CN203843664U - Wafer two-sided lapping equipment - Google Patents
Wafer two-sided lapping equipment Download PDFInfo
- Publication number
- CN203843664U CN203843664U CN201420276319.2U CN201420276319U CN203843664U CN 203843664 U CN203843664 U CN 203843664U CN 201420276319 U CN201420276319 U CN 201420276319U CN 203843664 U CN203843664 U CN 203843664U
- Authority
- CN
- China
- Prior art keywords
- lapping
- grinding
- abrasive disk
- plate
- cooling fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses wafer two-sided lapping equipment which comprises a lapping plate. A first drive device is arranged at the center of the bottom of the lapping plate. A sliding block is arranged at the bottom of the first drive device. The sliding block is mounted on a sliding rail. Lapping cloth is arranged on the upper surface of the lapping plate. A lapping head and a lapping compound supply device are arranged above the lapping plate. A second drive device is arranged at the center of the upper portion of the lapping head. A liner is connected to the bottom of the lapping head though a telescopic strut. A limit ring is arranged on the circumference of the bottom of the lapping head. A workpiece is arranged in a closed space defined by the limit ring, the liner and the lapping plate. A cooling liquid recovery plate and a cooling liquid supply plate are sequentially stacked above the lapping head. The cooling liquid supply plate is connected with an output pipe through an output pump. The other end of the output pipe is connected with a cooling channel arranged in the limit ring. The cooling channel is further connected to the cooling liquid recovery plate through a return pipe. The cooling liquid recovery plate and the cooling liquid supply plate are communicated through a pipeline. By means of the wafer two-sided lapping equipment, the temperature surrounding the limit ring is lowered, and lapping uniformity is guaranteed.
Description
Technical field
The utility model relates to workpiece milling apparatus technical field, relates in particular to a kind of wafer twin grinding equipment.
Background technology
Wafer refers to the silicon wafer that silicon semiconductor production of integrated circuits is used, because it is shaped as circle, therefore be called wafer; On silicon wafer, can manufacture various circuit component structures, have the IC of certain electric sexual function product and become.
The non-uniform temperature of the wafer of prior art in process of lapping, concrete reason is the spacing ring of grinding head and grinding pad fricative heat repeatedly in process of lapping, and making has largely and rise near the central area of the relative wafer of neighboring area temperature of the wafer of grinding pad.High temperature can cause the performance of material surface to change, and grinding agent also has different reaction rates under different temperatures, causes workpiece in uneven thickness in the time grinding.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of wafer twin grinding equipment, with the wafer twin grinding equipment that solves prior art problem in uneven thickness in the time grinding.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of wafer twin grinding equipment, comprise abrasive disk, place of described abrasive disk bottom centre is provided with drive unit one, described drive unit one bottom is provided with slide block, described slide block is installed on slide rail, described abrasive disk upper surface is provided with abrasive cloth, described abrasive disk top is provided with grinding head and grinding agent feedway, described grinding head central upper portion place is provided with drive unit two, described grinding head bottom is connected with liner by telescopic strut, border, described grinding head bottom is provided with spacing ring, described spacing ring, in the enclosure space that liner and abrasive disk surround, be provided with workpiece, described grinding head top is folded cooling fluid recovering tray and the cooling fluid supply dish of being provided with successively, described cooling fluid supply dish connects an efferent duct by rear pump, the described efferent duct other end is connected at the cooling duct in spacing ring, on described cooling duct, be also connected to cooling fluid recovering tray by return duct, described cooling fluid recovering tray and cooling fluid supply dish pass through pipeline communication.
Adopt above structure compared with prior art, the utlity model has following advantage: the spacing between telescopic strut adjustable cushion and abrasive disk, thus be applicable to the workpiece of different-thickness; Adopt rear pump that cooling fluid is flowed between cooling fluid supply dish, cooling duct and cooling fluid recovering tray, reduced spacing ring temperature around, make the temperature of wafer periphery in process of lapping keep balance, ensure the uniformity of grinding.
