CN101920476B - Chemical mechanical polishing equipment and conveying method of grinding fluid thereof - Google Patents
Chemical mechanical polishing equipment and conveying method of grinding fluid thereof Download PDFInfo
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- CN101920476B CN101920476B CN2009100574081A CN200910057408A CN101920476B CN 101920476 B CN101920476 B CN 101920476B CN 2009100574081 A CN2009100574081 A CN 2009100574081A CN 200910057408 A CN200910057408 A CN 200910057408A CN 101920476 B CN101920476 B CN 101920476B
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Abstract
The invention discloses chemical mechanical polishing equipment which comprises a grinding head pressurization device, a rotary motor, a grinding head translational sliding rail, a fixing ring, a grinding head, a silicon slice retaining ring, a silicon slice, a grinding pad, a grinding table and a grinding fluid conveying device, wherein, the grinding head is equipped with a grinding fluid conveyor; one end of the grinding fluid conveyor is communicated with a pipeline of the grinding fluid conveying device, and the other end of the grinding fluid conveyor leads to the edge of the silicon slice retaining ring; and an outlet of the grinding fluid conveyor is arranged at one side of the silicon slice. In the invention, the grinding fluid conveyor is arranged between the grinding fluid conveying device and the grinding table and positioned on the grinding head, so grinding fluid can synchronously translate with the grinding head and the silicon slice together to improve conveying efficiency of medicine liquid, and the grinding fluid can be conveyed to the edge of the silicon slice retaining ring of the grinding head to improve grinding uniformity of the silicon slice, thus further enhancing the grinding quality. The invention further discloses a conveying method of the grinding fluid of the chemical mechanical polishing equipment.
Description
Technical field
The present invention relates to a kind of semiconductor production equipment, be specifically related to a kind of chemical-mechanical polisher.The invention still further relates to a kind of conveying method of grinding fluid of chemical-mechanical polisher.
Background technology
CMP (Chemical Mechanical Polishing) is the equipment that carries out CMP process in the semicon industry.Typical C MP equipment as shown in Figure 1, silicon chip 7 is fixed in the bottom of grinding head 5 by silicon chip retaining ring 6, the top of grinding head 5 is provided with grinding head pressue device 1, grinding head pressue device 1 is provided with rotation motor 2, grinding head 5 is connected on the rotation terminal of grinding head pressue device 1 by retainer ring 4, grinding head pressue device 1 is arranged in the grinding head translation slide rail 3, and grinding head translation slide rail 3 is along the radial direction setting of grinding table 9.The below of grinding head 5 is provided with grinding table 9, and the upper surface of grinding table 9 is provided with grinding pad 8.
The operation principle of this CMP equipment is: rotation motor 2 drives grinding head pressue device 1, makes grinding head pressue device 1 rotation on one side, on one side translation back and forth on grinding head translation slide rail 3; Grinding head pressue device 1 drives retainer ring 4, grinding head 5 and silicon chip 7 thereupon and together moves, and grinding head pressue device 1 grinds silicon chip 7 by 5 pairs of silicon chip 7 back sides pressurizations of grinding head on grinding pad 8 simultaneously.Provide lapping liquid by grinding fluid conveying device 10 during grinding.
In the existing C MP equipment, the method that the conveying of chemical grinding liquid adopts fixed point to carry, promptly a grinding fluid conveying device 10 is placed at certain place, fixed position above grinding table 9, in the time of grinding table 9 rotations, grinding fluid conveying device 10 is carried soups to grinding table 9, and the rotation by grinding table 9 evenly distributes lapping liquid on grinding pad 8.The method of this conveying chemical grinding liquid is fairly simple, but have certain drawback: since process of lapping in silicon chip 7 in grinding table 9 upper edge radial direction translations back and forth, and the transfer position of lapping liquid immobilizes, then silicon chip 7 is near when far away when grinding fluid conveying device 10, therefore exists the waste of a certain amount of lapping liquid and silicon chip 7 to grind the bad problem of homogeneity.
