CN211388245U - Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process - Google Patents
Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process Download PDFInfo
- Publication number
- CN211388245U CN211388245U CN201922134728.4U CN201922134728U CN211388245U CN 211388245 U CN211388245 U CN 211388245U CN 201922134728 U CN201922134728 U CN 201922134728U CN 211388245 U CN211388245 U CN 211388245U
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- Prior art keywords
- coagulation
- resisting
- pipeline
- polishing
- fixing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model belongs to the technical field of semiconductor processing equipment, concretely relates to wax mouth moisturizing device for polishing equipment in silicon chip polishing course of working. The device includes: a coagulation-resisting pipeline connected with a coagulation-resisting liquid holding container and a fixed bracket for fixing the coagulation-resisting pipeline; the coagulation-resisting liquid containing container is used for containing coagulation-resisting liquid flowing out of the coagulation-resisting pipeline at the contact position of the coagulation-resisting pipeline and a wax nozzle of the polishing equipment; one end of the anti-condensation pipeline is connected with a wax nozzle of the polishing equipment, and the other end of the anti-condensation pipeline is connected with an anti-condensation liquid conveying pipeline; the fixed bolster includes: the vertical fixing base, the horizontal fixing support and the coagulation-resisting pipe fixing frame. The wax nozzle moisturizing device designed by the application better achieves the purpose of moisturizing the wax nozzle and improves the phenomena of solidification, blockage and the like of the mouth of the wax nozzle caused by long-time shutdown; the method has good practical value for ensuring the waxing uniformity in the silicon wafer polishing process and improving the polishing yield.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing equipment, concretely relates to wax mouth moisturizing device for polishing equipment in silicon chip polishing course of working.
Background
As a basic production raw material for semiconductor processing, polishing treatment of a silicon wafer is an essential processing step for subsequent processing production. One of the main purposes of silicon wafer polishing is to make the surface of the silicon wafer flat enough, so the flatness after polishing is one of the main indexes of the silicon wafer polishing processing.
In the prior art, when polishing a silicon wafer, the silicon wafer needs to be fixed first and then polished by using polishing equipment. The common silicon wafer fixing modes include a mechanical clamping mode, a paraffin bonding mode, a hydraulic adsorption mode and the like, wherein the mechanical clamping mode has a limited application range due to inevitable potential deformation damage to the silicon wafer, the hydraulic adsorption mode has a limited application range due to the production cost, complexity and the like, and the paraffin bonding mode is the most common silicon wafer fixing mode applied at present due to the convenience and the like.
When the silicon wafer is polished in a paraffin bonding mode, the main process is as follows: the method comprises the steps of firstly placing a silicon wafer at a specified position on a clamp, then infiltrating molten paraffin between the silicon wafer and the clamp (only supplying the necessary amount for not floating the silicon wafer), then pressurizing a workpiece to enable the paraffin to bond and fix the silicon wafer on a ceramic plate flatly, and further polishing the front side of the silicon wafer by using polishing equipment. However, in the actual processing and application process, due to various reasons such as maintenance, maintenance and replacement, the polishing equipment has different downtime, and if the polishing equipment is halted for a long time, the production environment temperature is low, and the paraffin solidification phenomenon inevitably occurs at the paraffin nozzle for spraying the paraffin, so that the solidified paraffin at the paraffin nozzle needs to be frequently cleaned, otherwise, the paraffin is easily coated unevenly, and further, the poor bonding or the reduction of the flatness of the silicon wafer during polishing is caused, and the production capacity and the product yield are finally influenced. Therefore, if the wax nozzle device can be improved to a certain extent, the method has better application significance for ensuring the stability of subsequent silicon wafer processing and the quality of the silicon wafer.
Disclosure of Invention
The application aims to provide a wax nozzle moisturizing device for polishing equipment in a silicon wafer polishing process, which can establish a certain technical foundation for the stability of the silicon wafer polishing quality.
The technical solution adopted in the present application is detailed as follows.
