CN103586754B - A kind of optical element burnishing device - Google Patents
A kind of optical element burnishing device Download PDFInfo
- Publication number
- CN103586754B CN103586754B CN201310608245.8A CN201310608245A CN103586754B CN 103586754 B CN103586754 B CN 103586754B CN 201310608245 A CN201310608245 A CN 201310608245A CN 103586754 B CN103586754 B CN 103586754B
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- CN
- China
- Prior art keywords
- polishing
- polishing fluid
- storage container
- fluid storage
- control valve
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/005—Blocking means, chucks or the like; Alignment devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
A kind of optical element burnishing device, relates to burnishing device.Be provided with polishing fluid storage container, control valve, bearing, rubbing head, humidity sensor, optical element fixture, polishing disk, protective cover, conduit, water pump, filter and shower nozzle; Polishing fluid storage container center is connected with between rubbing head main shaft; Establish three sections of arc openings bottom polishing fluid storage container, control valve is arranged on polishing fluid storage container bottom inside; Rubbing head upper surface contacts with polishing fluid storage container lower surface but does not fix, and in the corresponding polishing fluid storage container of rubbing head upper surface, groove is offered in the position of control valve, and 4 through holes are established in groove bottom; Distribution sensor around fixture; Inner uniform 4 drainage troughs of polishing disk, through hole is offered in the corresponding drainage trough position of polishing disk upper surface, and through hole connects polishing disk upper surface and drainage trough; Protective cover is connected with polishing disk main shaft; Be connected with tube at one end below protective cover, establish water pump and filter in conduit, the conduit other end is connected with shower nozzle, and shower nozzle is just to polishing pad.
Description
Technical field
The present invention relates to burnishing device, especially relate to a kind of optical element burnishing device effectively can saving polishing fluid.
Background technology
Along with the manufacturing fast development of contemporary optics and optical material application increasingly extensive, optical element surface quality is had higher requirement.Chemically mechanical polishing (chemicalmechanicalpolishing, CMP) technology carries out material removal by chemical action and mechanism to optical element, thus obtain smooth finish surface (Su Jianxiu, Guo Dongming, Kang Renke etc. during Wafer Chemical Mechanical Polishing, forms of motion is to impact analysis [J] heteropical in sheet. China Mechanical Engineering, 2005,9 (16): 815-818).Chemically mechanical polishing is widely used in super large-scale integration (ULSI) manufacture, become semiconductor processing industry realize the practical technique of silicon chip leveling and core technology (Dong Wei. chemical Mechanical Polishing Technique present Research and progress [J]. manufacturing technology and lathe, 2012, (07): 93-97).
Traditional chemical-mechanical polishing system is made up of a rotating polishing head, the polishing disk carrying polishing pad and polishing fluid feedway.Polishing fluid replenishing method existing in CMP process is: draw a conduit from polishing fluid feedway, be directly injected on polishing pad by polishing fluid.When using the method, a large amount of polishing fluid flows directly into polishing pad, and in polishing process, rubbing head drives optical element to rotate on polishing pad, and polishing disk also drives polishing pad to rotate, untapped polishing fluid may directly be thrown to beyond polishing pad by the centrifugal force produced, and causes great waste.Meanwhile, polishing fluid is from the supply of polishing disk side, and polishing fluid cannot be evenly distributed on surface of the work, affects workpiece processing quality.
Summary of the invention
The object of the invention is to easily cause polishing fluid to waste and surface of the work polishing fluid problem pockety for traditional polishing fluid adding method, there is provided and effectively can save polishing fluid, and realize polishing fluid and be uniformly distributed, effectively improve a kind of optical element burnishing device of polishing fluid utilization rate.
The present invention is provided with polishing fluid storage container, control valve, bearing, rubbing head, humidity sensor, optical element fixture, polishing disk, protective cover, conduit, water pump, filter and shower nozzle; The in-built polishing fluid of described polishing fluid storage container, polishing fluid storage container center is connected by bearing with between rubbing head main shaft, does not drive the rotation of polishing fluid storage container when rubbing head main shaft rotates; Polishing fluid storage container bottom even distributes three sections of arc openings, and control valve is arranged on polishing fluid storage container bottom inside, and control valve is controlled by humidity sensor, and control valve coordinates with three sections of arc openings and realizes open and-shut mode; Rubbing head upper surface contacts with polishing fluid storage container lower surface but does not fix, and in the corresponding polishing fluid storage container of rubbing head upper surface, a groove is offered in the position of control valve, and groove bottom is uniformly distributed 4 through holes, 4 corresponding optical element fixture surroundings of through hole; Distribute around optical element fixture humidity sensor, the polishing fluid humidity of real-time detecting optical component ambient; Inner uniform 4 drainage troughs of polishing disk, multiple through hole is offered in the corresponding drainage trough position of polishing disk upper surface, and through hole connects polishing disk upper surface and drainage trough; Protective cover is arranged on polishing disk outside, in wedge configuration; Protective cover is connected by bearing with polishing disk main shaft, when polishing disk rotates, and protective cover non rotating; Be connected with tube at one end below protective cover, arrange water pump and filter in conduit, the conduit other end is connected with shower nozzle, and shower nozzle is just to polishing pad; Unnecessary polishing fluid is back to shower nozzle by conduit, is sprayed on polishing pad, recycling.