Summary of the invention
Technical problem to be solved by this invention provides a kind of chemical-mechanical polisher, and it can improve the grinding effect of silicon chip.
For solving the problems of the technologies described above, the technical solution of chemical-mechanical polisher of the present invention is:
Grinding head pressue device, rotation motor, grinding head translation slide rail, retainer ring, grinding head, silicon chip retaining ring, silicon chip, grinding pad, grinding table, grinding fluid conveying device; Silicon chip is fixed in the bottom of grinding head by the silicon chip retaining ring, the top of grinding head is provided with the grinding head pressue device, the grinding head pressue device is provided with rotation motor, grinding head is connected on the rotation terminal of grinding head pressue device by retainer ring, the grinding head pressue device is arranged in the grinding head translation slide rail, the below of grinding head is provided with grinding table, and the upper surface of grinding table is provided with grinding pad; Described grinding head is provided with the lapping liquid conveyer, and an end of lapping liquid conveyer and the pipeline connection of grinding fluid conveying device, the other end of lapping liquid conveyer lead to silicon chip retaining ring edge, and the outlet of lapping liquid conveyer is arranged at a side of silicon chip.
Described lapping liquid conveyer is arranged at grinding head inside.
Described lapping liquid conveyer connects grinding fluid conveying device by the pipeline in the grinding head pressue device.
Be connected by 3/8inch two pass joints of making by the PFA material of antiacid alkali resistant between pipeline in the described grinding head pressue device and the pipeline of grinding fluid conveying device.
Described lapping liquid conveyer adopts the PFA materials processing of antiacid alkali resistant to form.
The present invention also provides a kind of conveying method of grinding fluid of chemical-mechanical polisher, and its technical solution is:
Grinding fluid conveying device is moved to grinding head pressue device top, and the pipeline of grinding fluid conveying device is communicated with pipeline one end in the grinding head pressue device; The other end of pipeline is communicated to silicon chip retaining ring edge by the lapping liquid conveyer in the grinding head pressue device; Grinding fluid conveying device by pipeline, lapping liquid conveyer in the grinding head pressue device, is transported to a side of silicon chip with lapping liquid.
The technique effect that the present invention can reach is:
The present invention is provided with the lapping liquid conveyer between grinding fluid conveying device and grinding table, and the lapping liquid conveyer is arranged on the grinding head, in the process of lapping, lapping liquid conveyer and grinding head are in grinding head translation slide rail inter-sync campaign, and the lapping liquid that grinding fluid conveying device is carried forms a kind of dynamic course of conveying along with grinding head and the synchronous translation of silicon chip, can improve the soup transfer efficiency, the lapping liquid that avoids waste is saved the lapping liquid use amount in a large number, increases the service efficiency of lapping liquid.
The present invention is arranged at a side of silicon chip with the outlet of lapping liquid conveyer, lapping liquid can be transported to the silicon chip retaining ring edge of grinding head, can realize carrying lapping liquid from the silicon chip proximal most position.Because the position of lapping liquid input is near more from silicon chip, grinding rate is high more, and homogeneity is good more, so the present invention can improve the grinding homogeneity of silicon chip, thereby improves Grinding Quality.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments:
Fig. 1 is the structural representation of existing chemical-mechanical polisher;
Fig. 2 is the structural representation of chemical-mechanical polisher of the present invention.
Description of reference numerals among the figure:
1 is the grinding head pressue device, and 2 is rotation motor, and 3 is grinding head translation slide rail,
4 is retainer ring, and 5 is grinding head, and 6 is the silicon chip retaining ring,
7 is silicon chip, and 8 is grinding pad, and 9 is grinding table,
10 is grinding fluid conveying device, and 11 is the lapping liquid conveyer.
