CN101941832A - 陶瓷材料和电子器件 - Google Patents

陶瓷材料和电子器件 Download PDF

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CN101941832A
CN101941832A CN201010225142XA CN201010225142A CN101941832A CN 101941832 A CN101941832 A CN 101941832A CN 201010225142X A CN201010225142X A CN 201010225142XA CN 201010225142 A CN201010225142 A CN 201010225142A CN 101941832 A CN101941832 A CN 101941832A
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stupalith
formula
ion
metal ion
combination
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CN101941832B (zh
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拉杰什·库马尔·马尔汉
杉山尚宏
野口祐二
宫山胜
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Denso Corp
University of Tokyo NUC
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Abstract

一种具有钙钛矿结构且由式(1-x)ABO3-xYZO3表示的陶瓷材料。在该式中,“x”是大于0且小于1的实数,“A”、“B”、“Y”和“Z”各自是一种或多种选自除了Pb离子和碱金属离子之外的多种金属离子M。“A”是二价的,“B”是四价的,“Y”是三价的,或三价金属离子的组合,“Z”是二价的和/或三价的金属离子,或二价的和/或五价的金属离子。

Description

陶瓷材料和电子器件
技术领域
本发明涉及一种具有钙钛矿结构的陶瓷材料。本发明还涉及电子器件,更具体而言,涉及打算用于高温应用的电容器。
背景技术
通常,可在25℃到400℃的高温下运转的SiC集成电路被用于艰苦的条件下,如车辆中。该SiC集成电路包括电容器,该电容器包括由高介电常数材料制成的介电层。
高介电常数材料广泛归类为由SiO2系材料和HfO2系材料代表的高介电常数门绝缘材料(以下称为材料1),和由BaTiO3代表的钙钛矿型氧化物(以下称为材料2)。关于材料2,其介电常数的温度稳定性可以通过如A D.Hilton和B.W.Ricketts在J.Phys.D:Appl.Phys.,29(1996)1321-1325中所描写的、用Sr替换部分Ba而改善。
材料1的难点是介电常数小至10到20。材料2的难点是介电常数随温度变化太大,即,介电常数的温度稳定性低。
发明内容
鉴于上述问题,本发明的目的是提供一种具有高介电常数和高的介电常数温度稳定性的陶瓷材料。本发明的另一个目的是提供一种使用该陶瓷材料的电容器。
根据本发明第一方面的陶瓷材料具有钙钛矿结构,并且由下式表示:(1-x)ABO3-xYZO3。式中“x”是大于0且小于1的实数,“A”、“B”、“Y”和“Z”各自是一种或多种选自除Pb离子和碱金属离子外的多种金属离子M,“A”是二价的,“B”是四价的,“Y”是三价的,或三价金属离子的组合,“Z”是二价的和/或三价的金属离子,或二价的和/或五价的金属离子。其可以是至少两种金属离子的组合,其中至少一种始终是二价的金属离子。该陶瓷材料可以具有高的介电常数,以及高的介电常数温度稳定性。
根据本发明第二方面的电容器包括由根据第一方面的陶瓷材料制成的介电层。因为该陶瓷材料具有高的介电常数和高的介电常数温度稳定性,因此该电容器可以具有高的介电常数和高的介电常数温度稳定性。