Described control valve can adopt annular control valve.
Described groove can adopt annular groove.
The real-time polishing fluid humidity that the present invention is positioned at polishing pad diverse location according to workpiece in process carries out polishing fluid supply, and the polishing fluid circulatory system is reused after untapped or unnecessary polishing fluid is collected filtration, ensures that polishing fluid is uniformly distributed and makes polishing fluid obtain utilizing the most fully.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the embodiment of the present invention.
Fig. 2 is the polishing fluid storage container structural representation of the embodiment of the present invention.
Fig. 3 is the annular regulating valve structure schematic diagram of the embodiment of the present invention.
Fig. 4 is the rubbing head generalized section of the embodiment of the present invention.
Fig. 5 is polishing disk and the protective cover generalized section of the embodiment of the present invention.
Below to the mark of each critical piece in publishing picture:
1, polishing fluid storage container, 1-1, polishing fluid, 1-2, arc opening, 2, annular control valve, 3, bearing, 4, rubbing head, 4-1, annular groove, 4-2, through hole, 5, humidity sensor, 6, optical element fixture, 6-1, optical element, 7, polishing disk, 7-1, drainage trough, 7-2, polishing pad, 7-3, through hole, 8, protective cover, 8-1, bearing, 9, conduit, 10, water pump, 11, filter, 12, shower nozzle, A, barbed portion, B, solid section.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme of the present invention is further elaborated.
As shown in Fig. 1 ~ 5, the embodiment of the present invention is provided with polishing fluid storage container 1, annular control valve 2, bearing 3, rubbing head 4, humidity sensor 5, optical element fixture 6, polishing disk 7, protective cover 8, conduit 9, water pump 10, filter 11 and shower nozzle 12; The in-built polishing fluid 1-1 of described polishing fluid storage container 1, is connected by bearing 3 between polishing fluid storage container 1 center with rubbing head 4 main shaft, does not drive the rotation of polishing fluid storage container 1 when rubbing head 4 main shaft rotates; Polishing fluid storage container 1 bottom even distributes three sections of arc opening 1-2, and annular control valve 2 is arranged on polishing fluid storage container 1 bottom inside, and annular control valve 2 is controlled by humidity sensor 5, and annular control valve 2 coordinates with three sections of arc opening 1-2 and realizes open and-shut mode; Rubbing head 4 upper surface contacts with polishing fluid storage container 1 lower surface but does not fix, in the corresponding polishing fluid storage container 1 of rubbing head 4 upper surface, an annular groove 4-1 is offered in the position of annular control valve 2, annular groove 4-1 bottom is uniformly distributed 4 through hole 4-2,4 corresponding optical element fixture 6 surroundings of through hole 4-2; Optical element fixture 6 surrounding distribution humidity sensor 5, the polishing fluid humidity around real-time detecting optical element 6-1; Inner uniform 4 the drainage trough 7-1 of polishing disk 7, multiple through hole 7-3 is offered in the corresponding drainage trough 7-1 position of polishing disk 7 upper surface, and through hole 7-3 connects polishing disk 7 upper surface and drainage trough 7-1; It is outside that protective cover 8 is arranged on polishing disk 7, in wedge configuration; Protective cover 8 is connected by bearing 8-1 with polishing disk 7 main shaft, when polishing disk 7 rotates, and protective cover 8 non rotating; Be connected with conduit 9 one end below protective cover 8, arrange water pump 10 and filter 11 in conduit 9, conduit 9 other end is connected with shower nozzle 12, and shower nozzle 12 is just to polishing pad 7-2; Unnecessary polishing fluid 1-1 is back to shower nozzle 12 by conduit 9, is sprayed on polishing pad 7-2, recycling.