The specific embodiment
As shown in Figure 2, chemical-mechanical polisher of the present invention comprises grinding head pressue device 1, rotation motor 2, grinding head translation slide rail 3, retainer ring 4, grinding head 5, silicon chip retaining ring 6, silicon chip 7, grinding pad 8, grinding table 9, grinding fluid conveying device 10; Silicon chip 7 is fixed in the bottom of grinding head 5 by silicon chip retaining ring 6, the top of grinding head 5 is provided with grinding head pressue device 1, grinding head pressue device 1 is provided with rotation motor 2, grinding head 5 is connected on the rotation terminal of grinding head pressue device 1 by retainer ring 4, grinding head pressue device 1 is arranged in the grinding head translation slide rail 3, and grinding head translation slide rail 3 is along the radial direction setting of grinding table 9.The below of grinding head 5 is provided with grinding table 9, and the upper surface of grinding table 9 is provided with grinding pad 8.
Be provided with lapping liquid conveyer 11 in the grinding head 5, one end of lapping liquid conveyer 11 is by the pipeline connection of the grinding fluid conveying device 10 of the pipeline in the grinding head pressue device 1 and its top, the other end leads to silicon chip retaining ring 6 edges by grinding head 5 inside, and the outlet of lapping liquid conveyer 11 is arranged at a side of silicon chip 7.
Lapping liquid conveyer 11 adopts the PFA materials processing of antiacid alkali resistant, and the diameter of lapping liquid conveyer 11 is 10mm.
Height H=the 550mm of pipeline in the grinding head pressue device 1, pipeline diameter is 10mm.
Lapping liquid is transported to a side of silicon chip 7, i.e. silicon chip retaining ring 6 edges of grinding head 5 by pipeline, lapping liquid conveyer 11 in grinding fluid conveying device 10, the grinding head pressue device 1.
Be connected by 3/8inch two pass joints of making by the PFA material of antiacid alkali resistant between pipeline in the grinding head pressue device 1 and the pipeline of grinding fluid conveying device 10.
The conveying method of grinding fluid of chemical-mechanical polisher of the present invention, adopt following method to carry lapping liquid:
Grinding fluid conveying device 10 is moved to the top of grinding head pressue device 1, and the pipeline of grinding fluid conveying device 10 is communicated with pipeline one end in the grinding head pressue device 1; The other end of pipeline is communicated to silicon chip retaining ring 6 edges by lapping liquid conveyer 11 in the grinding head pressue device 1; Grinding fluid conveying device 10 by pipeline, lapping liquid conveyer 11 in the grinding head pressue device 1, is transported to a side of silicon chip 7 with lapping liquid.
Claims (6)
1. a chemical-mechanical polisher comprises grinding head pressue device, rotation motor, grinding head translation slide rail, retainer ring, grinding head, silicon chip retaining ring, silicon chip, grinding pad, grinding table, grinding fluid conveying device; Silicon chip is fixed in the bottom of grinding head by the silicon chip retaining ring, the top of grinding head is provided with the grinding head pressue device, the grinding head pressue device is provided with rotation motor, grinding head is connected on the rotation terminal of grinding head pressue device by retainer ring, the grinding head pressue device is arranged in the grinding head translation slide rail, the below of grinding head is provided with grinding table, and the upper surface of grinding table is provided with grinding pad;
It is characterized in that: described grinding head is provided with the lapping liquid conveyer, one end of lapping liquid conveyer and the pipeline connection of grinding fluid conveying device, the other end of lapping liquid conveyer leads to silicon chip retaining ring edge, and the outlet of lapping liquid conveyer is arranged at a side of silicon chip;
Described lapping liquid conveyer is arranged on the grinding head, and in the process of lapping, lapping liquid conveyer and grinding head are in grinding head translation slide rail inter-sync campaign.
2. chemical-mechanical polisher according to claim 1 is characterized in that: described lapping liquid conveyer is arranged at grinding head inside.
3. chemical-mechanical polisher according to claim 2 is characterized in that: described lapping liquid conveyer connects grinding fluid conveying device by the pipeline in the grinding head pressue device.