附图说明
通过下列示范性实施方式的详细说明并结合附图,本发明另外的目的和优点将更容易地显现。在这些附图中:
图1所示为根据本发明第一实施方式和比较例的陶瓷材料的制造条件;
图2所示为根据本发明第一实施方式和比较例的陶瓷材料的评价结果;
图3所示为“X”值与在200℃、300℃和400℃下用1MHz的测量频率测量的介电常数之间的关系;
图4所示为温度与用不同测量频率测量的x=0.6的样品的介电常数之间的关系;
图5所示为温度与用不同测量频率测量的x=0的样品的介电常数之间的关系;
图6A所示为x=0的样品的X射线衍射数据图;
图6B所示为x=0.05的样品的x射线衍射数据图;
图6C所示为x=0.1的样品的x射线衍射数据图;
图6D所示为x=0.2的样品的x射线衍射数据图;
图6E所示为x=0.4的样品的x射线衍射数据图;
图6F所示为x=0.6的样品的x射线衍射数据图;
图6G所示为x=0.7的样品的x射线衍射数据图;
图7所示为温度与根据第一实施方式实例的x=0.05、并含有5%的Bi金属离子的样品的介电常数的关系图,其中该样品具有下式:(1-x)BaTiO3-xBi(Ni2/3Nb1/3)O3+Bi 5%;
图8所示为根据第一实施方式实例(1-x)BaTiO3-xBi(Mg1/2Zn1/2)O3的陶瓷材料的制造条件;
图9所示为根据第一实施方式实例(1-x)BaTiO3-xBi(Mg1/2Zn1/2)O3的陶瓷材料的评价结果;
图10A所示为温度和x=0.2的样品以不同测量频率测量的介电常数的关系图;
图10B所示为温度和x=0.4的样品以不同测量频率测量的介电常数的关系图;
图10C所示为温度和x=0.4(高密度)的样品以不同测量频率测量的介电常数的关系图;
图10D所示为温度和x=0.5的样品以不同测量频率测量的介电常数的关系图;
图11A所示为x=0.2的样品的X射线衍射数据图;
图11B所示为x=0.4的样品的X射线衍射数据图;
图11C所示为x=0.4(高密度)的样品的X射线衍射数据图;
图11D所示为x=0.5的样品的X射线衍射数据图;和
图11E所示为x=0.6的样品的X射线衍射数据图。
具体实施方式
(第一实施方式)
根据本发明第一实施方式陶瓷材料由下式(1)表示:
(1-x)BaTiO3-xBi(Mg2/3Nb1/3)O3...(1)
其中,“x”表示Bi(Mg2/3Nb1/3)O3与该陶瓷材料总量的摩尔比。因此,“x”表示大于0且小于1的实数。如下制造“x”分别是0、0.05、0.1、0.2、0.4、0.5、0.6和0.7的各种情况下的陶瓷材料。x=0的陶瓷材料是比较例。
首先将原料BaCO3、Bi2O3、TiO2、MgO和Nb2O5称重,并将其投入带有球的塑料缸中,然后添加乙醇。然后通过用球磨机处理来混合这些原料。每种原料的量应确保Ba、Bi、Ti、Mg和Nb的比值与式(1)中的化学计量比例符合。
在蒸发乙醇之后,将这些材料投入氧化铝坩埚内,并在马弗炉内预烧制。预烧制温度是900℃到1000℃的温度,预烧制的时间为4小时。在空气中进行预烧制。通过预烧制将这些材料变成粉末。将乙醇添加至该粉末中,再用球磨机将该粉末粉碎。
在蒸发乙醇之后,用公知的单轴压制,自该粉末模制成型小球。压制条件是0.5tf/cm2和5分钟。将该小球投入袋中,并在冷等静压制仪器(CIP仪器)内进行各向同性的压制处理。压制条件是150MPa和30分钟。
在1000℃到1350℃的温度下烧制该小球4小时。然后,在空气中将该小球在1100℃下退火7小时,由此形成该陶瓷材料。
设定每个“x”值的预烧制条件和烧制条件。图1中所示为预烧制条件、烧制条件、退火条件、形成的陶瓷材料的相对密度。
将预烧制的温度尽可能低地设置在使该陶瓷材料变成单相的范围内。将烧制的温度尽可能低地设置在使该陶瓷材料的密度变得足够高的范围内。
如下评价由上述方法形成的陶瓷材料。首先,从每个陶瓷材料的小球切割出厚度为0.3mm的薄板,并在抛光板上用抛光粉打磨该薄板。在该打磨的薄板的两面上,通过溅射形成金电极层。使用Ag糊剂将每个电极层与Pt线的一端相连,从而形成样品。
将样品放置在红外灯炉内。将每个Pt线的另一端(在与每个电极层相连端另一侧上的一端)与测量装置如阻抗分析器连接,再测量电容“C”。然后,由下式(2)计算介电常数“ε”。在式(2)中,“S”是电极面积,即薄板的面积,而“d”是电极间隔,即薄板的厚度。例如,“d”是0.2mm至0.3mm的值,而“S”是小于或等于0.3cm2的值。
C=ε·S/d...(2)
在25℃至400℃范围内的多个温度下,用1kHz、3kHz、10kHz、30kHz、100kHz、300kHz和1MHz的测量频率测量介电常数。
图2中所示为在25℃、200℃、300℃和400℃下用1MHz的测量频率测量的介电常数、居里温度、介电常数变化比和泄放电流密度,其中每个样品的x值是0、0.05、0.1、0.2、0.5、0.6和0.7。介电常数变化比是在400℃下测量的介电常数与在200℃下测量的介电常数之比。
图3所示为“x”值与在200℃、300℃和400℃下用1MHz测量频率测量的介电常数之间的关系。
如图2和图3所示,与其中“x”值为0时的样品的介电常数变化比和泄放电流密度相比,在其中“x”值为大于0的每个样品中,介电常数变化比和泄放电流密度较小。尤其当“x”值大于或等于0.1时,可有效降低介电常数的变化比,同时保持了高的介电常数。
图4所示为温度与在用测量频率为1kHz、3kHz、10kHz、30kHz、100kHz、300kHz和1MHz下测量的x=0.6的样品的介电常数之间的关系。图5所示为温度与在用测量频率为1kHz、3kHz、10kHz、30kHz、100kHz、300kHz和1MHz下测量的x=0的样品的介电常数之间的关系。由图4和图5显而易见,在x=0.6的样品中,即使当测量频率改变时,与x=0的样品相比,该样品的介电常数的温度依赖性难以被改变。
在图6A、图6B、图6C、图6D、图6E、图6F和图6G中分别显示了x=0、0.05、0.1、0.2、0.5、0.6和0.7的样品的X射线衍射数据。由图6A-图6G中显而易见,每个样品都是单相的,并且具有钙钛矿结构,虽然杂质的峰值大致保持在x=0.7的样品的X射线衍射数据上。
如上所述,根据本实施方式的陶瓷材料具有高的介电常数和高的介电常数温度稳定性。另外,即使在改变测量频率时,介电常数对温度的依赖性也难以改变。此外,因为该陶瓷材料基本上不包含Pb离子和碱金属离子,所以即使当应用于半导体加工工艺时,也不太会出现问题。“基本上不包括Pb离子和碱金属离子”是指该陶瓷材料可以包括Pb离子和碱金属离子,但Pb离子和碱金属离子的量太少,以至于不会抑制上述效果。
因为根据本实施方式的陶瓷材料具有上述效果,因此该陶瓷材料可用作电容器的介电层。该电容器可以包括由该陶瓷材料制成的多个介电层和多个内电极层,并且该介电层和内电极层可以交替堆叠。内电极层可以包括导电的Ni合金。根据本实施方式的陶瓷材料还可用于除电容器外的各种电子器件中。
可以改进根据本实施方式的陶瓷材料,以便使其具有由下式(3)表示的结构:
(1-x)BaTiO3-xBi(Ni2/3Nb1/3)O3...(3)
其中,“x”是大于0且小于1的实数。在该式(3)中,式(1)中的Mg2+变成为Ni2+。具有由式(3)表示的结构的陶瓷材料能够具有基本上类似于由式(1)表示的陶瓷材料的效果。尤其当“x”的值大于或等于0.5时,该陶瓷材料可以具有高的介电常数和高的介电常数温度稳定性。
制备“x”是0.05、0.1、0.2、0.3、0.4和0.5的各种情况下的陶瓷材料。在没有过量的Bi金属离子时是难以实现高密度的陶瓷材料的。过量的Bi对于制备式(3)所示结构的高密度陶瓷小球是必须的。因此,本实施方式可以改进为具有下式(4)所示的结构:
(1-x)BaTiO3-xBi(Ni2/3Nb1/3)O3+Bi(5%~15%)...(4)
