JP5365665B2 - センサユニット - Google Patents
センサユニット Download PDFInfo
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- JP5365665B2 JP5365665B2 JP2011139384A JP2011139384A JP5365665B2 JP 5365665 B2 JP5365665 B2 JP 5365665B2 JP 2011139384 A JP2011139384 A JP 2011139384A JP 2011139384 A JP2011139384 A JP 2011139384A JP 5365665 B2 JP5365665 B2 JP 5365665B2
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- sensor unit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0016—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Description
L=7mmとした場合、(式2)により寄生容量Ch=2.5pFと計算される。
(1)所定の厚さをもって対向する第1面および第2面を有するセラミック部材と、
前記第1面側に実装されたセンサ部と、
前記第2面側に固定された複数の金属ピンと、
前記セラミック部材を貫通して前記センサ部と前記金属ピンとを接続する複数の内部配線と、
前記第2面側の周端部に形成され、溶接により筐体と接合する金属部材と、
前記第1面側において前記センサ部を覆って前記セラミック部材の周縁部に固定された絶縁材キャップと、
この絶縁材キャップの内壁面に形成された金属膜シールド部材と、
前記金属部材の、前記金属ピンと対向する内周壁に形成されたテーパー状切り欠き部と、
前記セラミック部材を貫通する前記複数の内部配線の夫々を取り囲んで形成されたシールド部材と、
を備えることを特徴とするセンサユニット。
(1)内部配線をもつセラミック部材100の構成により、従来構造の金属ボディ30と金属ピン40を貫通穴30C内で近接して配置させるガラス封着部に生ずる大きな寄生容量の発生を回避し、寄生容量を大幅に低減させてノイズ利得を低減させることができる。
6e―6(20℃〜100℃)、セラミック(アルミナ)の膨張係数は、6e―6(20℃〜100℃)である。セラミックとコバールの接合は一般的に行われている。
図5の実施例では、セラミック部材100内を貫通する複数の内部配線200の夫々を取り囲むシールド部材600を備え、絶縁キャップ400の内周面に形成された金属膜シールド500とともに電気的に接続して回路コモンに接続し、フローティングされたセンサユニット1を実現している。
10 センサ部
20 支持台
40 金属ピン
60 封液カプセル
80 筐体
90 溶接
100 セラミック部材
100a 第1面
100b 第2面
200 内部配線
300 金属部材
300a テーパー状切り欠き部
400 絶縁材キャップ
500 金属膜シールド部材
600 シールド部材
700 シールド部材
Claims (5)
- 所定の厚さをもって対向する第1面および第2面を有するセラミック部材と、
前記第1面側に実装されたセンサ部と、
前記第2面側に固定された複数の金属ピンと、
前記セラミック部材を貫通して前記センサ部と前記金属ピンとを接続する複数の内部配線と、
前記第2面側の周端部に形成され、溶接により筐体と接合する金属部材と、
前記第1面側において前記センサ部を覆って前記セラミック部材の周縁部に固定された絶縁材キャップと、
この絶縁材キャップの内壁面に形成された金属膜シールド部材と、
前記金属部材の、前記金属ピンと対向する内周壁に形成されたテーパー状切り欠き部と、
前記セラミック部材を貫通する前記複数の内部配線の夫々を取り囲んで形成されたシールド部材と、
を備えることを特徴とするセンサユニット。 - 前記複数の金属ピンの夫々を取り囲んで形成されたシールド部材を備えることを特徴とする請求項1に記載のセンサユニット。
- 前記セラミック部材を貫通する前記複数の内部配線の全体を囲んで形成されたシールド部材を備えることを特徴とする請求項1に記載のセンサユニット。
- 前記セラミック部材は多層セラミック部材で形成され、前記内部配線は、各多層セラミック部材間の貫通配線で接続されると共に、前記シールド部材は、各多層セラミック部材上に生成されたリング状の金属プリントを貫通配線で接続して形成されることを特徴とする請求項1または3に記載のセンサユニット。
- 前記絶縁材キャップの内壁面に形成された前記金属膜シールド部材は、前記セラミック部材の側壁面の前記第2面側まで延長されていることを特徴とする請求項1に記載のセンサユニット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011139384A JP5365665B2 (ja) | 2011-06-23 | 2011-06-23 | センサユニット |
EP12171609.6A EP2538190B1 (en) | 2011-06-23 | 2012-06-12 | Sensor unit |
CN201210212500.2A CN102840871B (zh) | 2011-06-23 | 2012-06-21 | 传感器单元 |
US13/532,331 US9116063B2 (en) | 2011-06-23 | 2012-06-25 | Sensor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011139384A JP5365665B2 (ja) | 2011-06-23 | 2011-06-23 | センサユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013007606A JP2013007606A (ja) | 2013-01-10 |
JP5365665B2 true JP5365665B2 (ja) | 2013-12-11 |
Family
ID=46514089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011139384A Active JP5365665B2 (ja) | 2011-06-23 | 2011-06-23 | センサユニット |
Country Status (4)
Country | Link |
---|---|
US (1) | US9116063B2 (ja) |
EP (1) | EP2538190B1 (ja) |
JP (1) | JP5365665B2 (ja) |
