的顶面上的结合焊盘与陶瓷衬底上的导体路径之间的电连接。
在大部分现有技术应用中，将硅压力感测管芯结合到补偿集成电路管芯，是通过单独地将每个管芯结合到陶瓷衬底并且利用衬底上的迹线连接这两个管芯而实现的。因此，这些引线结合要求陶瓷衬底上的区域用于结合焊盘，这增加了引线结合的数量。需要在陶瓷衬底上具有居间传导迹线的两个引线结合以便形成压力感测管芯与可编程补偿IC之间的每个连接。连接路径的电感随着路径长度的增加而增大。引线结合的数量和长度的增加进一步增大了封装尺寸和制造成本。此外，传感器的可靠性也可能受所需的引线结合的数量的影响。通常，希望的是减少用来将压力感测管芯引线结合焊盘连接到补偿集成电路管芯的传导迹线和引线结合的长度和数量。
基于以上所述，可以相信，存在对于改进的用于直接管芯-管芯引线结合的方法的需要。也可以相信，存在对于与不同补偿集成电路管芯兼容的改进的压力管芯焊盘布局的需要。
发明内容
以下概述被提供来促进对于所公开实施例独特的一些创新特征的理解，并不意欲是详尽的描述。这些实施例的各个方面的完全理解可以通过将整个说明书、权利要求书、附图和摘要作为一个整体而获得。
因此，本发明的一个方面是提供改进的传感器件和部件。
本发明的另一个方面是提供与不同补偿IC管芯兼容的改进的压力传感器管芯焊盘布局。
本发明的另外的方面是提供改进的用于直接管芯-管芯引线结合的方法。
前述方面以及其他目的和优点现在可以如这里所描述的实现。一种用于直接管芯-管芯引线结合的方法合并了可以安装在陶瓷衬底上的可编程补偿IC(集成电路)管芯和压力感测管芯。这两个管芯可以相互邻近放置，使得压力感测管芯上的引线结合焊盘和补偿IC管芯上的结合导线相互充分靠近以便直接在这两个管芯之间引线结合。为了使这成为可能，结合焊盘必须处于相同的顺序。压力感测管芯和补偿IC可以直接利用引线结合连接以便减少引线结合的数量并且提高可靠性。压力感测管芯可以被设计成具有多个引线结合焊盘图案以便与不同的可编程补偿IC管芯一起利用。这里更详细地公开的方法和压力感测管芯布局减少了连接压力感测管芯和补偿IC管芯所需的引线结合的数量。
附图说明
其中在所有单独附图中相同的附图标记表示相同或功能相似的元件并且其可以结合到说明书中且形成说明书的一部分的附图进一步说明了实施例并且与详细描述一起用来解释这里公开的实施例。
图1示出了可以依照优选实施例实现的用于直接管芯-管芯结合的压力感测管芯焊盘布局的顶视图；
图2示出了可以依照优选实施例实现的具有压力感测管芯和可编程补偿IC管芯的压力传感器装置的顶视图；以及
图3示出了可以依照示例性实施例实现的压力感测管芯焊盘布局的顶视图。
具体实施方式
在这些非限制性实例中讨论的特定值和配置可以被改变并且仅被引用来说明至少一个实施例，而非意在限制其范围。
参照图1，示出了可以依照优选实施例实现的用于直接管芯-管芯结合的压力感测管芯焊盘系统100的顶视图。图1中绘出的系统100总体上合并了压力感测管芯105，该压力感测管芯包括第一组引线结合焊盘图案110和第二组引线结合焊盘图案120，每一组在压力感测管芯105的相对侧形成。系统100的引线结合图案110和120可以由诸如铝、金或铜之类的各种各样的材料形成。第一组引线结合焊盘图案110包括信号结合焊盘145、165、175和电源结合焊盘135、155。此外，这些结合焊盘可以采取各种各样的配置，包括与图1中所绘不同的形状。