图7所示为温度与样品在测量频率为1kHz、3kHz、10kHz、30kHz、100kHz、300kHz和1MHz下测量的介电常数的关系图,其中该样品的x=0.05,且Bi3+超过陶瓷材料总量的5%。如图7中所示,用镍金属离子代替Mg金属离子可以增加介电常数的数值,但是,该数值表现出强的温度依赖和频率依赖的特性。可能需要多于两种成分的复合组成(complexcomposition)来稳定所观察到的较强的温度和频率依赖的特性。
可以改进根据本实施方式的陶瓷材料,以便使其具有由下式(5)所示的结构:
实例:(1-x)BaTiO3-xBi(Mg1/2Zr1/2)O3...(5)
其中,“x”是大于0且小于1的实数。在式(5)中,Nb3+(1)被变成Zr4+。制备“x”是0.2、0.4、0.4(高密度)、0.5和0.6的各种情况下的陶瓷材料。预烧制条件、烧制条件、形成的陶瓷材料的相对密度见图8中所示。
图9中所示为在25℃、200℃、300℃和400℃下用1MHz的测量频率测量的介电常数、居里温度、介电常数变化比和泄放电流密度,其中每个样品的x值是0.2、0.4、0.4(高密度)和0.5。介电常数的变化比是在400℃下测量的介电常数与在200℃下测量的介电常数之比。
图10A至图10D所示为温度与在1kHz、3kHz、10kHz、30kHz、100kHz、300kHz和1MHz的测量频率下测量的、“x”值为0.2、0.4、0.4(高密度)和0.5的样品的介电常数及介电损失的关系图。如图10A至图10D中所示,在其中“x”值大于0.2的各样品中,与其中“x”值等于0.2的样品的介电常数变化比和泄放电流密度相比,其介电常数变化比较小。当“x”值大于或等于0.5时,介电常数变化比有效地较小,同时还保持了高的介电常数,但是泄放电流相对有所增加。
图11A、图11B、图11C、图11D和图11E中分别示出了x值为0.2、0.4、0.4(高密度)、0.5和0.6的样品的X射线衍射数据。由图11A-图11E中显而易见,每个样品都是单相的,并且具有钙钛矿结构,虽然杂质的峰值大致保持在x=0.6的样品的X射线衍射数据上。
可以改进本实施方式的陶瓷材料,以使其具有由下式(6)表示的结构:
(1-x)BaTiO3-xBi(Zn1/2Zr1/2)O3...(6)
其中,“x”是大于0且小于1的实数。在式(6)中,式(1)中的Mg2+和Nb3+变成为Zn2+和Zr4+。具有式(6)所示结构的陶瓷材料可以具有与由式(1、3、5)所示结构的陶瓷材料基本相似的效果。尤其是当“x”值大于或等于0.2且小于或等于0.5(0.2≤x≤0.5)时,该陶瓷材料可以具有高介电常数和高的介电常数温度稳定性。
(第二实施方式)
根据本发明第二实施方式的陶瓷材料由下式(7)表示:
(1-x)Ba(MII,MIV,V)O3-xBi(MII,MIV,V)O3...(7)
其中,“x”是大于0且小于1的实数,MII是二价金属离子,MIV是四价金属离子,MV是五价金属离子。(MII,MIV,V)是指二价金属离子MII和四价金属离子MIV的组合,或二价金属离子MII与五价金属离子MV的组合。在式(7)中,紧跟在Ba之后描述的(MII,MIV,V)的平均化合价是4,紧跟在Bi之后描述的(MII,MIV,V)的平均化合价是3。金属离子MII、MIV和MV的每一种既不是Pb离子也不是碱金属离子。
二价金属离子MII是一种或多种选自Mg2+、Ni2+和Zn2+的金属离子。四价金属离子MIV是一种或多种选自Ti4+和Zr4+的金属离子。五价金属离子MV是一种或多种选自Nb5+和Ta5+的金属离子。
根据本实施方式的陶瓷材料可以以基本上类似于第一实施方式的陶瓷材料的方式来制造。然而,可以根据制造陶瓷材料的化学计量比例来调整材料的种类和配比。
根据本实施方式的陶瓷材料具有钙钛矿结构,并且产生基本上类似于根据第一实施方式陶瓷材料效果的效果。
(第三实施方式)
根据本发明第三实施方式的陶瓷材料由下式(8)表示:
(1-x)BaTiO3-x(Bi,MIII)(MII,MIV,V)O3...(8)