CN (1) | CN102840871B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013101315A1 (de) * | 2013-02-11 | 2014-08-14 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Verlötung eines Anschlusselement |
CN103759864A (zh) * | 2014-01-26 | 2014-04-30 | 中国电子科技集团公司第四十九研究所 | 一种陶瓷封装结构及采用该陶瓷封装结构的压力敏感器件管壳 |
US9648745B2 (en) | 2014-10-22 | 2017-05-09 | Honeywell International Inc. | Systems and methods for mounting the printed wiring assembly to the header assembly of a pressure sensor |
CN105043658A (zh) * | 2015-06-19 | 2015-11-11 | 宁波南车时代传感技术有限公司 | 空调用压力传感器 |
DE102015223362A1 (de) * | 2015-11-25 | 2017-06-01 | Minimax Gmbh & Co. Kg | Explosionsgeschütztes Gehäuse für Mittel zum Senden und Empfangen elektromagnetischer Strahlung |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0810169B2 (ja) | 1987-06-30 | 1996-01-31 | 横河電機株式会社 | 振動形差圧センサ |
JP2724419B2 (ja) * | 1990-08-28 | 1998-03-09 | 日本特殊陶業株式会社 | 圧力センサ |
JPH05223669A (ja) * | 1992-02-12 | 1993-08-31 | Hitachi Ltd | 半導体圧力センサ |
US6568274B1 (en) * | 1998-02-04 | 2003-05-27 | Mks Instruments, Inc. | Capacitive based pressure sensor design |
US5962791A (en) * | 1998-07-16 | 1999-10-05 | Balzers Aktiengellschaft | Pirani+capacitive sensor |
JP2001074582A (ja) * | 1999-08-31 | 2001-03-23 | Hitachi Ltd | 筒内圧センサ |
JP3932302B2 (ja) * | 2000-12-27 | 2007-06-20 | 独立行政法人産業技術総合研究所 | 圧力センサ |
JP4044307B2 (ja) * | 2001-08-01 | 2008-02-06 | 株式会社山武 | 圧力センサ |
JP2004045216A (ja) * | 2002-07-11 | 2004-02-12 | Toyoda Mach Works Ltd | 圧力センサ |
CN100443873C (zh) * | 2004-09-28 | 2008-12-17 | Vega格里沙贝两合公司 | 用于固定在容器上的传感器,特别是压力传感器 |
US7538401B2 (en) * | 2005-05-03 | 2009-05-26 | Rosemount Aerospace Inc. | Transducer for use in harsh environments |
EP2056087A4 (en) * | 2006-10-02 | 2011-11-30 | Panasonic Elec Works Co Ltd | PRESSURE SENSOR |
JP2008203117A (ja) * | 2007-02-21 | 2008-09-04 | Yokogawa Electric Corp | 物理量測定モジュールおよび物理量測定器 |
US7677109B2 (en) * | 2008-02-27 | 2010-03-16 | Honeywell International Inc. | Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die |
JP2009265041A (ja) * | 2008-04-28 | 2009-11-12 | Yamatake Corp | 静電容量型圧力センサ |
ITTO20080485A1 (it) * | 2008-06-19 | 2009-12-20 | Eltek Spa | Dispositivo sensore di pressione |
DE102009007837A1 (de) * | 2009-02-06 | 2010-08-19 | Epcos Ag | Sensormodul und Verfahren zum Herstellen von Sensormodulen |
JP2010197057A (ja) * | 2009-02-23 | 2010-09-09 | Kyocera Corp | 圧力検出装置用基体および圧力検出装置 |
-
2011
- 2011-06-23 JP JP2011139384A patent/JP5365665B2/ja active Active
-
2012
- 2012-06-12 EP EP12171609.6A patent/EP2538190B1/en active Active
- 2012-06-21 CN CN201210212500.2A patent/CN102840871B/zh active Active
- 2012-06-25 US US13/532,331 patent/US9116063B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013007606A (ja) | 2013-01-10 |
EP2538190A1 (en) | 2012-12-26 |
CN102840871A (zh) | 2012-12-26 |
US9116063B2 (en) | 2015-08-25 |
CN102840871B (zh) | 2015-10-21 |
US20120324998A1 (en) | 2012-12-27 |
EP2538190B1 (en) | 2020-08-26 |
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