CN101919323B - 导热和导电的互连结构 - Google Patents

导热和导电的互连结构 Download PDF

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CN101919323B
CN101919323B CN2008801252267A CN200880125226A CN101919323B CN 101919323 B CN101919323 B CN 101919323B CN 2008801252267 A CN2008801252267 A CN 2008801252267A CN 200880125226 A CN200880125226 A CN 200880125226A CN 101919323 B CN101919323 B CN 101919323B
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interconnection structure
main body
thickness dimension
heat conduction
heat
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CN101919323A (zh
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R·朱拉姆
S·米斯拉
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Henkel AG and Co KGaA
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Bergquist Co Inc
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Abstract

一种能够操作以放置在第一主体和第二主体之间的互连结构，其中所述互连结构包括能够操作以与所述第一主体并列的第一表面、能够操作以与所述第二主体并列的第二表面、以及限定在所述第一表面和所述第二表面之间的厚度维度。所述互连结构包括第一导热材料和第二导热材料，其中第二导热材料以一种或更多种不同的结构形成，所述结构形成穿过厚度维度的所述第二材料的至少一条大体上连续的路径。所述互连结构显示沿着厚度轴的低于约100psi的压缩模量。

Description

导热和导电的互连结构
技术领域
本发明涉及用于与电子组件有关的方面的接口材料和结构，更具体地涉及互连结构，该互连结构用于与诸如印刷电路板(PCB)、集成电路(IC)、中央处理器(CPU)等有关的方面的产热电子设备，以及用于耦接这些产热电子设备来隔离诸如热沉的主体。
背景技术
随着从产热电子设备散热的需求的增大，已经发现热接口材料和结构应用相应地增加。由于用于制造各种产品的电子组件尺寸越来越小且容量越来越大，其每单位面积上的产热急剧增加。因为在高温环境下许多电子组件会损失效率和性能，采用有利于从各产热电子组件自身和周围移除热能的材料和结构变得十分必要。
在很多应用中，采用诸如热沉或者散热片(heat spreader)的散热器来提高从产热电子组件移除热能的速率。这些散热器是导热的，且典型地提供相对高容量的热交换接口。举个例子，散热片可以被热耦接至产热电子组件，并被放置在由冷却风扇驱动的移动空气流的路径中，或者可以和具有更大热容量的另一流体(例如水)热接触，以便向热负荷流体(heat loading fluid)散发热能。在某些循环中，散热片具有较大的表面积以增加与如前所述的热负荷流体的可能接触面积。
在通过使用散热器移除热能时会遇到的问题是，如何在产热电子组件和散热器之间获得良好的热耦接。例如，产热电子组件和散热器的各自的接触面可能是不平整的，从而阻止了彼此之间的连续接触。如果无法获得两个接触面之间的接触，那么由于以两个接触面之间的空隙形式引入了额外的热边界，并且其中该空隙的热导率可能比散热器材料的热导率低，因此，热转移效率急剧下降。
目前已经实施过各种解决方案来试图克服这个问题，包括在产热电子组件和散热器之间放置导热接口材料以最小化或者消除产热电子组件和散热器之间的空隙。热接口材料具有多种不同的形式，例如油脂、蜡、膏、胶状物、垫、粘合剂等等。传统的热接口材料典型地包含聚合物物质，当其以块体形式被放置在施加的压力下和可能的高温环境下，至少能有点与表面整合(conformable)。在某些应用中，这种整合物质可以是硅油或者其他聚合物材料。为了填补各个热转移表面中的任何表面不平整以使从产热电子组件到热接口材料以及随后从热接口材料到散热器的热转移效率最大化，热接口材料的整合性方面很重要。任何可能存在于热接口材料和产热电子组件的各个表面以及散热器之间的空隙都引入额外的热边界，这将降低热转移速率。
尽管已经开发了各种热接口材料和结构来从产热电子组件移除热能，已经发现接口材料和结构在作为两个主体之间的导电体时可以是额外有用的。当然，在传统领域里也发现了很多导电连接装置。然而，这些装置典型地不是充分整合的，并且导热不足以提供所预期的热导率和热转移特性。
因此，本发明的一个主要目的就是提供互连结构，该互连结构是导热和导电的，并且也是充分整合以对于作为热和电互连结构有用。
本发明的另一目的是提供互连结构，该互连结构沿至少一个指定方向的热导率和电导率超过至少最小阈值，该方向连接第一主体至第二主体。
本发明的又一目的是提供放置在第一主体和第二主体之间的导热和导电的互连结构，该互连结构表现出充分的整合性以使得第一主体和第二主体之间热能和电能的转移达到预期的效率。
发明内容
借助于本发明，可以通过两个主体之间的接口有效地转移热能和电能。通过布置的充分整合的互连结构便利电能和热能的传输，以使两个主体之间的热能和电能的转移能达到预期的效率。因而，互连结构可以具有多种应用，包括产热电子组件与各自的散热器之间的连接。
在一个实施例中，本发明的互连结构包括能够操作以与所述第一主体并列的第一表面和能够操作以与所述第二主体并列的第二表面，其中互连结构的厚度维度限定在所述第一表面和所述第二表面之间。该互连结构包括热导率至少约0.5W/m·K的第一材料和电阻低于约10000欧姆的第二材料。该第二材料可以以一种或更多种不同的结构形成，该结构形成穿过所述厚度维度的所述第二材料的至少一条大体上连续的路径。该互连结构具有沿着厚度轴的低于约100psi的压缩模量。
在某些实施例中，第一材料可以是聚合物基体，并可以填充有重量在大约5％至大约95％之间的导热颗粒。所述第一材料的至少一部分被放置为连续穿过所述厚度维度。
在某些实施例中，在互连结构中可以提供多个结构，其中每个所述结构穿过厚度维度连续延伸。这些结构也可以大体上相互平行并被第一材料分隔。
一种用于从第一主体向第二主体转移热能和电能的方法，可以包括提供互连结构，该互连结构包括第一表面、第二表面和限定在所述第一表面和第二表面之间的厚度维度。该互连结构的第一材料可以具有至少约0.5W/m·K的热导率，第二材料具有低于约10000欧姆的电阻。第二材料可以以一种或更多种不同的结构形成，这些结构形成穿过所述厚度维度的所述第二材料的至少一条大体上连续的路径。该互连结构优选地还显示沿着厚度轴的低于约100psi的压缩模量。用于转移热能和电能的方法还包括在所述第一主体和所述第二主体之间放置所述互连结构，使得所述第一表面与所述第一主体热接触以及电接触，并且使得所述第二表面与所述第二主体热接触以及电接触。
附图说明
图1是包含互连结构的电子组件布置的侧视图；
图2是互连结构的透视图；
图3是互连结构的透视图；以及
图4是互连结构的透视图。
具体实施方式
现在将参照表示本发明各种可能配置的附图，以具体实施方式来描述上文列举的目的和优点以及本发明的其他目的、特征和进展。本发明的其他实施方式和方面被认为处于本领域普通技术人员的掌握之中。
现在将结合附图来进行描述，首先参考图1，示出了互连结构10被放置在产热电子组件12和散热器14之间的电子组件布置。举例来说，电子组件12可以是置于基板24上的中央处理单元22，其中，散热器14用于移开处理器22产生的多余热能。在某些实施例中，散热器14可为热沉或者散热片，其包括用于将热能散发至空气中和/或其他与其接触的流体的多个鳍片(fin)32。鳍片32大大增加了与流体介质进行热传导的可能的表面积。