其中,“x”是大于0且小于1的实数,MII是二价金属离子,MIII是三价金属离子,MIV是四价金属离子,MV是五价金属离子。(Bi,MIII)是指Ba3+与除Bi3+外的三价金属离子MIII的组合。另外,(MII,MIV,V)是指二价金属离子MII与四价金属离子MIV的组合,或二价金属离子MII与五价金属离子MV的组合。在式(5)中,紧跟在(Bi,MIII)之后描述的(MII,MIV,V)的平均化合价是3。金属离子MII、MIII、MIV和MV的每一种既不是Pb离子也不是碱金属离子。
二价金属离子MII是一种或多种选自Mg2+、Ni2+和Zn2+的金属离子。三价金属离子MIII是稀土类(RE),且是一种或多种选自La3+、Nd3+和Sm3+的金属离子。在(Bi,MIII)中,三价金属离子MIII占例如大于或等于10%的摩尔比。当三价金属离子MIII占大于或等于10%的摩尔比时,可以有效降低介电常数的温度变化。四价金属离子MIV是一种或多种选自Ti4+和Zr4+的金属离子。五价金属离子MV是一种或多种选自Nb5+和Ta5+的金属离子。
根据本实施方式的陶瓷材料可以以基本上类似于根据第一实施方式的陶瓷材料的方式来制造。然而,可以根据制造陶瓷材料的化学计量比例来调整材料的种类和配比。
根据本实施方式的陶瓷材料具有钙钛矿结构,并且产生基本上类似于根据第一实施方式的陶瓷材料效果的效果。
(第四实施方式)
根据本发明第四实施方式的陶瓷材料由下式(9)表示:
(1-x)Ba(MII,MIV,V)O3-x(Bi,MIII)(MII,MIV,V)O3...(9)
其中,“x”是大于0且小于1的实数,MII是二价金属离子,MIII是三价金属离子,MIV是四价金属离子,MV是五价金属离子。(Bi,MIII)是指Ba3+与除Bi3+外的三价金属离子MIII的组合。另外,(MII,MIV,V)是指二价金属离子MII与四价金属离子MIV的组合,或二价金属离子MII与五价金属离子MV的组合。在式(9)中,紧跟在Ba之后描述的(MII,MIV,V)的平均化合价是4,紧跟在(Bi,MIII)之后描述的(MII,MIV,V)的平均化合价是3。金属离子MII、MIII、MIV和MV的每一种既不是Pb离子也不是碱金属离子。
二价金属离子MII是一种或多种选自Mg2+、Ni2+和Zn2+的金属离子。三价金属离子MIII是稀土类(RE),且是一种或多种选自La3+、Nd3+和Sm3+的金属离子。在(Bi,MIII)中,三价金属离子MIII占例如大于或等于10%的摩尔比。当三价金属离子MIII占大于或等于10%的摩尔比时,可有效降低介电常数的温度变化。四价金属离子MIV是一种或多种选自Ti4+和Zr4+的金属离子。五价金属离子MV是一种或多种选自Nb5+和Ta5+的金属离子。
根据本实施方式的陶瓷材料可以以基本上类似于根据第一实施方式的陶瓷材料的方式来制造。然而,可以根据制造陶瓷材料的化学计量比例来调整材料的种类和配比。
根据本实施方式的陶瓷材料具有钙钛矿结构,并且产生基本上类似于根据第一实施方式陶瓷材料效果的效果。
根据本发明第一至第四实施方式的陶瓷材料还可由下式(10)表示:
(1-x)ABO3-xYZO3...(10)
其中“x”是大于0且小于1的实数,“A”、“B”、“Y”和“Z”各自是一种或多种选自除了Pb离子和碱金属离子之外的多种金属离子M。“A”是二价的,“B”是四价的,“Y”是三价的,或三价金属离子的组合,“Z”是二价的,和/或三价的金属离子,或二价的和/或五价的金属离子。其可以是至少两种金属离子的组合,其中至少一种始终是二价的金属离子。金属离子M包括二价金属离子MII、三价金属离子MIII、四价金属离子MIV、五价金属离子MV。金属离子M包括Ba2+、Mg2+、Ni2+、Zn2+、Bi3+、La3+、Nd3+、Sm3+、Ti4+、Zr4+、Nb5+和Ta5+
即使已通过参考附图与其示范性实施方式结合完全描述了本发明,但是应注意对本领域技术人员来说,各种改变和改进将会变得显而易见。

Claims (23)

1.一种具有钙钛矿结构、且由下式(1)表示的陶瓷材料:
(1-x)ABO3-xYZO3...(1)
