CN101910224B - 纳米粒子、乙烯基单体和有机硅的共聚物 - Google Patents
纳米粒子、乙烯基单体和有机硅的共聚物 Download PDFInfo
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Abstract
本发明涉及一种共聚物,其包含(a)(甲基)丙烯酸酯官能化纳米粒子、(b)乙烯基单体和(c)有机硅大分子单体的反应产物。所述(甲基)丙烯酸酯官能化纳米粒子选自二氧化硅纳米粒子、氧化锆纳米粒子、二氧化钛纳米粒子以及它们的组合。
Description
技术领域
本发明涉及纳米粒子、乙烯基单体和有机硅的共聚物。
背景技术
在本领域中已知有机硅-乙烯基共聚物用作压敏粘合剂(PSA)产品的防粘涂层,此有机硅-乙烯基共聚物包括那些具有乙烯基聚合物主链和有机硅侧基(参见例如美国专利No.4,728,571(Clemens等人))以及那些具有有机硅聚合物主链和丙烯酸酯侧基(参见例如美国专利No.5,202,190(Kantner等人))的有机硅-乙烯基共聚物。然而,当这些防粘涂层经受相对较高的温度(例如,高于约50℃的温度)时,PSA产品中会积聚不期望的剥离力和片层去除力和/或丧失粘附力。
发明内容
鉴于上述情况,我们认识到本领域需要这样的有机硅-乙烯基共聚物:当用作防粘涂层时,该有机硅-乙烯基共聚物不如常规有机硅-乙烯基共聚物那样对相对较高温度敏感。
简而言之,本发明提供包含(a)(甲基)丙烯酸酯官能化纳米粒子、(b)乙烯基单体和(c)有机硅大分子单体的反应产物的共聚物。该(甲基)丙烯酸酯官能化纳米粒子选自二氧化硅纳米粒子、氧化锆纳米粒子、二氧化钛纳米粒子以及它们的组合。该有机硅大分子单体由下式表示:
X-(Y)n-Si(R)3-mZm
其中:
X为乙烯基,
Y为二价连接基团,
n为0或1,
R为氢、烷基、芳基或烷氧基,
m为1至3的整数,以及
Z为具有约1,000以上数均分子量的单价有机硅聚合物部分,并且在共聚条件下基本上不起化学反应。
如本文所用,术语“(甲基)丙烯酰基”、“(甲基)丙烯酸酯”和“(甲基)丙烯酸”分别指丙烯酰基和甲基丙烯酰基、丙烯酸酯和甲基丙烯酸酯、以及丙烯酸和甲基丙烯酸。
本发明的共聚物可用作防粘涂层。与包含常规有机硅-乙烯基共聚物的防粘涂层相比,包含本发明共聚物的防粘涂层在相对较高温度下更稳定。此外,包含本发明共聚物的防粘涂层在压敏粘合剂(PSA)从该防粘涂层中剥离时,呈现出稳定的剥离力。
具体实施方式
本发明的共聚物包含(甲基)丙烯酸酯官能化二氧化硅纳米粒子、乙烯基单体和有机硅大分子单体的反应产物。
(甲基)丙烯酸酯官能化纳米粒子
可用于本发明共聚物中的纳米粒子包括二氧化硅、氧化锆或二氧化钛。二氧化硅、氧化锆或二氧化钛纳米粒子经(甲基)丙烯酸酯表面改性,以允许该官能化纳米粒子与反应性乙烯基单体和有机硅大分子单体共聚合。优选地,(甲基)丙烯酸酯官能化纳米粒子为二氧化硅纳米粒子。
通常,可用于本发明的纳米粒子的特征在于具有约1nm至高达约150nm的平均粒径尺寸。如本文所用,术语“纳米粒子直径”(或“纳米粒子尺寸”)是指纳米粒子的最大横截面尺寸。优选地,这些纳米粒子的形状大体上为球形,大小相对均匀,并且这些纳米粒子大体上保持非聚集状态。
氧化锆纳米粒子通常具有约5至约150nm(优选地,约5至约75nm;更优选地,约5至约25nm;最优选地,约5至约15nm)的粒度。可用于本发明的氧化锆纳米粒子可以产品名NalcoTMOOSSOO8从NalcoCompany(Naperville,IL)商购获得以及以产品名WO或WOS从Buhler(Uzweil,Switzerland)商购获得。氧化锆纳米粒子还可按照美国专利No.7,241,437(Davidson等人)中描述的方法制备。