A wax nozzle moisturizing device for polishing equipment in a silicon wafer polishing process comprises: a coagulation-resisting pipeline connected with a coagulation-resisting liquid holding container and a fixed bracket for fixing the coagulation-resisting pipeline;
the coagulation-inhibiting liquid, which is intended to prevent the coagulation of a binder such as a wax (more particularly a paraffin wax for example), is generally composed of NH as the main component4OH、H2O2And the like;
the anti-coagulation liquid containing container is used for containing anti-coagulation liquid flowing out of an anti-coagulation pipeline at the joint of the anti-coagulation liquid containing container and a wax nozzle of the polishing equipment; in the preferred design, an adsorbing material (such as sponge) for adsorbing the coagulation-resisting liquid is arranged in the containing container, and the adsorbing material is contacted with the wax nozzle, so that the consumption of the coagulation-resisting liquid during the coagulation-resisting wax nozzle can be reduced, and the overflowing of the coagulation-resisting liquid and the pollution to the operating environment can be avoided;
one end of the anti-condensation pipeline is connected with a wax nozzle of the polishing equipment, and the other end of the anti-condensation pipeline is connected with an anti-condensation liquid conveying pipeline and used for conveying anti-condensation liquid; in the actual design, the coagulation-resisting pipeline is made of 1/4 PFA; in the preferred design, an 1/4 ball valve for controlling the flow of the anti-coagulation liquid is designed on the anti-coagulation pipeline;
the polishing apparatus is typically a single-side polishing apparatus;
the fixed bolster includes: the vertical fixing base, the transverse fixing bracket and the coagulation resistance tube fixing bracket are arranged on the vertical fixing base;
the vertical fixing base is of an L-shaped structure and is used for integrally fixing the device on the table top, and in the preferred design, a transverse plate used for fixing the vertical fixing base on the table top and a vertical plate used for fixing the transverse fixing support are both designed to be of a U-shaped groove structure so as to be convenient for adjusting the fixing position;
the horizontal fixing support is in an L-shaped structure which is in a right-angle connection relationship with the vertical fixing base, the vertical arm of the horizontal fixing support is detachably connected with the vertical fixing base (for example, realized through a bolt), and the cross arm of the horizontal fixing support is detachably connected with the coagulation-resisting pipe fixing frame (for example, realized through a bolt); in the preferred design, the cross arm is also designed in a U-shaped groove structure, so that the distance between the coagulation-resisting pipe and the polishing equipment can be adjusted in the transverse direction;
the coagulation-resisting pipe fixing frame is an L-shaped structure which is in a right-angle connection relationship with the transverse fixing support, a coagulation-resisting pipeline is fixed on a vertical panel of the coagulation-resisting pipe fixing frame, and the transverse panel of the coagulation-resisting pipe fixing frame is detachably connected with the transverse fixing support (for example, realized through bolts); in the preferred design, the horizontal panel also adopts "U" shape groove type structural design to be convenient for adjust the regulation of hindering congealing pipeline and polishing equipment wax mouth distance in different dimensions direction.
The wax mouth device of moisturizing that this application designed, its structure is succinct, convenient to use, has better realized the target that the wax mouth moisturized on the one hand, has improved and has shut down the phenomenon such as the wax mouth of pipe solidification that causes for a long time, jam, and on the other hand has better practical value to guaranteeing to scribble the wax homogeneity in the silicon chip polishing course of working, improving the polishing yield, and the device preparation cost that provides in addition this application is comparatively cheap, is convenient for maintain, therefore has better popularization and application meaning.
Drawings
Fig. 1 is a schematic structural view of a wax nozzle moisturizing device provided by the present application.
Detailed Description
The present application is further illustrated by the following examples.
Examples
As shown in fig. 1, the wax nozzle moisturizing device for polishing equipment in the silicon wafer polishing process provided by the present application comprises: a coagulation-resisting pipeline 8 connected with a coagulation-resisting liquid container and a fixed bracket for fixing the coagulation-resisting pipeline.
The set-inhibiting liquid, which is intended to inhibit the setting of a binding agent such as a wax (more particularly a paraffin wax), is generally constituted by NH4OH、H2O2And the like.
The anti-condensation liquid holding container (not shown in the figure) is used for holding anti-condensation liquid flowing out of an anti-condensation pipeline 8 at a wax nozzle connecting part 6 of the polishing equipment; in the actual design, be equipped with the adsorption material (adsorption material for example for the sponge) that adsorbs the condensate that hinders in holding the container, through adsorption material and wax mouth contact, hinder the condensate quantity when can reducing on the one hand and hinder the wax mouth, on the other hand can avoid hindering excessive and the pollution to the operation environment of condensate.