应当指出的是，本文使用的术语“电源”意在包括电力和地。压力感测管芯105仅仅包括一些代表性结合焊盘，然而，应当理解的是，压力感测管芯105可以具有许多信号结合焊盘和电源结合焊盘。类似地，第二组引线结合焊盘图案120也包括信号结合焊盘145、165、185和电源结合焊盘135、155。压力感测管芯105还包括分别用于电源结合焊盘135、155以及信号结合焊盘145、165的结合线130、150、140、160。
为了清楚起见，压力感测管芯焊盘系统100包括仅仅沿着边缘的结合焊盘，然而，结合焊盘也可以沿着管芯105的其余边缘提供，使得感测管芯105可以与不同的可编程补偿IC管芯兼容。压力感测管芯上的结合焊盘可以提供除压力外的信号，结合焊盘175和185可以连接到例如提供与温度成比例的信号的二极管器件。
参照图2，示出了依照优选实施例的具有压力感测管芯105和可编程补偿IC管芯250的压力传感器装置200的顶视图。压力传感器装置200包括具有传导迹线210的基底陶瓷层230。传导迹线210可以是任何适当的传导金属，其可以丝网印刷到基底陶瓷层230上，但是优选地为具有可引线结合的修整表面的金、钯银或其他金属化材料。
例如图1中所示的压力感测管芯105可以利用粘合剂安装到基底陶瓷层230上。粘合剂将压力感测管芯105直接附着到基底陶瓷层230上。压力感测管芯105具有多个用于形成电连接的目的的结合焊盘135、145、155、165和170，并且可以被安装成使得结合焊盘135、145、155、165和170是暴露的。
可编程补偿IC管芯250可以如图2中所示安装到陶瓷衬底230上。补偿IC管芯250可以包括存储器芯片或处理器芯片或者其他类型的集成电路。典型地，补偿IC管芯250包括(通常由硅形成的)衬底，但是可以使用其他或附加材料。补偿IC管芯250的确切性质在本发明的范围内可以改变。压力感测管芯105和可编程补偿IC管芯250可以相互邻近放置，使得引线结合焊盘135、145、155、165和170处于与可编程补偿IC管芯250上的那些相同的顺序。这最小化了压力感测管芯105与可编程补偿IC管芯250之间的布线复杂度。
压力感测管芯105的结合焊盘135、145、155、165和170可以利用结合引线220、222、224、226和228在一对一的基础上连接到可编程补偿IC管芯250的相应结合导线。例如，压力感测管芯105上的电源结合焊盘135和155可以利用引线结合224和228电连接到可编程补偿IC管芯250的电源结合导线260和265。通常由铝或金形成的非常细的结合引线可以用来在一对一的基础上将压力感测管芯105上的结合焊盘与集成电路管芯250上的结合导线连接。通过这种方式，可以建立从结合焊盘到封装导线的电连接。
参照图3，示出了可以依照示例性实施例实现的压力感测管芯焊盘布局300的顶视图。压力感测管芯焊盘300包括在压力感测管芯300的所有四个侧边的四组引线结合焊盘图案310、320、330和340。压力感测管芯300可以与四种不同的可编程补偿IC管芯兼容，以便利用引线结合直接连接这两个管芯。为了清楚和明确起见，所述四组引线结合焊盘图案310、320、330和340仅仅包含一些代表性引线结合焊盘，然而，附加的结合焊盘也可以添加到这四组引线结合焊盘图案310、320、330和340。
应当理解的是，上面公开的以及其他的特征和功能的变型或者其可替代物可以根据意愿组合到许多其他不同的系统或应用中。此外，本领域技术人员在以后可以做出各种当前无法预见或无法预料的替代物、修改、变型或其改进，这些也被以下权利要求书包含。

Claims (10)

1.一种用于直接管芯-管芯引线结合的方法，包括：