As preferably, the top surface edge place of described abrasive disk is provided with groove, and described groove is located at the circus movement track outside of grinding head.Because the top surface edge place at abrasive disk is provided with groove, when grinding head completes after grinding step workpiece, abrasive disk does rectilinear motion along guide rail, by workpiece alignment groove, thereby the vacuum adsorption force between workpiece and mill dish is disappeared, can avoid again the problem of easy loss grinding agent in process of lapping.
As preferably, described liner is provided with through hole in order to supply with grinding agent.From liner top, grinding agent is supplied with and entered in enclosed cavity, and coordinate the grinding head of rotation, can grind workpiece surface and sidewall, improved operating efficiency.
As preferably, the direction of rotation of described abrasive disk and grinding head is contrary.Contrary direction of rotation can improve grinding efficiency.
As preferably, the cross sectional shape of described cooling duct is any in circular, ellipse or rectangle.
Brief description of the drawings
Fig. 1 is the structural representation of wafer twin grinding equipment of the present utility model.
Fig. 2 is the structural representation of the grinding head of wafer twin grinding equipment of the present utility model.
Fig. 3 is the grinding trajectory schematic diagram of the head of milling of wafer twin grinding equipment of the present utility model.
Fig. 4 is that the workpiece motion s of wafer twin grinding equipment of the present utility model is to the schematic diagram of groove top.
Shown in figure: 1, abrasive disk, 2, drive unit, 3, abrasive cloth, 4, grinding head, 5, grinding agent feedway, 6, liner, 7, spacing ring, 8, workpiece, 9, cooling fluid recovering tray, 10, cooling fluid supply dish, 11, rear pump, 12, efferent duct, 13, cooling duct, 14, return duct, 15, pipeline, 16, groove, 17, through hole, 18, slide block, 19, slide rail, 20, drive unit two.
Detailed description of the invention
Below in conjunction with drawings and Examples, detailed description of the invention of the present utility model is described in further detail.Following examples are used for illustrating the utility model, but are not used for limiting scope of the present utility model.
A kind of wafer twin grinding equipment, comprise abrasive disk 1, described abrasive disk 1 place of bottom centre is provided with motor, described motor bottom is provided with slide block 18, described slide block 18 is installed on slide rail 19, described abrasive disk 1 upper surface is provided with abrasive cloth 3, described abrasive disk 1 top is provided with grinding head 4 and grinding agent feedway 5, described grinding head 4 central upper portion places are provided with another motor in order to drive grinding head 4 around its axis rotation, described grinding head 4 bottoms are connected with liner 6 by telescopic strut, described grinding head 4 borders, bottom are provided with spacing ring 7, described spacing ring 7, in the enclosure space that liner 6 and abrasive disk 1 surround, be provided with workpiece 8, described grinding head 4 tops are folded cooling fluid recovering tray 9 and the cooling fluid supply dish 10 of being provided with successively, described cooling fluid supply dish 10 connects an efferent duct 12 by rear pump 11, described efferent duct 12 other ends are connected at the cooling duct 13 in spacing ring 7, on described cooling duct 13, be also connected to cooling fluid recovering tray 9 by return duct 14, described cooling fluid recovering tray 9 is communicated with by pipeline 15 with cooling fluid supply dish 10.
The top surface edge place of described abrasive disk 1 is provided with groove 16, and described groove 16 is located at the circus movement track outside of grinding head 4.Described liner 6 is provided with through hole 17 in order to supply with grinding agent.The direction of rotation of described abrasive disk 1 and grinding head 4 is contrary.The cross sectional shape of described cooling duct 13 is any in circle, ellipse or rectangle.