二氧化钛纳米粒子通常具有约5至约50nm(优选地,约5至约15nm;更优选地,约10nm)的粒径尺寸。可用于本发明的二氧化钛纳米粒子可从mknano(M.K.Impex Cananda(Ontario)分部)商购获得。
二氧化硅纳米粒子通常具有约5nm至高达约100nm(优选地,约5nm至约20nm;更优选地,约5nm、约8nm、或约20nm)的粒径尺寸。
可用于本发明的可官能化的二氧化硅纳米粒子的优选类别为二氧化硅、氧化锆或二氧化钛的溶胶。无定形、半结晶和/或结晶二氧化硅溶胶尤其可用。此类溶胶可通过多种技术制备并可为多种形式,其中包括水溶胶(其中水用作液体介质)、有机溶胶(其中使用有机液体)和混合溶胶(其中液体介质包含水和有机液体)。有关技术和形式的说明在例如美国专利No.2,801,185(Iler)、4,522,958(Das等人)和5,648,407(Goetz等人)中有所描述。
可用的二氧化硅纳米粒子还可作为胶态分散体或溶胶从例如NalcoCompany(Naperville,IL)(例如,NalcoTM1040、1042、1050、1060、1130、2326、2327和2329胶态二氧化硅)和W.R.Grace & Co.(例如LudoxTM胶态二氧化硅)供应商处商购获得。优选的可商购获得的二氧化硅纳米粒子包括NalcoTM 1130、NalcoTM 2326和NalcoTM 2327。最优选NalcoTM 1130二氧化硅纳米粒子。
(甲基)丙烯酸酯官能化二氧化硅纳米粒子可使用例如(甲基)丙烯酸酯硅烷偶联剂等偶联剂制备。优选的偶联剂包括(例如)3-烯丙氧丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷(A-174硅烷)、γ-甲基丙烯酰氧基丙基三甲氧基硅烷(Z-6030硅烷)和甲基丙烯酰氧基丙基二甲基氯硅烷(M-8542硅烷)。A-174硅烷是最优选的硅烷偶联剂。
甲基丙烯酰氧基硅烷表面官能化二氧化硅溶胶的制备在例如美国专利No.7,101,616(Arney等人)中有所描述。丙烯酰氧基硅烷和甲基丙烯酰氧基硅烷表面官能化纳米粒子的制备在例如WO 2006/073856中有所描述。
优选的(甲基)丙烯酸酯官能化二氧化硅纳米粒子可由以下通式表示:
乙烯基单体
可用于制备本发明共聚物的乙烯基单体的例子包括(但不限于)(甲基)丙烯酸酯、烯丙基化合物、乙烯基醚、乙烯基酯等。可用的乙烯基单体包括(例如)(甲基)丙烯酸羟乙酯、(甲基)丙烯酸羟丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸羟己酯、(甲基)丙烯酸羟癸酯、(甲基)丙烯酸羟十二烷基酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸、N-乙烯基-2-吡咯烷酮和羟丙基(甲基)丙烯酸、2-甲基丙烯酰氧基丙基三甲氧硅烷、3-甲基丙烯酰氧基丙基三乙氧基硅烷、3-丙烯酰氧基丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三氯硅烷、(甲基)丙烯酸环氧丙酯、丙烯腈、N-羟甲基甲基丙烯酰胺、N-羟甲基丙烯酰胺等。
优选的单体包括(例如)(甲基)丙烯酸酯单体、苯乙烯、丙烯酸、丙烯腈、N-乙烯基吡咯烷酮以及它们的混合物。更优选的单体包括(例如)(甲基)丙烯酸甲酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸十八烷基酯、苯乙烯、(甲基)丙烯酸、丙烯腈、N-乙烯基吡咯烷酮以及它们的混合物
优选地,使用(甲基)丙烯酸酯单体;更优选地,使用丙烯酸甲酯和丙烯酸。
有机硅大分子单体
可用于制备本发明共聚物的有机硅大分子单体为具有单个官能团(即乙烯基)的端部官能化聚合物。可用的有机硅大分子单体在例如美国专利No.4,728,571(Clemens等人)中有所描述。此类大分子单体可由下式表示:
X-(Y)n-Si(R)3-mZm
其中:
X为乙烯基,
Y为二价连接基团,
n为0或1,
R为氢、烷基、芳基或烷氧基,
m为1至3的整数,以及
Z为具有约1,000以上数均分子量的单价有机硅聚合物部分,并且在共聚条件下基本上不起化学反应。
优选的有机硅大分子单体还可进一步定义为具有由以下通式表示的X基团:
其中R1为氢或COOH,并且R2为氢、甲基或CH2COOH。
Z基团具有以下通式:
其中R3和R5独立地为烷基、芳基或氟代烷基,R4为烷基、烷氧基、烷基氨基、芳基、羟基或氟代烷基,并且r为约5至约700的整数。优选地,R3和R5独立地为甲基、乙基或丙基。
优选地,有机硅大分子单体具有选自以下通式的通式,其中m为1、2或3;p为0或1;R”为烷基或氢;并且X、R和Z如上定义:
其中q为2至6的整数;
X-Si(R)3-mZm;
其中q为0至2的整数;
其中q为2至6的整数;
其中q为2至6的整数。
优选地,有机硅大分子单体具有约1,000至约50,000(更优选约5,000至约25,000;最优选约10,000)的分子量。
特别优选的有机硅大分子单体可由下式表示:
其中t为约10至约400。
有机硅大分子单体(或“大分子单体”)是本领域已知的,并且可通过例如美国专利No.3,786,116(Milkovich等人)和3,842,059(Milkovich等人)中所公开的方法制备。聚二甲基有机硅大分子单体的制备以及后续与乙烯基单体的共聚己在Y.Yamashita等人撰写的数篇论文中有所描述(例如,在Polymer J.14,913(1982)(聚合物杂志,第14卷第913页,1982年);ACS Polymer Preprints 25(1),245(1984)(ACS聚合物预印本,第25卷第1期第245页,1984年);Makromol.Chem.185,9(1984)(高分子化学,第185卷第9期,1984年)中有所描述)。此大分子单体制备方法涉及用以形成分子量可控的活性聚合物的六甲基环三有机硅单体(D3)的阴离子聚合反应,以及通过包含可聚合乙烯基的氯硅烷化合物实现的终止反应。
用于上述阴离子聚合反应的合适单体通常为下式的二有机环有机硅
其中R3和R5如此前所定义,其中r为3至7的整数。优选的为环状有机硅,其中r为3或4,并且R3和R5均为甲基,这些环状有机硅在下文中分别指定为D3和D4。D3为具有张力的环状结构,是特别优选的结构。
对阴离子聚合反应的引发剂进行选择,使得可制备一官能活性聚合物。合适的引发剂包括碱金属碳氢化合物,例如烷基锂、烷基钠或烷基钾、或者芳基锂、芳基钠或芳基钾化合物,其中烷基或芳基中包含高达20个碳原子或更多,优选包含高达8个碳原子。此类化合物的例子包括乙基钠、丙基钠、苯基钠、丁基钾、辛基钾、甲基锂、乙基锂、正丁基锂、仲丁基锂、叔丁基锂、苯基锂和2-乙基己基锂。优选锂化合物作为引发剂。还适宜作为引发剂的有:碱金属醇盐、氢氧化物和酰胺,以及由下列化学式表示的三有机硅醇盐
其中M为碱金属、四烷基铵或四烷基鏻阳离子,并且其中R3、R4和R5如此前所定义。优选的三有机硅醇盐引发剂为三甲基硅醇锂(LTMS)。通常,优选使用张力环状单体和锂引发剂来降低再分配反应的可能性,并因此形成窄分子量分布的有机硅大分子单体,从而合理地避免不需要的环状低聚物。
通过引发剂/环状单体比率来确定分子量,因此引发剂的量的变化范围可以为约0.004至约0.2摩尔有机金属引发剂/摩尔单体。优选地,引发剂的量为约0.008至约0.04摩尔引发剂/摩尔单体。
在阴离子聚合反应的引发阶段,可采用惰性有机溶剂,优选极性有机溶剂。使用锂抗衡离子进行的阴离子聚合的链增长要求强极性溶剂(例如四氢呋喃、二甲基亚砜或六甲基磷酰三胺)或此类极性溶剂与非极性脂肪族、环脂族或芳香烃溶剂(例如己烷、庚烷、辛烷、环己烷或甲苯)的混合物。极性溶剂用于“活化”硅醇盐离子,从而实现链增长。
一般来讲,该聚合反应可在约-20℃至约100℃、优选地约-10℃至约30℃的温度范围内进行。通常要求无水条件和惰性气氛,例如氮气、氦气或氩气。
阴离子聚合反应的终止通常通过活性聚合阴离子与含有卤素的终止剂(即官能化氯硅烷)直接反应以生成乙烯基封端的聚合单体来实现。此类终止剂可由通式X-(Y)n-Si(R)3-mClm表示,其中m为1、2或3,并且其中X、Y、n和R已在此前定义。优选的终止剂为甲基丙烯酰氧基丙基二甲基氯硅烷。通过在聚合温度下向活性聚合物添加摩尔数稍微过量的终止剂(相对于引发剂的量)进行终止反应。根据上述Y.Yamashita等人的论文,为了提高大分子单体的官能度,可在添加完终止剂后对反应混合物进行超声波照射。可通过在甲醇中沉淀来进行大分子单体的纯化。
共聚物
本发明将二氧化硅纳米粒子聚合到乙烯基部分,从而提供乙烯基-有机硅接枝共聚物。一般来讲,本发明的共聚物可由下式表示:
其中:
表示二氧化硅纳米粒子,
R’为-X-(Y)n-Si(R)3-mZm,其中X、Y、n、R、m和Z如上文所述,并且
Q为具有约500至约100,000(优选约4,000至约20,000)平均分子量的乙烯基聚合链段。
优选地,Q为由选自(甲基)丙烯酸酯单体、苯乙烯、丙烯酸、丙烯腈、N-乙烯基吡咯烷酮以及它们的混合物的单体形成的无规共聚物。更优选地,Q为由选自(甲基)丙烯酸甲酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸十八烷基酯、苯乙烯、(甲基)丙烯酸、丙烯腈、N-乙烯基吡咯烷酮以及它们的混合物的单体所形成的。优选地,Q具有约4,000至约20,000的平均分子量。
优选地,X、Y、n、R、m和Z为如上所述。更优选地,R’为
其中t为约10至约400。
本领域的技术人员将知道,所给出的上式仅表示本发明的一种可能共聚物,并非旨在限制本发明的共聚物。本领域的技术人员将知道(例如)二氧化硅粒子可具有多于或少于四个乙烯基-有机硅共聚物附接“支链”,并且某些-OH基团可进一步反应和交联。
方法
本发明的共聚物可通过例如美国专利No.Re.24,906(Ulrich)中描述的常规自由基聚合进行共聚。将单体溶解在惰性有机溶剂中,并利用合适的自由基引发剂(可通过加热或光化学方式活化)将其聚合。此类引发剂包括偶氮化合物(例如2,2-偶氮-二(异丁腈))、氢过氧化物(例如氢过氧化叔丁基)和过氧化物(例如过氧化苯甲酰或过氧化环己酮)。所使用的引发剂的量通常为可聚合组合物总重量的约0.01至约5重量%。
自由基共聚反应中所用的有机溶剂可以是对反应物和产物具有惰性并且不会对反应产生其他不利影响的任何有机液体。合适的溶剂包括乙酸乙酯以及例如乙酸乙酯与甲苯、庚烷与甲苯和异丙醇、庚烷与甲苯和甲醇的混合物。也可使用其他溶剂体系。溶剂的量一般为反应物和溶剂的总重量的约30-80重量%。除溶液聚合法外,还可通过其他熟知的技术,例如悬浮聚合法、乳液聚合法和本体聚合法进行共聚。
优选的接枝技术涉及(甲基)丙烯酸酯官能化纳米粒子、乙烯基单体和有机硅大分子单体的共聚。然而,也可采用其他接枝技术。
乙烯基单体装料、引发剂、有机硅大分子单体、官能化二氧化硅纳米粒子和溶剂可加入到任何合适的容器中。通常,按乙烯基单体、有机硅大分子单体和纳米粒子的总重量计,有机硅大分子单体含量为约5至约60重量%,纳米粒子含量为约1至约10重量%。