其中“x”是大于0且小于1的实数,“A”、“B”、“Y”和“Z”各自是一种或多种选自除Pb离子和碱金属离子外的多种金属离子M,“A”是二价的,“B”是四价的,“Y”是三价的,或三价金属离子的组合,“Z”是二价的、三价的或五价的,其共同表示至少两种金属离子的组合。
2.权利要求1的陶瓷材料,其中
式(1)中的“ABO3”形成母体结构。
3.权利要求1的陶瓷材料,其中
式(1)中的“A”是Ba2+,或Ba2+与一种或多种选自多种金属离子M的组合。
4.权利要求1的陶瓷材料,其中
式(1)中的“B”是Ti4+,或Ti4+与一种或多种选自多种金属离子M的组合。
5.权利要求1的陶瓷材料,其中
该多种金属离子M包括二价金属离子MII,四价金属离子MIV,和五价金属离子MV,且
式(1)中的“B”是二价金属离子MII与四价金属离子MIV的组合,或二价金属离子MII与五价金属离子MV的组合。
6.权利要求1的陶瓷材料,其中
该多种金属离子M包括三价金属离子MIII
式(1)中的“Y”是Bi3+,或Bi3+与三价金属离子MIII的组合。
7.权利要求1的陶瓷材料,其中
该多种金属离子M包括二价金属离子MII,四价金属离子MIV,和五价金属离子MV,且
式(1)中的“Z”是二价金属离子MII与四价金属离子MIV的组合,或二价金属离子MII与五价金属离子MV的组合。
8.权利要求5的陶瓷材料,其中
该二价金属离子MII是一种或多种选自Mg2+、Ni2+和Zn2+的金属离子。
9.权利要求5的陶瓷材料,其中
该四价金属离子MIV是一种或多种选自Ti4+和Zr4+的金属离子。
10.权利要求5的陶瓷材料,其中
该五价金属离子MV是一种或多种选自Nb5+和Ta5+的金属离子。
11.权利要求7的陶瓷材料,其中
该二价金属离子MII是一种或多种选自Mg2+、Ni2+和Zn2+的金属离子。
12.权利要求7的陶瓷材料,其中
该四价金属离子MIV是一种或多种选自Ti4+和Zr4+的金属离子。
13.权利要求7的陶瓷材料,其中
该五价金属离子MV是一种或多种选自Nb5+和Ta5+的金属离子。
14.权利要求6的陶瓷材料,其中
该三价金属离子MIII是一种或多种选自La3+、Nd3+和Sm3+的金属离子。
15.权利要求1的陶瓷材料,其中
式(1)中的“A”是Ba2+,式(1)中的“B”是Ti4+,式(1)中的“Y”是Bi3+,式(1)中的“Z”是Mg2+与Nb5+的组合,式(1)中的“x”大于或等于0.1(x≥0.1)。
16.权利要求1的陶瓷材料,其中
式(1)中的“A”是Ba2+,式(1)中的“B”是Ti4+,式(1)中的“Y”是Bi3+,式(1)中的“Z”是Ni2+与Nb5+的组合,式(1)中的“x”大于或等于0.05且小于或等于0.5(0.05≤x≤0.5)。
17.权利要求16的陶瓷材料,其中
式(1)中的“x”大于或等于0.05,且Bi3+超过该陶瓷材料总量的5%。
18.权利要求1的陶瓷材料,其中
式(1)中的“A”是Ba2+,式(1)中的“B”是Ti4+,式(1)中的“Y”是Bi3+,式(1)中的“Z ”是Mg2+与Zr4+的组合,式(1)中的“x”大于或等于0.2且小于或等于0.5(0.2≤x≤0.5)。
19.权利要求1的陶瓷材料,其中
式(1)中的“A”是Ba2+,式(1)中的“B  ”是Ti4+,式(1)中的“Y”是Bi3+,式(1)中的“Z”是Zn2+与Zr4+的组合,式(1)中的“x”大于或等于0.2且小于或等于0.5(0.2≤x≤0.5)。
20.权利要求1的陶瓷材料,其中
该多种金属离子M由以下离子组成:Ba2+、Mg2+、Ni2+、Zn2+、Bi3+、La3+、Nd3+、Sm3+、Ti4+、Zr4+、Nb5+和Ta5+
21.一种电容器,其包括由权利要求1-20之一的陶瓷材料制得的介电层。
22.权利要求21的电容器,其还包括更多的介电层和多个内电极层,其中该介电层和该内电极层交替堆叠。
23.权利要求22的电容器,其中该多个内电极层包括导电的Ni、Ti或Ni-Ti合金。
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