Operation principle of the present invention is as follows:
In polishing process, rubbing head 4 drives optical element 6-1 rotation, do relative rotary motion, and polishing disk 7 also drives polishing pad 7-2 to rotate on polishing pad 7-2 simultaneously, and polishing pad 8 position that the optical element moment touches is change.The polishing fluid 1-1 humidity of the real-time detecting optical element 6-1 position of humidity sensor 5, the moisture signal measured is converted into the signal of telecommunication and is input to output performance element, the rotation of annular control valve 2 in real-time control polishing fluid storage container 1, coordinates with three sections of arc opening 1-2 bottom polishing fluid storage container 1 and realizes open and-shut mode.For the place that polishing fluid 1-1 humidity is enough, annular control valve 2 rotates to solid section B corresponding with arc opening 1-2, and namely enclose bottom polishing fluid storage container 1, polishing fluid 1-1 cannot flow on polishing pad 8.For the place that polishing fluid 1-1 humidity is inadequate, annular control valve 2 rotates to barbed portion A corresponding with arc opening 1-2, polishing fluid 1-1 in polishing fluid storage container 1 flows in the annular groove 4-1 of rubbing head 4 by annular control valve 2, and below annular groove 4-1, through hole 4-2 flows on polishing pad 7-2 and optical element 6-1, directly effectively can control jet velocity and the flow of polishing fluid.Due to rubbing head 4 rotation, the polishing fluid 1-1 flowed down from 4 through hole 4-2 will be evenly distributed on optical element 6-1 and peripheral region thereof.Polishing fluid 1-1 unnecessary on polishing pad 7-2 in polishing process is drained to protective cover 8 by through hole 7-3 and drainage trough 7-1.Meanwhile, protective cover 8 surrounding, in undertaking polishing process, polishing pad 7-2 is thrown out of unnecessary polishing fluid 1-1 due to centrifugal action.The wedge configuration of protective cover 8 can ensure that polishing fluid 1-1 flow to bottom protective cover 8 smoothly.The polishing fluid 1-1 reclaimed in protective cover 8 is extracted by water pump 10 and filters through filter 11 and stir, and is again back on polishing pad 7-2, realizes the recycling of polishing fluid.Filter 11 includes volatile oxidant and pH stabilizing agent, ensures the use value of the polishing fluid 1-1 that protective cover 8 is recovered to.By the cooperating of humidity sensing system, polishing fluid feed system and the polishing fluid circulatory system, realize polishing fluid and targetedly spray and reuse, ensure that optical element polishing fluid is uniformly distributed in real time, and effectively save polishing fluid, realize object of the present invention.
Claims (3)
1. an optical element burnishing device, is characterized in that being provided with polishing fluid storage container, control valve, polishing fluid storage container bearing, rubbing head, humidity sensor, optical element fixture, polishing disk, protective cover, conduit, water pump, filter and shower nozzle; The in-built polishing fluid of described polishing fluid storage container, polishing fluid storage container center is connected by polishing fluid storage container bearing with between rubbing head main shaft, does not drive the rotation of polishing fluid storage container when rubbing head main shaft rotates; Polishing fluid storage container bottom even distributes three sections of arc openings, and control valve is arranged on polishing fluid storage container bottom inside, and control valve is controlled by humidity sensor, and control valve coordinates with three sections of arc openings and realizes open and-shut mode; Rubbing head upper surface contacts with polishing fluid storage container lower surface but does not fix, and in the corresponding polishing fluid storage container of rubbing head upper surface, a groove is offered in the position of control valve, and groove bottom is uniformly distributed 4 through holes, 4 corresponding optical element fixture surroundings of through hole; Distribute around optical element fixture humidity sensor, the polishing fluid humidity of real-time detecting optical component ambient; Inner uniform 4 drainage troughs of polishing disk, multiple through hole is offered in the corresponding drainage trough position of polishing disk upper surface, and through hole connects polishing disk upper surface and drainage trough; Protective cover is arranged on polishing disk outside, in wedge configuration; Protective cover is connected by polishing disk bearing with polishing disk main shaft, when polishing disk rotates, and protective cover non rotating; Be connected with tube at one end below protective cover, arrange water pump and filter in conduit, the conduit other end is connected with shower nozzle, and shower nozzle is just to polishing pad; Unnecessary polishing fluid is back to shower nozzle by conduit, is sprayed on polishing pad, recycling.
2. a kind of optical element burnishing device as claimed in claim 1, is characterized in that described control valve adopts annular control valve.
3. a kind of optical element burnishing device as claimed in claim 1, is characterized in that described groove adopts annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310608245.8A CN103586754B (en) | 2013-11-26 | 2013-11-26 | A kind of optical element burnishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310608245.8A CN103586754B (en) | 2013-11-26 | 2013-11-26 | A kind of optical element burnishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103586754A CN103586754A (en) | 2014-02-19 |
| CN103586754B true CN103586754B (en) | 2015-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310608245.8A Expired - Fee Related CN103586754B (en) | 2013-11-26 | 2013-11-26 | A kind of optical element burnishing device |
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| Country | Link |
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| CN (1) | CN103586754B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104400587A (en) * | 2014-10-16 | 2015-03-11 | 中山市吉尔科研技术服务有限公司 | Spiral-flow type optical lens polishing equipment |
| CN106312756A (en) * | 2015-06-25 | 2017-01-11 | 安徽鸿凌机电仪表(集团)有限公司 | Grinding device for plastic products |
| CN104999369B (en) * | 2015-08-13 | 2019-01-01 | 厦门理工学院 | Buffing Humidity Detection error correcting method |
| CN104999368B (en) * | 2015-08-13 | 2017-10-31 | 厦门理工学院 | Buffing Humidity Automatic Control device and its control method |
| CN105922125B (en) * | 2016-05-24 | 2018-04-17 | 广东工业大学 | A kind of magneto-rheological fluid dynamic pressure composite polishing device and its polishing method |
| CN105834862A (en) * | 2016-05-30 | 2016-08-10 | 苏州微米光学科技有限公司 | Polishing working plate for optical glass |
| CN106363527B (en) * | 2016-11-30 | 2018-12-11 | 德米特（苏州）电子环保材料有限公司 | Polisher lapper |
| CN106425827B (en) * | 2016-11-30 | 2018-09-11 | 德米特（苏州）电子环保材料有限公司 | Workpiece surface treatment equipment |
| CN107020577B (en) * | 2017-04-27 | 2019-01-01 | 平湖瑞星金属工艺有限公司 | A kind of hardware steel ball polishing agent burnishing device |
| CN109420970B (en) * | 2017-08-31 | 2021-10-26 | 深圳市水佳鑫科技有限公司 | Hard metal electrochemical plane grinding equipment |
| CN108857840A (en) * | 2018-07-25 | 2018-11-23 | 浙江工业大学 | The photochemistry machining platform and polishing fluid replacing options of replaceable polishing fluid |
| US11244834B2 (en) * | 2018-07-31 | 2022-02-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry recycling for chemical mechanical polishing system |
| CN109397007B (en) * | 2018-10-26 | 2024-03-01 | 中国科学院上海光学精密机械研究所 | Novel efficient thermal field regulating and controlling polishing machine and polishing method thereof |
| CN109465738A (en) * | 2018-12-10 | 2019-03-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of polishing pedestal and polissoir |
| CN109676528A (en) * | 2018-12-24 | 2019-04-26 | 铜陵精远线模有限责任公司 | A kind of mold polish lapping liquid circulating sleeve |
| CN110193763B (en) * | 2019-05-11 | 2021-01-05 | 苏州奥博特光学科技有限公司 | Prism fine polishing equipment and process |
| CN112192436B (en) * | 2020-10-15 | 2022-10-11 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
| CN114473852A (en) * | 2020-10-28 | 2022-05-13 | 中国科学院微电子研究所 | Polishing head and chemical mechanical planarization equipment |
| CN115179111B (en) * | 2022-06-29 | 2023-10-24 | 大连理工大学 | Bath polishing method and device for deliquescing workpiece |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2147077Y (en) * | 1992-12-18 | 1993-11-24 | 马鞍山钢铁公司 | Automatic liquid dropping polishing machine with sample rotation chuck |
| US6623329B1 (en) * | 2000-08-31 | 2003-09-23 | Micron Technology, Inc. | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad |
| JP2007181895A (en) * | 2006-01-06 | 2007-07-19 | Komatsu Ltd | Pressure control device on polishing device |
| CN2930972Y (en) * | 2006-08-11 | 2007-08-08 | 上海海事大学 | Inner-cooling-type high speed thin film grinding head |
| CN101920476B (en) * | 2009-06-11 | 2011-12-14 | 上海华虹Nec电子有限公司 | Chemical mechanical polishing equipment and conveying method of grinding fluid thereof |
| CN103042470A (en) * | 2013-01-23 | 2013-04-17 | 厦门大学 | Polishing solution adding device |
-
2013
- 2013-11-26 CN CN201310608245.8A patent/CN103586754B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN103586754A (en) | 2014-02-19 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20151111 Termination date: 20211126 |