Operation principle of the present utility model is: workpiece is positioned over to spacing ring, in the enclosure space that liner and abrasive disk surround, telescopic strut regulates the thickness of enclosure space to adapt to workpiece, when grinding, grinding agent feedway supplies with grinding agent to respectively the through hole of liner and abrasive cloth, abrasive disk and grinding head rotate simultaneously workpiece are carried out to omnibearing grinding, because the top surface edge place at abrasive disk is provided with groove, when grinding head completes after grinding step workpiece, abrasive disk does rectilinear motion along guide rail, by workpiece alignment groove, thereby the vacuum adsorption force between workpiece and mill dish is disappeared, can avoid again the problem of easy loss grinding agent in process of lapping.In addition, adopt rear pump that cooling fluid is flowed between cooling fluid supply dish, cooling duct and cooling fluid recovering tray, reduced spacing ring temperature around, make the temperature of wafer periphery in process of lapping keep balance, ensure the uniformity of grinding.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (5)
1. a wafer twin grinding equipment, it is characterized in that: comprise abrasive disk (1), place of described abrasive disk (1) bottom centre is provided with drive unit one (2), described drive unit one (2) bottom is provided with slide block (18), described slide block (18) is installed on slide rail (19), described abrasive disk (1) upper surface is provided with abrasive cloth (3), described abrasive disk (1) top is provided with grinding head (4) and grinding agent feedway (5), described grinding head (4) central upper portion place is provided with drive unit two (20), described grinding head (4) bottom is connected with liner (6) by telescopic strut, border, described grinding head (4) bottom is provided with spacing ring (7), described spacing ring (7), in the enclosure space that liner (6) and abrasive disk (1) surround, be provided with workpiece (8), described grinding head (4) top is folded cooling fluid recovering tray (9) and the cooling fluid supply dish (10) of being provided with successively, described cooling fluid supply dish (10) connects an efferent duct (12) by rear pump (11), described efferent duct (12) other end is connected at the cooling duct (13) in spacing ring (7), on described cooling duct (13), be also connected to cooling fluid recovering tray (9) by return duct (14), described cooling fluid recovering tray (9) is communicated with by pipeline (15) with cooling fluid supply dish (10).
2. wafer twin grinding equipment according to claim 1, it is characterized in that: the top surface edge place of described abrasive disk (1) is provided with groove (16), described groove (16) is located at the circus movement track outside of grinding head (4).
3. wafer twin grinding equipment according to claim 2, is characterized in that: described liner (6) is provided with through hole (17) in order to supply with grinding agent.
4. wafer twin grinding equipment according to claim 3, is characterized in that: the direction of rotation of described abrasive disk (1) and grinding head (4) is contrary.
5. wafer twin grinding equipment according to claim 3, is characterized in that: the cross sectional shape of described cooling duct (13) is any in circle, ellipse or rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420276319.2U CN203843664U (en) | 2014-05-27 | 2014-05-27 | Wafer two-sided lapping equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420276319.2U CN203843664U (en) | 2014-05-27 | 2014-05-27 | Wafer two-sided lapping equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203843664U true CN203843664U (en) | 2014-09-24 |
Family
ID=51556722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420276319.2U Expired - Fee Related CN203843664U (en) | 2014-05-27 | 2014-05-27 | Wafer two-sided lapping equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203843664U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108687652A (en) * | 2018-05-29 | 2018-10-23 | 李涵 | A kind of semiconductor chip fabrication process |
| CN108747721A (en) * | 2018-05-29 | 2018-11-06 | 李涵 | A kind of semiconductor crystal wafer half refines, Refining apparatus |
-
2014
- 2014-05-27 CN CN201420276319.2U patent/CN203843664U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108687652A (en) * | 2018-05-29 | 2018-10-23 | 李涵 | A kind of semiconductor chip fabrication process |
| CN108747721A (en) * | 2018-05-29 | 2018-11-06 | 李涵 | A kind of semiconductor crystal wafer half refines, Refining apparatus |
| CN108747721B (en) * | 2018-05-29 | 2019-11-01 | 江苏锡沂高新区科技发展有限公司 | A kind of semiconductor crystal wafer partly fine grinding, Refining apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20150527 |
|
| EXPY | Termination of patent right or utility model |