图1示出的布置例示作为电子组件12和散热器14之间的接口的互连结构10。作为接口为了使越过接口的能量输运的效率最大化，互连结构10可以与处理器22的表面26以及散热器14的表面34传导性接触。
可以多种配置提供互连结构10，只要互连结构10至少在沿着和厚度维度“t”平行的第一方向“z”上穿过其厚度维度“t”显示热导性和电导性。图2-图4示出了互连结构10的示例布置，这些互连结构分别由附图标记210、310和410来进行标识。
参考图2所示的实施例，互连结构210包括第一表面212以及通常与之相对的第二表面214。互连结构210的厚度维度“t2”被限定在第一表面212和第二表面214之间。尽管本发明的互连结构的厚度维度“t2”可以在很大程度上变化，但是厚度维度“t”通常在约1到约20密耳之间的量级，在某些情况下，在约5到约10密耳之间的量级。然而，互连结构的厚度维度“t”可按照要求或者需要来选定以满足应用的特定要求。
在图2所示的实施例中，互连结构210包括第一导热材料216和导电结构218。如前所述，导热材料216可以是不同的膏、蜡、胶状物、油脂、油、粘合剂等中的一种或者多种，其可以作为与各个表面(如散热器14的表面34和组件12的表面26)整合的接口。在某些实施例中，膏、蜡、胶状物、油脂、油、粘合剂等至少在“z”方向上是导热的。预期导热材料216在至少“z”方向上的热导率为至少0.5W/m·K。
导热材料216可以包括高分子化合物，如包括硅胶、天然或合成橡胶、丙烯酸、聚氨酯橡胶和热塑性橡胶的弹性体，以及包括环氧树脂、酚树脂等的玻璃材料。高分子化合物可以是大体上完全交联的结构或者“B-阶段”结构，包括那些可以在通过例如热激括或者辐射激活放置在接口位置之后被交联的结构。因此，导热材料216可以自支撑膜或垫的形式作为完全固化的物质被提供，或以可省略的形式提供，无论其是大体上完全固化还是处于需要进一步固化的“B阶段”。导热材料216也可以通过在室温下形成固定的形态“相变”，但在例如处理器22的操作温度下会有些液化。导热材料216可以包括基于有机硅的聚合物或其他聚合物，包括热塑性或热固性聚合物。
在某些实施例中，导热材料216可以包括导热填充材料以提高热导率和/或导热材料216的流变学特性。示例导热填充材料包括氧化铝、氮化铝、氮化硼、氧化锌、石墨、金属合金等等。某些填充材料可以被认为是“颗粒”，包括形状、尺寸、尺寸分布或密度均匀或不均匀的各种固体或者空心体。虽然各种颗粒尺寸分布都可用于导热材料216的填充材料，但是已经发现，大约1微米至大约200微米之间的平均颗粒尺寸提供了有用的尺寸分布。这种填充物在导热材料216中的装载浓度占重量的大约5％到大约95％之间，其中较高装载浓度的导热填充物典型地提高导热材料216的总热导率和粘度。结果，典型地在预期的热导率水平和基于其粘度的块体材料的物理可操作性两者之间取得平衡。
多种商业上可用的产品可用于作为导热材料216，包括例如有机硅或者不含硅的Gap可以从Bergquist Company of Chanhassen，Minnesota得到。
在图2所示的实施例中，导热材料216可以被提供作为被导电结构218分隔的部分，或者替代地作为分隔导电结构218的部分。如图2所示，导热材料216可以以连续延伸穿过厚度维度“t2”的方式被放置的一个或更多个部分，其中导热材料216的连续路径从互连结构210的第一表面212延伸至第二表面214。导热材料216的这种连续路径有助于在电子组件12和散热器14之间穿过互连结构210的厚度维度“t2”提供连续的导热路径。事实上，穿过厚度维度“t”的导热材料216的连续路径提供低热阻路径，以使得能够从电子组件12进行有效的热转移。
导电结构218优选由电阻低于约10000欧姆的材料制成。导电结构218的示例材料包括铜、铝、定向石墨、钻石、金属合金等。优选地，导电结构218穿过互连结构210的厚度维度“t2”形成导电材料的至少一条基本连续的路径。在某些实施例中，至少一个导电结构218本身提供穿过互连结构210的厚度维度“t2”的连续导电路径。可以预期在实际应用(如具有接地垫的高频ASIC)中从互连结构210的第一表面212到第二表面214的良好的导电性，以消除电磁干扰。
在如图2所示的实施例中，导电结构218是大体上平面的薄片或者板的形式，每个延伸穿过互连结构210的整个厚度维度“t2”或者整个长度尺寸“l”。然而，这种结构218并不需要都延伸穿过互连结构210的整个厚度维度“t2”和/或整个长度尺寸“l”。例如，一个或更多个结构218可以仅部分穿过厚度维度“t2”或穿过长度尺寸“l”而延伸，其中这种结构218可以被选择性地放置在互连结构210内。然而，在某些实施例中，可以将导电结构218定向为大体上沿着“z”方向，以有助于从第一表面212到第二表面214(或从第二表面214到第一表面212)传输电能。导电结构218可以是例如厚度维度“w”在大约6微米到大约250微米的箔层的形式。
本发明的互连结构(如互连结构210)的一个重要的物理特性是第一表面212和第二表面214与各主体表面(如元件12的表面26和散热器14的表面34)的整合性。主体的整合性的一种量度是压缩模量，其中本发明的互连结构优选在沿着“z”方向显示低于约每平方英寸100磅的压缩模量。因此，为了获取所预期的压缩模量，可以根据导热材料216和导电结构218各自的物理特性和配置选择导热材料216和导电结构218。导电结构218可以例如相对较薄，以便至少在“z”方向上相对容易压缩。举例来说，用于导电结构218的铜箔材料可以具有的厚度维度“w”在大约6微米到大约250微米之间。申请人已经确定这种箔配置(例如铜材料的箔配置)能够实现互连结构210的预期压缩模量。此外，导热材料216也优选由相对可压缩的材料形成，例如前面所述的聚合物基体。
互连结构310在图3中被示出为具有第一表面312、通常与之相对的第二表面314、以及限定在两者之间的厚度维度“t3”。互连结构310包括第一导热材料316和导电结构318。导热材料316可与前面参考导热材料216的描述相类似。导热材料316的至少一部分可在第一表面312和第二表面314之间连续延伸穿过厚度维度“t3”。
导电结构318可以是棒状或者杆状，其截面尺寸“x”在大约6微米至250微米之间。这些导电结构318每个可以具有大体相同的截面尺寸“x”，或者可以具有不同的截面尺寸。优选地，导电材料的至少一条大体连续的路径延伸穿过互连结构310的厚度维度“t3”。例如，至少一个导电结构318可以穿过厚度维度“t3”连续延伸。然而，这些导电结构318中的一些可以完全延伸穿过互连结构310的厚度维度“t3”。导电结构318可以是任何预期的截面形状，并可以在互连结构310内按多种方向中的任何一种排列。在某些实施例中，至少一个导电结构318沿相对于第一表面312大体垂直的方向延伸，以在电耦接的第一主体和第二主体之间(如电子组件12和散热器14之间)产生最小长度导电路径。然而，在某些布置中，除了垂直于第一表面312之外，导电结构318的其他定向可能导致在第一表面312和第二表面314之间的最小长度导电路径。因此，导电结构318的定向可根据每个应用的需求来选定。如前面参考导电结构218所述的，结构318的电阻优选低于约10000欧姆，可以由各种导电材料制造。
图4示出了另一布置，其中互连结构410包括导电结构418，该导电结构418至少部分包封导电材料416。在如图4所示的实施例中，多个导电结构418可以如参考图2中所描述的那样具有沿不同方向的板或者薄片的形状。在一个实施例中，结构418A和418B被定向为沿着“z”方向，并在互连结构410的第一表面412和第二表面414之间延伸，同时置于互连结构410的通常相对的两侧406和407。导电结构418C、418D被定向为沿着“y”方向，并在导电结构418A和418B之间延伸，以大致围绕导电材料416。当然，也可以提供其他的导电结构418A-D的布置。例如，导电结构418C、418D可延伸至相对侧406、407，而导电结构418A、418B在结构418C、418D之间延伸。以这种方式，通过结构418C到418A到418D或者从418C到418B到418D的结合，穿过厚度维度“t4”形成导电材料的至少一条连续路径，反之亦然。
本文所描述的布置仅仅是本发明设想的无数配置中的示例。事实上，申请人考虑了能够实现穿过互连结构的厚度维度的导热性和导电性的各种配置，该互连结构可被放置于两个主体之间。为了实现本发明的目的，申请人考虑到互连结构仅受第一导热材料、第二导电材料和互连结构的总体整合性的原理限制，第一导热材料显示大于约0.5W/m·K的热导率，第二导电材料具有低于约10000欧姆的电阻，且互连结构的总体整合性由沿着“z”方向的低于约100psi的压缩模量限定。可以预期导电材料以一种或更多种不同的结构形成，这些不同的结构穿过互连结构的厚度维度形成导电材料的至少一条大体上连续的路径。
为符合专利法规，已在本文相当详细地描述了本发明，并且本发明向本领域技术人员提供了运用新颖的原理以及按需要构建和使用本发明的实施例所需的信息。然而，应当理解，本发明可以由具体不同的设备实施，并且可以做出各种修改而不偏离本发明本身的范围。

Claims (20)

1.一种能够操作以放置在第一主体和第二主体之间的互连结构，所述互连结构包括：
(a)能够操作以与所述第一主体并列的第一表面；
(b)能够操作以与所述第二主体并列的第二表面；
(c)限定在所述第一表面和所述第二表面之间的厚度维度；
(d)第一材料，其热导率至少约0.5W/m·K；以及
(e)第二材料，其电阻低于约10000欧姆，所述第二材料以一种或更多种不同的结构形成，所述结构形成穿过所述厚度维度的所述第二材料的至少一条大体上连续的路径，
其中所述互连结构具有沿着厚度轴的低于约100psi的压缩模量。
2.如权利要求1所述的互连结构，其中所述第一主体是产热元件。
3.如权利要求1所述的互连结构，其中所述第二主体是热沉。
4.如权利要求1所述的互连结构，其中所述第一材料是聚合物基体。
5.如权利要求4所述的互连结构，其中所述聚合物基体由导热颗粒填充，该导热颗粒占聚合物基体重量的大约5％至大约95％。
6.如权利要求5所述的互连结构，其中所述导热颗粒选自氧化铝、氮化铝、氮化硼、石墨及其组合。
7.如权利要求5所述的互连结构，其中所述导热颗粒的平均颗粒尺寸范围是大约1μm至200μm。
8.如权利要求1所述的互连结构，其中所述第一材料的至少一部分被放置为连续穿过所述厚度维度。
9.如权利要求1所述的互连结构，包括多个所述结构，每个结构连续地延伸穿过所述厚度维度。
10.如权利要求9所述的互连结构，其中多个所述结构大体上相互平行，且彼此相互间隔开。
11.如权利要求10所述的互连结构，其中所述第一材料分隔多个所述结构。
12.一种用于从第一主体向第二主体转移热能和电能的方法，所述方法包括：
(a)提供互连结构，该互连结构包括：
(i)第一表面、第二表面和限定在所述第一表面和第二表面之间的厚度维度；
(ii)第一材料，其热导率至少约0.5W/m·K；以及
(iii)第二材料，其电阻低于约10000欧姆，所述第二材料以一种或更多种不同的结构形成，所述结构形成穿过所述厚度维度的所述第二材料的至少一条大体上连续的路径，
其中所述互连结构具有沿着厚度轴的低于约100psi的压缩模量；
(b)在所述第一主体和所述第二主体之间放置所述互连结构，使得所述第一表面与所述第一主体热接触以及电接触，并且使得所述第二表面与所述第二主体热接触以及电接触。
13.如权利要求11所述的方法，其中所述第一主体是产热元件。
14.如权利要求12所述的方法，其中所述第二主体是热沉。
15.如权利要求12所述的方法，其中所述第一材料是聚合物基体。
16.如权利要求15所述的方法，其中所述聚合物基体由导热颗粒填充，该导热颗粒占聚合物基体重量的大约5％至大约95％。
17.如权利要求12所述的方法，其中所述第一材料的至少一部分被放置为连续穿过所述厚度维度。
18.如权利要求12所述的方法，包括多个所述结构，每个结构连续地延伸穿过所述厚度维度。
19.如权利要求18所述的方法，其中多个所述结构大体上相互平行。
20.如权利要求19所述的方法，其中所述第一材料分隔多个所述结构。
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