4. chemical-mechanical polisher according to claim 3 is characterized in that: be connected by 3/8inch two pass joints of being made by the PFA material of antiacid alkali resistant between the pipeline in the described grinding head pressue device and the pipeline of grinding fluid conveying device.
5. chemical-mechanical polisher according to claim 1 is characterized in that: described lapping liquid conveyer adopts the PFA materials processing of antiacid alkali resistant to form.
6. the conveying method of grinding fluid of the described chemical-mechanical polisher of claim 1 is characterized in that:
Grinding fluid conveying device is moved to grinding head pressue device top, and the pipeline of grinding fluid conveying device is communicated with pipeline one end in the grinding head pressue device; The other end of pipeline is communicated to silicon chip retaining ring edge by the lapping liquid conveyer in the grinding head pressue device; Grinding fluid conveying device by pipeline, lapping liquid conveyer in the grinding head pressue device, is transported to a side of silicon chip with lapping liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2009100574081A CN101920476B (en) | 2009-06-11 | 2009-06-11 | Chemical mechanical polishing equipment and conveying method of grinding fluid thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009100574081A CN101920476B (en) | 2009-06-11 | 2009-06-11 | Chemical mechanical polishing equipment and conveying method of grinding fluid thereof |
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| CN101920476A CN101920476A (en) | 2010-12-22 |
| CN101920476B true CN101920476B (en) | 2011-12-14 |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152218A (en) * | 2010-12-30 | 2011-08-17 | 青岛嘉星晶电科技股份有限公司 | Wafer polishing device |
| CN102513906B (en) * | 2011-12-20 | 2013-10-09 | 元亮科技有限公司 | Sapphire substrate polishing process |
| CN103056780B (en) * | 2013-01-23 | 2016-02-24 | 王敬达 | The method and apparatus of swivel joint conveying liquid abrasive material |
| CN103551959A (en) * | 2013-10-31 | 2014-02-05 | 桂林福冈新材料有限公司 | Grinding fluid distribution arm |
| CN103586754B (en) * | 2013-11-26 | 2015-11-11 | 厦门大学 | A kind of optical element burnishing device |
| CN103831700B (en) * | 2014-03-14 | 2017-05-17 | 天津大学 | Fluid dynamic pressure half-contact solidification material grinding and polishing device |
| CN106891229A (en) * | 2017-04-02 | 2017-06-27 | 长葛市老城昌宝建筑机械配件厂 | A kind of polishing device of stainless-steel pipe |
| CN109822454B (en) * | 2019-03-27 | 2023-11-10 | 西南交通大学 | Green energy-saving polishing head device of self-powered ultraviolet light source of modularized design |
| CN109866084A (en) * | 2019-04-08 | 2019-06-11 | 北京建筑大学 | A kind of UV photocatalysis assistant chemical mechanical polishing apparatus and polishing method |
| CN211388245U (en) * | 2019-12-03 | 2020-09-01 | 郑州合晶硅材料有限公司 | Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process |
| WO2023083374A1 (en) * | 2021-11-15 | 2023-05-19 | Comptake Technology Inc. | System and method of thinning wafer substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1897226A (en) * | 2005-07-11 | 2007-01-17 | 上海华虹Nec电子有限公司 | Mechamical polisher |
| CN101121239A (en) * | 2006-08-07 | 2008-02-13 | 上海华虹Nec电子有限公司 | Chemical and mechanical grinding bench chemical liquid supplying device |
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- 2009-06-11 CN CN2009100574081A patent/CN101920476B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1897226A (en) * | 2005-07-11 | 2007-01-17 | 上海华虹Nec电子有限公司 | Mechamical polisher |
| CN101121239A (en) * | 2006-08-07 | 2008-02-13 | 上海华虹Nec电子有限公司 | Chemical and mechanical grinding bench chemical liquid supplying device |
Non-Patent Citations (2)
| Title |
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| JP特开2001-269862A 2001.10.02 |
| JP特开2004-349875A 2004.12.09 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131218 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20131218 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |