CN103586754A - Optical element polishing device - Google Patents
Optical element polishing device Download PDFInfo
- Publication number
- CN103586754A CN103586754A CN201310608245.8A CN201310608245A CN103586754A CN 103586754 A CN103586754 A CN 103586754A CN 201310608245 A CN201310608245 A CN 201310608245A CN 103586754 A CN103586754 A CN 103586754A
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- CN
- China
- Prior art keywords
- polishing
- polishing fluid
- optical element
- storage container
- protective cover
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/005—Blocking means, chucks or the like; Alignment devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
Abstract
The invention provides an optical element polishing device, and relates to polishing devices. The optical element polishing device comprises a polishing solution storing container, a regulating valve, a bearing, a polishing head, a humidity sensor, an optical element fixture, a polishing disk, a protective cover, a guide pipe, a water pump, a filter and a spray head. The center of the polishing solution storing container is connected with a main shaft of the polishing head. The bottom of the polishing solution storing container is provided with three arc-shaped openings. The regulating valve is mounted on the inner side of the bottom of the polishing solution storing container. The upper surface of the polishing head and the lower surface of the polishing solution storing container are in contact with each other but not fixed to each other. The position, corresponding to the regulating valve in the polishing solution storing container, of the upper surface of the polishing head is provided with a groove, and the lower portion of the groove is provided with four through holes. Sensors are distributed around the fixture. Four drainage grooves are evenly distributed inside the polishing disk. The positions, corresponding to the drainage grooves, of the upper surface of the polishing disk are provided with through holes which are connected with the upper surface of the polishing disk and the drainage grooves. The protective cover is connected with a main shaft of the polishing disk. The lower portion of the protective cover is connected with one end of the guide pipe. The water pump and the filter are arranged in the guide pipe. The other end of the guide pipe is connected with the spray head, and the spray head directly faces a polishing pad.
Description
Technical field
The present invention relates to burnishing device, especially relate to a kind of optical element burnishing device that can effectively save polishing fluid.
Background technology
Increasingly extensive along with the application of the manufacturing fast development of contemporary optics and optical material, has higher requirement to optical element surface quality.Chemically mechanical polishing (chemical mechanical polishing, CMP) technology is, by chemical action and mechanism, optical element is carried out to material removal, thereby obtain smooth finish surface (Su Jianxiu, Guo Dongming, Kang Renke etc. during Wafer Chemical Mechanical Polishing, forms of motion is to heteropical impact analysis [J] in sheet. China Mechanical Engineering, 2005,9 (16): 815-818).Chemically mechanical polishing is widely used in super large-scale integration (ULSI) manufacture, become semiconductor machining industry realize the practical technique of silicon chip leveling and core technology (Dong Wei. chemical Mechanical Polishing Technique present Research and progress [J]. manufacturing technology and lathe, 2012, (07): 93-97).
Traditional chemical-mechanical polishing system is comprised of polishing disk and the polishing fluid feedway of a rotation rubbing head, carrying polishing pad.Polishing fluid replenishing method existing in CMP process is: from polishing fluid feedway, draw a conduit, directly polishing fluid is injected on polishing pad.While using the method, a large amount of polishing fluids flow directly into polishing pad, and in polishing process, rubbing head drives optical element to rotate on polishing pad, and polishing disk also drives polishing pad rotation, the centrifugal force producing may directly be thrown to untapped polishing fluid beyond polishing pad, has caused great waste.Meanwhile, polishing fluid is supplied with from polishing disk one side, and polishing fluid cannot be evenly distributed on surface of the work, affects workpiece crudy.
Summary of the invention
The object of the invention is to easily cause polishing fluid waste and surface of the work polishing fluid problem pockety for traditional polishing fluid adding method, provide and can effectively save polishing fluid, and realize polishing fluid and be uniformly distributed, effectively improve a kind of optical element burnishing device of polishing fluid utilization rate.
The present invention is provided with polishing fluid storage container, control valve, bearing, rubbing head, humidity sensor, optical element fixture, polishing disk, protective cover, conduit, water pump, filter and shower nozzle; The in-built polishing fluid of described polishing fluid storage container, is connected by bearing between polishing fluid storage container center and rubbing head main shaft, does not drive the rotation of polishing fluid storage container during the rotation of rubbing head main shaft; Three sections of arc openings of polishing fluid storage container bottom even distribution, control valve is arranged on polishing fluid storage container bottom inside, and control valve is controlled by humidity sensor, and control valve coordinates and realizes open and-shut mode with three sections of arc openings; Rubbing head upper surface contacts with polishing fluid storage container lower surface but is unfixing, and in the corresponding polishing fluid storage container of rubbing head upper surface, a groove is offered in the position of control valve, and groove bottom is uniformly distributed 4 through holes, 4 corresponding optical element fixture surroundings of through hole; The optical element fixture humidity sensor that around distributes, detects optical element polishing fluid humidity around in real time; Inner uniform 4 drainage troughs of polishing disk, a plurality of through holes are offered in the corresponding drainage trough of polishing disk upper surface position, and through hole connects polishing disk upper surface and drainage trough; Protective cover is arranged on polishing disk outside, is wedge configuration; Protective cover is connected by bearing with polishing disk main shaft, and during polishing disk rotation, protective cover does not rotate; Protective cover below is connected with conduit one end, and water pump and filter are set in conduit, and the conduit other end is connected with shower nozzle, and shower nozzle is over against polishing pad; Unnecessary polishing fluid is back to shower nozzle place by conduit, is sprayed on polishing pad recycling.
Described control valve can adopt annular control valve.
Described groove can adopt annular groove.
The real-time polishing fluid humidity that the present invention is positioned at polishing pad diverse location according to workpiece in process is carried out polishing fluid supply, and the polishing fluid circulatory system is reused after untapped or unnecessary polishing fluid is collected to filtration, guarantees that polishing fluid is uniformly distributed and makes polishing fluid to obtain utilizing the most fully.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the embodiment of the present invention.
Fig. 2 is the polishing fluid storage container structural representation of the embodiment of the present invention.
Fig. 3 is the annular regulating valve structure schematic diagram of the embodiment of the present invention.
Fig. 4 is the rubbing head generalized section of the embodiment of the present invention.
Fig. 5 is polishing disk and the protective cover generalized section of the embodiment of the present invention.
Below give the mark of each critical piece in publishing picture:
1, polishing fluid storage container, 1-1, polishing fluid, 1-2, arc opening, 2, annular control valve, 3, bearing, 4, rubbing head, 4-1, annular groove, 4-2, through hole, 5, humidity sensor, 6, optical element fixture, 6-1, optical element, 7, polishing disk, 7-1, drainage trough, 7-2, polishing pad, 7-3, through hole, 8, protective cover, 8-1, bearing, 9, conduit, 10, water pump, 11, filter, 12, shower nozzle, A, barbed portion, B, solid section.
The specific embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is further elaborated.
As shown in Fig. 1~5, the embodiment of the present invention is provided with polishing fluid storage container 1, annular control valve 2, bearing 3, rubbing head 4, humidity sensor 5, optical element fixture 6, polishing disk 7, protective cover 8, conduit 9, water pump 10, filter 11 and shower nozzle 12; The in-built polishing fluid 1-1 of described polishing fluid storage container 1, is connected by bearing 3 between polishing fluid storage container 1 center and rubbing head 4 main shafts, does not drive the rotation of polishing fluid storage container 1 during rubbing head 4 main shafts rotation; Three sections of arc opening 1-2 of polishing fluid storage container 1 bottom even distribution, annular control valve 2 is arranged on polishing fluid storage container 1 bottom inside, and annular control valve 2 is controlled by humidity sensor 5, and annular control valve 2 coordinates and realizes open and-shut mode with three sections of arc opening 1-2; Rubbing head 4 upper surfaces contact with polishing fluid storage container 1 lower surface but are unfixing, an annular groove 4-1 is offered in the position of the corresponding polishing fluid storage container of rubbing head 4 upper surfaces 1 interior annular control valve 2, annular groove 4-1 bottom is uniformly distributed 4 through hole 4-2,4 corresponding optical element fixture 6 surroundings of through hole 4-2; Optical element fixture 6 humidity sensor 5 that around distributes, detects optical element 6-1 polishing fluid humidity around in real time; Inner uniform 4 the drainage trough 7-1 of polishing disk 7, the corresponding drainage trough 7-1 of polishing disk 7 upper surfaces offers a plurality of through hole 7-3 in position, and through hole 7-3 connects polishing disk 7 upper surfaces and drainage trough 7-1; Protective cover 8 is arranged on polishing disk 7 outsides, is wedge configuration; Protective cover 8 is connected by bearing 8-1 with polishing disk 7 main shafts, and during polishing disk 7 rotation, protective cover 8 does not rotate; Protective cover 8 belows are connected with conduit 9 one end, and water pump 10 and filter 11 are set in conduit 9, and conduit 9 other ends are connected with shower nozzle 12, and shower nozzle 12 is over against polishing pad 7-2; Unnecessary polishing fluid 1-1 is back to shower nozzle 12 places by conduit 9, is sprayed at polishing pad 7-2 upper, recycling.
Operation principle of the present invention is as follows:
In polishing process, rubbing head 4 drives optical element 6-1 rotations, does relative rotary motion on polishing pad 7-2 simultaneously, and polishing disk 7 also drives polishing pad 7-2 rotation, and polishing pad 8 positions that optical element touches constantly change.Humidity sensor 5 detects the polishing fluid 1-1 humidity of optical element 6-1 position in real time, the moisture signal measuring is converted into the signal of telecommunication and is input to output performance element, control in real time the rotation of annular control valve 2 in polishing fluid storage container 1, coordinate and realize open and-shut mode with three sections of 1 bottoms of polishing fluid storage container arc opening 1-2.For the enough places of polishing fluid 1-1 humidity, annular control valve 2 rotates to solid section B corresponding with arc opening 1-2, has sealed polishing fluid storage container 1 bottom, and polishing fluid 1-1 cannot flow on polishing pad 8.For the inadequate place of polishing fluid 1-1 humidity, annular control valve 2 rotates to barbed portion A corresponding with arc opening 1-2, polishing fluid 1-1 in polishing fluid storage container 1 flows in the annular groove 4-1 of rubbing head 4 by annular control valve 2, and flow on polishing pad 7-2 and optical element 6-1 along annular groove 4-1 below through hole 4-2, can directly effectively control jet velocity and the flow of polishing fluid.Due to rubbing head 4 rotations, the polishing fluid 1-1 flowing down from 4 through hole 4-2 will be evenly distributed on optical element 6-1 and peripheral region thereof.In polishing process, the upper unnecessary polishing fluid 1-1 of polishing pad 7-2 is drained to protective cover 8 by through hole 7-3 and drainage trough 7-1.Meanwhile, protective cover 8 surroundings are in accepting polishing process, and polishing pad 7-2 is upper because centrifugal action is thrown out of unnecessary polishing fluid 1-1.The wedge configuration of protective cover 8 can guarantee that polishing fluid 1-1 flow to protective cover 8 bottoms smoothly.The polishing fluid 1-1 reclaiming in protective cover 8 is extracted through filter 11 and is filtered and stir by water pump 10, is again back to polishing pad 7-2 upper, realizes the recycling of polishing fluid.Filter 11 includes volatile oxidant and pH stabilizing agent, guarantees the use value of the polishing fluid 1-1 that protective cover 8 is recovered to.By the cooperating of humidity sensing system, polishing fluid feed system and the polishing fluid circulatory system, realize polishing fluid and targetedly spray and reuse, guarantee that optical element polishing fluid is uniformly distributed in real time, and effectively save polishing fluid, realize object of the present invention.
Claims (3)
1. an optical element burnishing device, is characterized in that being provided with polishing fluid storage container, control valve, bearing, rubbing head, humidity sensor, optical element fixture, polishing disk, protective cover, conduit, water pump, filter and shower nozzle; The in-built polishing fluid of described polishing fluid storage container, is connected by bearing between polishing fluid storage container center and rubbing head main shaft, does not drive the rotation of polishing fluid storage container during the rotation of rubbing head main shaft; Three sections of arc openings of polishing fluid storage container bottom even distribution, control valve is arranged on polishing fluid storage container bottom inside, and control valve is controlled by humidity sensor, and control valve coordinates and realizes open and-shut mode with three sections of arc openings; Rubbing head upper surface contacts with polishing fluid storage container lower surface but is unfixing, and in the corresponding polishing fluid storage container of rubbing head upper surface, a groove is offered in the position of control valve, and groove bottom is uniformly distributed 4 through holes, 4 corresponding optical element fixture surroundings of through hole; The optical element fixture humidity sensor that around distributes, detects optical element polishing fluid humidity around in real time; Inner uniform 4 drainage troughs of polishing disk, a plurality of through holes are offered in the corresponding drainage trough of polishing disk upper surface position, and through hole connects polishing disk upper surface and drainage trough; Protective cover is arranged on polishing disk outside, is wedge configuration; Protective cover is connected by bearing with polishing disk main shaft, and during polishing disk rotation, protective cover does not rotate; Protective cover below is connected with conduit one end, and water pump and filter are set in conduit, and the conduit other end is connected with shower nozzle, and shower nozzle is over against polishing pad; Unnecessary polishing fluid is back to shower nozzle place by conduit, is sprayed on polishing pad recycling.
2. a kind of optical element burnishing device as claimed in claim 1, is characterized in that described control valve adopts annular control valve.
3. a kind of optical element burnishing device as claimed in claim 1, is characterized in that described groove adopts annular groove.
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CN201310608245.8A CN103586754B (en) | 2013-11-26 | 2013-11-26 | A kind of optical element burnishing device |
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CN201310608245.8A CN103586754B (en) | 2013-11-26 | 2013-11-26 | A kind of optical element burnishing device |
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CN103586754B CN103586754B (en) | 2015-11-11 |
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Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104400587A (en) * | 2014-10-16 | 2015-03-11 | 中山市吉尔科研技术服务有限公司 | Spiral-flow type optical lens polishing equipment |
CN104999369A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Buffing humidity detection error correcting method |
CN104999368A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Device and method for automatically controlling buffing humidity |
CN105834862A (en) * | 2016-05-30 | 2016-08-10 | 苏州微米光学科技有限公司 | Polishing working plate for optical glass |
CN105922125A (en) * | 2016-05-24 | 2016-09-07 | 广东工业大学 | Magneto-rheological fluid dynamic pressure composite polishing device and method |
CN106312756A (en) * | 2015-06-25 | 2017-01-11 | 安徽鸿凌机电仪表(集团)有限公司 | Grinding device for plastic products |
CN106363527A (en) * | 2016-11-30 | 2017-02-01 | 德米特(苏州)电子环保材料有限公司 | Grinding polisher |
CN106425827A (en) * | 2016-11-30 | 2017-02-22 | 德米特(苏州)电子环保材料有限公司 | Workpiece surface treatment device |
CN107020577A (en) * | 2017-04-27 | 2017-08-08 | 吴建莲 | A kind of hardware steel ball polishing agent burnishing device |
CN108857840A (en) * | 2018-07-25 | 2018-11-23 | 浙江工业大学 | The photochemistry machining platform and polishing fluid replacing options of replaceable polishing fluid |
CN109397007A (en) * | 2018-10-26 | 2019-03-01 | 中国科学院上海光学精密机械研究所 | A kind of new and effective thermal field regulation polishing machine and its polishing method |
CN109420970A (en) * | 2017-08-31 | 2019-03-05 | 深圳市水佳鑫科技有限公司 | Hard metal electrochemical surface milling apparatus |
CN109465738A (en) * | 2018-12-10 | 2019-03-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | A kind of polishing pedestal and polissoir |
CN109676528A (en) * | 2018-12-24 | 2019-04-26 | 铜陵精远线模有限责任公司 | A kind of mold polish lapping liquid circulating sleeve |
CN110193763A (en) * | 2019-05-11 | 2019-09-03 | 苏州奥博特光学科技有限公司 | A kind of prism essence casts standby and technique |
CN110842760A (en) * | 2018-07-31 | 2020-02-28 | 台湾积体电路制造股份有限公司 | Polishing system for polishing a substrate and method of operating a polishing system |
CN112192436A (en) * | 2020-10-15 | 2021-01-08 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
CN114473852A (en) * | 2020-10-28 | 2022-05-13 | 中国科学院微电子研究所 | Polishing head and chemical mechanical planarization equipment |
CN115179111A (en) * | 2022-06-29 | 2022-10-14 | 大连理工大学 | Bath polishing method and device for deliquesced workpiece |
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Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104400587A (en) * | 2014-10-16 | 2015-03-11 | 中山市吉尔科研技术服务有限公司 | Spiral-flow type optical lens polishing equipment |
CN106312756A (en) * | 2015-06-25 | 2017-01-11 | 安徽鸿凌机电仪表(集团)有限公司 | Grinding device for plastic products |
CN104999368B (en) * | 2015-08-13 | 2017-10-31 | 厦门理工学院 | Buffing Humidity Automatic Control device and its control method |
CN104999369A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Buffing humidity detection error correcting method |
CN104999368A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Device and method for automatically controlling buffing humidity |
CN105922125A (en) * | 2016-05-24 | 2016-09-07 | 广东工业大学 | Magneto-rheological fluid dynamic pressure composite polishing device and method |
CN105922125B (en) * | 2016-05-24 | 2018-04-17 | 广东工业大学 | A kind of magneto-rheological fluid dynamic pressure composite polishing device and its polishing method |
CN105834862A (en) * | 2016-05-30 | 2016-08-10 | 苏州微米光学科技有限公司 | Polishing working plate for optical glass |
CN106425827A (en) * | 2016-11-30 | 2017-02-22 | 德米特(苏州)电子环保材料有限公司 | Workpiece surface treatment device |
CN106363527A (en) * | 2016-11-30 | 2017-02-01 | 德米特(苏州)电子环保材料有限公司 | Grinding polisher |
CN106425827B (en) * | 2016-11-30 | 2018-09-11 | 德米特(苏州)电子环保材料有限公司 | Workpiece surface treatment equipment |
CN106363527B (en) * | 2016-11-30 | 2018-12-11 | 德米特(苏州)电子环保材料有限公司 | Polisher lapper |
CN107020577A (en) * | 2017-04-27 | 2017-08-08 | 吴建莲 | A kind of hardware steel ball polishing agent burnishing device |
CN107020577B (en) * | 2017-04-27 | 2019-01-01 | 平湖瑞星金属工艺有限公司 | A kind of hardware steel ball polishing agent burnishing device |
CN109420970A (en) * | 2017-08-31 | 2019-03-05 | 深圳市水佳鑫科技有限公司 | Hard metal electrochemical surface milling apparatus |
CN108857840A (en) * | 2018-07-25 | 2018-11-23 | 浙江工业大学 | The photochemistry machining platform and polishing fluid replacing options of replaceable polishing fluid |
CN110842760A (en) * | 2018-07-31 | 2020-02-28 | 台湾积体电路制造股份有限公司 | Polishing system for polishing a substrate and method of operating a polishing system |
US11244834B2 (en) | 2018-07-31 | 2022-02-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry recycling for chemical mechanical polishing system |
CN109397007A (en) * | 2018-10-26 | 2019-03-01 | 中国科学院上海光学精密机械研究所 | A kind of new and effective thermal field regulation polishing machine and its polishing method |
CN109397007B (en) * | 2018-10-26 | 2024-03-01 | 中国科学院上海光学精密机械研究所 | Novel efficient thermal field regulating and controlling polishing machine and polishing method thereof |
CN109465738A (en) * | 2018-12-10 | 2019-03-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | A kind of polishing pedestal and polissoir |
CN109676528A (en) * | 2018-12-24 | 2019-04-26 | 铜陵精远线模有限责任公司 | A kind of mold polish lapping liquid circulating sleeve |
CN110193763A (en) * | 2019-05-11 | 2019-09-03 | 苏州奥博特光学科技有限公司 | A kind of prism essence casts standby and technique |
CN112192436A (en) * | 2020-10-15 | 2021-01-08 | 上海理工大学 | Self-adjusting elastic energy-saving polishing device |
CN114473852A (en) * | 2020-10-28 | 2022-05-13 | 中国科学院微电子研究所 | Polishing head and chemical mechanical planarization equipment |
CN115179111A (en) * | 2022-06-29 | 2022-10-14 | 大连理工大学 | Bath polishing method and device for deliquesced workpiece |
CN115179111B (en) * | 2022-06-29 | 2023-10-24 | 大连理工大学 | Bath polishing method and device for deliquescing workpiece |
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