One end of the coagulation-resisting pipeline 8 is connected with a wax nozzle of the polishing equipment (namely, the position marked 6 in the figure is directly contacted with the wax nozzle), and the other end of the coagulation-resisting pipeline is connected with a coagulation-resisting liquid conveying pipeline (not shown in the figure) and used for conveying coagulation-resisting liquid; in the actual design, the coagulation-resisting pipeline is made of 1/4 PFA; in the preferred design, an 1/4 ball valve for controlling the flow of the anti-coagulation liquid is designed on the anti-coagulation pipeline;
the polishing apparatus is typically a single-side polishing apparatus.
The fixed bolster includes: the vertical fixing base 2, the horizontal fixing support 3 and the coagulation-resisting pipe fixing frame 5;
the vertical fixing base 2 is of an L-shaped structure and is used for integrally fixing the device on the table top, and in the preferred design, a transverse plate 1 used for fixing the vertical fixing base on the table top and a vertical plate used for fixing a transverse fixing support are both designed to be of a U-shaped groove structure so as to be convenient for adjusting the fixing position;
the transverse fixing bracket 3 is an L-shaped structure which is in a right-angle connection relationship with the vertical fixing base, a vertical arm of the transverse fixing bracket is detachably connected with the vertical fixing base (for example, realized by a bolt), and a cross arm 9 of the transverse fixing bracket is detachably connected with the coagulation-resisting pipe fixing frame (for example, realized by a bolt); in the preferred design, the cross arm 9 also adopts a U-shaped groove structure design, so that the distance between the coagulation-resisting pipe and the polishing equipment can be adjusted in the transverse direction;
the coagulation-resisting pipe fixing frame 5 is an L-shaped structure which is in a right-angle connection relationship with the transverse fixing support, a coagulation-resisting pipeline is fixed on a vertical panel 7 (it needs to be explained that an additional vertical panel design is adopted in the drawing, so that the displacement adjustment in the vertical direction is further realized, but in the actual design, the coagulation-resisting pipe can be directly fixed on the vertical panel), and the transverse panel 4 is detachably connected with the transverse fixing support (for example, realized through bolts); in the preferred design, the horizontal panel also adopts "U" shape groove type structural design to be convenient for adjust the regulation of hindering congealing pipeline and polishing equipment wax mouth distance in different dimensions direction.
Can find out through above-mentioned structural design, the wax mouth moisturizing device that this application provided can realize the displacement of a plurality of angles such as horizontal, vertical, inside and outside and adjust to can adapt to different operation environment, satisfy the wax mouth needs of moisturizing, consequently have better practical value.
Claims (8)
1. The utility model provides a wax mouth device of moisturizing for polishing equipment in silicon chip polishing course of working which characterized in that, the device includes: a coagulation-resisting pipeline connected with a coagulation-resisting liquid holding container and a fixed bracket for fixing the coagulation-resisting pipeline;
the coagulation-resisting liquid containing container is used for containing coagulation-resisting liquid flowing out of the coagulation-resisting pipeline at the contact position of the coagulation-resisting pipeline and a wax nozzle of the polishing equipment;
one end of the anti-condensation pipeline is connected with a wax nozzle of the polishing equipment, and the other end of the anti-condensation pipeline is connected with an anti-condensation liquid conveying pipeline;
the fixed bolster includes: the vertical fixing base, the transverse fixing bracket and the coagulation resistance tube fixing bracket are arranged on the vertical fixing base;
wherein the vertical fixed base is of an L-shaped structure and is used for integrally fixing the device on the table-board;
the horizontal fixed support is an L-shaped structure which is in a right-angle connection relationship with the vertical fixed base, a vertical arm of the horizontal fixed support is detachably connected with the vertical fixed base, and a cross arm of the horizontal fixed support is detachably connected with the coagulation-resisting pipe fixed frame;
the anti-coagulation tube fixing frame is an L-shaped structure which is in a right-angle connection relation with the transverse fixing support, a coagulation blocking pipeline is fixed on the vertical panel of the anti-coagulation tube fixing frame, and the transverse panel of the anti-coagulation tube fixing frame is detachably connected with the transverse fixing support.
2. The device for moisturizing a wax nozzle for polishing equipment during a silicon wafer polishing process as claimed in claim 1, wherein an adsorbing material for adsorbing the coagulation-inhibiting liquid is provided in the container.
3. The device for moisturizing a wax nozzle of polishing equipment in a silicon wafer polishing process as recited in claim 1, wherein the anti-condensation pipeline is made of 1/4 PFA.
4. The device for moisturizing a wax nozzle for polishing equipment in a silicon wafer polishing process as claimed in claim 3, wherein the anti-coagulating pipe is designed with an 1/4 ball valve for controlling the flow of the anti-coagulating liquid.
5. The device for moisturizing a wax nozzle for polishing equipment in the silicon wafer polishing process as claimed in claim 1, wherein the horizontal plate for fixing the vertical fixing base on the table top and the vertical plate for fixing the horizontal fixing support are designed to have a U-shaped groove structure.
6. The device for moisturizing a wax nozzle for polishing equipment during a silicon wafer polishing process as claimed in claim 1, wherein the cross arm of the transverse fixing bracket is designed in a "U" -shaped groove structure.
7. The device for moisturizing a wax nozzle of polishing equipment during the polishing process of silicon wafers as claimed in claim 1, wherein the transverse panel of the coagulation-preventing tube holder is designed to have a U-shaped groove structure.
8. The device for moisturizing a wax nozzle for polishing equipment in a silicon wafer polishing process according to claim 1, wherein the polishing equipment is single-side polishing equipment.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922134728.4U CN211388245U (en) | 2019-12-03 | 2019-12-03 | Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process |
| PCT/CN2020/117980 WO2021109693A1 (en) | 2019-12-03 | 2020-09-27 | Wax nozzle moisturizing apparatus for polishing device during polishing process of silicon wafer |
| TW109215900U TWM609202U (en) | 2019-12-03 | 2020-12-01 | Wax nozzle moisturizing device for polishing equipment during silicon wafer polishing processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922134728.4U CN211388245U (en) | 2019-12-03 | 2019-12-03 | Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211388245U true CN211388245U (en) | 2020-09-01 |
Family
ID=72229301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922134728.4U Active CN211388245U (en) | 2019-12-03 | 2019-12-03 | Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN211388245U (en) |
| TW (1) | TWM609202U (en) |
| WO (1) | WO2021109693A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021109693A1 (en) * | 2019-12-03 | 2021-06-10 | 郑州合晶硅材料有限公司 | Wax nozzle moisturizing apparatus for polishing device during polishing process of silicon wafer |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002001165A (en) * | 2000-06-26 | 2002-01-08 | Fuji Photo Film Co Ltd | Centrifuge and method for manufacturing base for planographic printing plate |
| JP2003111966A (en) * | 2001-10-03 | 2003-04-15 | J Box:Kk | Polishing cleaner for ball body |
| CN101920476B (en) * | 2009-06-11 | 2011-12-14 | 上海华虹Nec电子有限公司 | Chemical mechanical polishing equipment and conveying method of grinding fluid thereof |
| CN201728595U (en) * | 2010-04-29 | 2011-02-02 | 武汉新芯集成电路制造有限公司 | Polishing liquid supply device |
| CN208018809U (en) * | 2018-02-05 | 2018-10-30 | 清华大学 | The Hydra sprayer of CMP tool chamber |
| CN209600070U (en) * | 2018-12-27 | 2019-11-08 | 广州瓦良格机器人科技有限公司 | A kind of moisturizing device of high temp glass digital ink-jet ink-jet head of printer |
| CN211388245U (en) * | 2019-12-03 | 2020-09-01 | 郑州合晶硅材料有限公司 | Wax nozzle moisturizing device for polishing equipment in silicon wafer polishing process |
-
2019
- 2019-12-03 CN CN201922134728.4U patent/CN211388245U/en active Active
-
2020
- 2020-09-27 WO PCT/CN2020/117980 patent/WO2021109693A1/en active Application Filing
- 2020-12-01 TW TW109215900U patent/TWM609202U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021109693A1 (en) * | 2019-12-03 | 2021-06-10 | 郑州合晶硅材料有限公司 | Wax nozzle moisturizing apparatus for polishing device during polishing process of silicon wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM609202U (en) | 2021-03-11 |
| WO2021109693A1 (en) | 2021-06-10 |
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