将压力感测管芯安装到陶瓷衬底，其中所述压力感测管芯包括至少一个引线结合焊盘图案，所述引线结合焊盘图案与多个引线结合焊盘以及包括多个结合导线的可编程补偿IC管芯相关联；
将所述压力感测管芯与所述可编程补偿IC管芯相互邻近放置，使得与所述压力感测管芯相关联的所述多个引线结合焊盘和所述可编程补偿IC管芯的所述多个结合导线相互靠近并且以相同的顺序设置；以及
利用至少一个引线结合将所述多个引线结合焊盘直接电连接到对应的与所述可编程补偿IC管芯相关联的所述多个结合导线，从而减少所述至少一个引线结合的总数量并且提高其可靠性。
2.权利要求1的方法，还包括：
利用所述至少一个引线结合焊盘图案配置所述压力感测管芯，使得所述压力感测管芯与多个补偿IC管芯兼容。
3.权利要求1的方法，其中所述多个引线结合焊盘包括在所述压力感测管芯上的至少一个信号结合焊盘以及至少一个电源结合焊盘。
4.权利要求1的方法，其中所述至少一个引线结合焊盘图案由包括以下至少一个的组形成：铝，金和铜。
5.权利要求1的方法，还包括：
利用所述至少一个引线结合焊盘图案配置所述压力感测管芯，使得所述压力感测管芯与多个补偿IC管芯兼容，其中所述多个引线结合焊盘包括在所述压力感测管芯上的至少一个信号结合焊盘以及至少一个电源结合焊盘。
6.一种直接管芯-管芯引线结合装置，包括：
安装到陶瓷衬底的压力感测管芯，所述压力感测管芯包括至少一个引线结合焊盘图案，所述引线结合焊盘图案与多个引线结合焊盘以及包括多个结合导线的可编程补偿IC管芯相关联；
其中所述压力感测管芯与所述可编程补偿IC管芯相互邻近放置，使得与所述压力感测管芯相关联的所述多个引线结合焊盘和所述可编程补偿IC管芯的所述多个结合导线相互靠近并且以相同的顺序设置；并且
其中利用至少一个引线结合将所述多个引线结合焊盘直接电连接到且对应于与所述可编程补偿IC管芯相关联的所述多个结合导线，从而减少所述至少一个引线结合的总数量并且提高其可靠性。
7.权利要求6的装置，进一步其中：
利用所述至少一个引线结合焊盘图案配置所述压力感测管芯，使得所述压力感测管芯与多个补偿IC管芯兼容；
所述多个引线结合焊盘包括在所述压力感测管芯上的至少一个信号结合焊盘以及至少一个电源结合焊盘。
8.一种直接管芯-管芯引线结合装置，包括：
安装到陶瓷衬底的压力感测管芯，所述压力感测管芯包括至少一个引线结合焊盘图案，所述引线结合焊盘图案与多个引线结合焊盘以及包括多个结合导线的可编程补偿IC管芯相关联；
其中所述压力感测管芯与所述可编程补偿IC管芯相互邻近放置，使得与所述压力感测管芯相关联的所述多个引线结合焊盘和所述可编程补偿IC管芯的所述多个结合导线相互靠近并且以相同的顺序设置；
其中利用至少一个引线结合将所述多个引线结合焊盘直接电连接到且对应于与所述可编程补偿IC管芯相关联的所述多个结合导线，从而减少所述至少一个引线结合的总数量并且提高其可靠性，并且
其中利用所述至少一个引线结合焊盘图案配置所述压力感测管芯，使得所述压力感测管芯与多个补偿IC管芯兼容。
9.权利要求8的装置，进一步其中利用所述至少一个引线结合焊盘图案配置所述压力感测管芯，使得所述压力感测管芯与多个补偿IC管芯兼容。
10.权利要求8的装置，其中所述多个引线结合焊盘包括在所述压力感测管芯上的至少一个信号结合焊盘以及至少一个电源结合焊盘。
CN2009801065072A 2008-02-27 2009-02-10 用于直接引线结合到可编程补偿集成电路管芯的压力感测管芯焊盘布局和方法 Active CN101960590B (zh)

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