CN102446872A - 具有印刷电路的三明治式平面散热器 - Google Patents

具有印刷电路的三明治式平面散热器 Download PDF

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CN102446872A
CN102446872A CN2010105051957A CN201010505195A CN102446872A CN 102446872 A CN102446872 A CN 102446872A CN 2010105051957 A CN2010105051957 A CN 2010105051957A CN 201010505195 A CN201010505195 A CN 201010505195A CN 102446872 A CN102446872 A CN 102446872A
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printed circuit
percent
ranging
sandwich
substrate
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王建梅
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SHANGHAI LINGHAO ENVIRONMENTAL PROTECTION TECHNOLOGY DEVELOPMENT CO LTD
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SHANGHAI LINGHAO ENVIRONMENTAL PROTECTION TECHNOLOGY DEVELOPMENT CO LTD
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Priority to CN2010105051957A priority Critical patent/CN102446872A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明属于散热范畴，尤其是关于一种具有印刷电路的三明治式平面散热器，由印刷电路和平面散热器组成，其特征在于：该三明治式平面散热器由厚度≤2mm的基板和粘接在基板上下两面的厚度≤1mm的碳纳米材料的导热散热层组成，该碳纳米材料为纯度99％的碳纳米管和纳米石墨，该碳纳米管的内径为30～60nm，长度为5～10μm，含量40～70％(重量百分)；该纳米石墨的粒径为60～90nm，含量20％～50％(重量百分)，该印刷电路设置在导热散热层表面。解决将电路上的各电子元件的发热量由同一散热器进行散热，以达到电器内腔空间最小化的技术问题。

Description

具有印刷电路的三明治式平面散热器
技术领域：
本发明属于散热范畴，尤其是关于具有印刷电路的三明治式平面散热器。
背景技术：
目前随技术的发展和人们对电子器件功能和携带方便的时尚化追求，电子产品日趋向小型化和薄型化发展，但其功率却不断增大，电子元器件的散热问题已成为一个越来越迫切解决的技术问题。业界也提出不少技术方案，如专利号为ZL98207733.5“双重散热的电脑CPU散热器”采用包括复数片竖立排列并构成蜂窝状竖向孔的热传导金属片的散热器板和轴向风扇。又如专利号为ZL200320118805.3的“散热器”包括一基体；多个散热鳍片，该散热鳍片从基体一表面沿远离基体的方向延伸；多个碳纳米管，该碳纳米管形成于散热鳍片表面，其中该多个碳纳米管彼此基本平行且基本垂直于散热鳍片。这些散热器有一个共同点是它们的散热结构是沿高度延伸，而现今电子产品却高度有限，例如手提电脑、手机等愈来愈薄，所以这种沿高度方向延伸的散热结构形成的散热器与电子产品发展的趋势不相容。
发明内容：
本发明的目的在于提供一种具有印刷电路的三明治式平面散热器，解决将电路上的各电子元件的发热量由同一散热器进行散热，以达到电器内腔空间最小化的技术问题。
本发明解决上述技术问题的技术方案是：
一种具有印刷电路的三明治式平面散热器，由印刷电路和平面散热器组成，其特征在于：该三明治式平面散热器由厚度≤2mm的基板和粘接在基板上下两面的厚度≤1mm的碳纳米材料的导热散热层组成，该碳纳材料为纯度99％的碳纳米管和纳米石墨，该碳纳米管的内径为30～60nm，长度为5～10μm，含量40～70％(重量百分)；该石墨的粒径为60～90nm，含量20％～50％(重量百分)；该印刷电路设置在导热散热层表面。
该基板为塑料板、树脂板或金属板。
本发明的有益效果在于：
将印刷电路设置在平面散热器上可以取消各电子器元件分散的散热机构，大为缩小其体积，利于仓储和运输，而且简化元器件制造工艺和成本。
可将平面散热器的面积扩大至几乎与电器底座面积相等，充分利用电器内部一切可利用的空间。
可将元器件合理设置在基板上面、下面、或上下两面，达到优化设计。
附图说明：
图1是本发明的立体视图。
具体实施方式：
请参阅图1所示，本发明为一个三层板状的三明治式结构，其中间为基板2，上下两面为导热散热层1和3。基板2为塑料板、树脂板或金属板，其厚度≤2mm，起支撑作用。在基板2的上表面和下表面分别用粘接剂粘接有厚度≤1mm的碳纳米材料组成的导热散热层1和3。碳纳米材料为纯度99％的碳纳米管和纳米石墨。碳纳米管的内径为30～60nm，长度为5～10μm，含量40～70％(重量百分)；纳米石墨的粒径为60～90nm，含量为20％～50％(重量百分)。将碳纳米管和纳米石墨用5％～10％(重量百分)的粘接剂搅匀后粘接在基板2两面。印刷电路4用导热绝缘胶设置在该导热散热层1和/或3的表面。
本发明的平面双向的传热散热效果十分优良，例如：功率7瓦的LED灯连结在本发明的印刷电路4上，其中心温度从原来的110℃迅速降至58℃。

Claims (2)

1.一种具有印刷电路的三明治式平面散热器，由印刷电路和平面散热器组成，其特征在于：该三明治式平面散热器由厚度≤2mm的基板和粘接在基板上下两面的厚度≤1mm的碳纳米材料的导热散热层组成，该碳纳米材料为纯度99％的碳纳米管和纳米石墨，该碳纳米管的内径为30～60nm，长度为5～10μm，含量40～70％(重量百分)；该纳米石墨的粒径为60～90nm，含量20％～50％(重量百分)，该印刷电路设置在导热散热层表面。
2.根据权利要求1所述的一种具有印刷电路的三明治式平面散热器，其特征在于：该基板为塑料板、树脂板或金属板。
CN2010105051957A 2010-10-13 2010-10-13 具有印刷电路的三明治式平面散热器 Pending CN102446872A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102958273A (zh) * 2012-10-23 2013-03-06 陈伟杰 Pcb板
CN103196048A (zh) * 2013-01-14 2013-07-10 杨渊翔 一种广角发光led灯管
CN103625035A (zh) * 2013-11-26 2014-03-12 昆山汉品电子有限公司 一种碳纳米管散热体及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1896674A (zh) * 2005-07-11 2007-01-17 佛山市顺德区汉达精密电子科技有限公司 以纳米碳管涂层提高金属散热片散热速度的方法
US20070126116A1 (en) * 2004-08-24 2007-06-07 Carlos Dangelo Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a Surface
CN101083234A (zh) * 2006-05-26 2007-12-05 香港科技大学 具有排列整齐的碳纳米管阵列的散热结构及其制造和应用
JP2010050170A (ja) * 2008-08-19 2010-03-04 Panasonic Corp 熱伝導シート、半導体装置およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070126116A1 (en) * 2004-08-24 2007-06-07 Carlos Dangelo Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a Surface
CN1896674A (zh) * 2005-07-11 2007-01-17 佛山市顺德区汉达精密电子科技有限公司 以纳米碳管涂层提高金属散热片散热速度的方法
CN101083234A (zh) * 2006-05-26 2007-12-05 香港科技大学 具有排列整齐的碳纳米管阵列的散热结构及其制造和应用
JP2010050170A (ja) * 2008-08-19 2010-03-04 Panasonic Corp 熱伝導シート、半導体装置およびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102958273A (zh) * 2012-10-23 2013-03-06 陈伟杰 Pcb板
CN102958273B (zh) * 2012-10-23 2015-10-28 陈伟杰 Pcb板
CN103196048A (zh) * 2013-01-14 2013-07-10 杨渊翔 一种广角发光led灯管
CN103625035A (zh) * 2013-11-26 2014-03-12 昆山汉品电子有限公司 一种碳纳米管散热体及其制备方法

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Application publication date: 20120509