在一些实施例中,(甲基)丙烯酸酯官能化二氧化硅纳米粒子与乙烯基单体和有机硅大分子单体的重量比为约10∶90或更低(优选约5∶95或更低;更优选约2∶98)。在一些实施例中,有机硅大分子单体与乙烯基单体的重量比介于约10∶90和约40∶60之间。
必要或需要时,本发明的共聚物可与相容的改性剂共混以优化物理特性。这种改性剂的使用在本领域是常见的。例如,可能需要包含诸如颜料、填充剂、稳定剂或各种聚合物添加剂之类的材料。
用涂
出人意料的是,乙烯基单体、有机硅大分子单体和(甲基)丙烯酸酯官能化纳米粒子的聚合反应不会导致胶凝。凝胶是单个大分子通过聚合物链的交联形成的无限网状结构,因而在低于其分解温度的温度下不溶于任何溶剂(参见(例如)Principles of Polymerization,3rd ed.,Wiley&Sons,p.108,(1991)(《聚合原理》,第三版,Wiley & Sons,第108页,1991年))。
因此本发明的共聚物可用于可涂覆型组合物中。如本文所用,术语“可涂覆型”或“可涂覆型组合物”是指组合物可溶于或可分散于溶剂或水中并且基本上无凝胶,并且可使用标准涂覆方法涂覆到基底上。如果需要,该可涂覆型组合物在涂覆基底前可在液体(例如,水和/或有机溶剂)中稀释或分散。优选地,按涂层组合物重量计,该涂层组合物包含约2至约20%的固体(更优选约5至约10%)。
可通过标准方法,例如喷涂、填充、浸渍、辊涂、刷涂或尽染将可涂覆型组合物涂覆到基底(或具有基底的制品)上。然后组合物可经过干燥除去任何残余的水或溶剂。
该可涂覆型组合物可用作防粘涂层,并且可涂覆到要求对粘合剂具有防粘特性的表面上。本发明的防粘组合物的一种制备方法提供高纯度共聚物,其可由聚合反应溶剂直接涂覆。所得涂层不需要固化或交联。然而,如果特定应用需要耐溶剂性,则可以通过本领域熟知的标准方法,例如辐射固化(电子束或紫外线)或化学交联实现交联。
本发明的防粘涂层最适于用作固体基底(可为片材、纤维或成型物体)的涂层。然而,优选的基底为用于压敏粘合剂产品的柔性基底。合适的基底包括纸张、金属薄片和金属箔、无纺布以及热塑性树脂(例如聚酯、聚酰胺、聚烯烃、聚碳酸酯、聚氯乙烯等)膜,但可以使用任何要求对粘合剂具有防粘作用的表面。可使用本领域已知的引物来帮助将涂层粘附到基底上,但它们一般并不是必需的。
防粘涂层组合物可通过常规涂层技术涂覆到合适的基底上。所得涂层对广泛的常规压敏粘合剂(例如天然橡胶基、丙烯酸系和其它合成成膜弹性体粘合剂)具有有效的防粘特性。防粘涂层组合物会形成稳定的剥离力和良好的再粘附力,即使是在高温和潮湿的条件下。
防粘涂层组合物尤其可用于隔离衬垫和涂层片材(例如,具有覆盖其第一主表面的至少一部分的防粘涂层和覆盖其第二主表面的至少一部分的粘合剂的柔性片材)中。有利的是,在涂层片材上的本发明的防粘涂层可接受水基和油基油墨(例如,墨水笔和记号笔)。
实例
下面的实例进一步说明了本发明的目的和优点,但是在这些实例中叙述的具体材料及其用量,以及其他条件和细节不应当被不当地解释为是对本发明的限制。
材料
指示词 | 名称、化学式和/或结构 | 可得性 |
MEK | 甲基乙基酮 | Sigma-Aldrich |
乙醇 | C2H5OH | Sigma-Aldrich |
甲醇 | CH3OH | Sigma-Aldrich |
SiMac | 甲基丙烯酰氧基丙基聚二甲基有机硅 | Shin-Etsu |
VAZO-64 | 偶氮二异丁腈 | DuPont |
异辛基硅烷 | Sigma-Aldrich | |
Prostab 5198 | 聚合抑制剂 | CIBA |
MMA | 甲基丙烯酸甲酯 | Sigma-Aldrich |
IBMA | 甲基丙烯酸异丁酯 | Sigma-Aldrich |
A-174 | 3-甲基丙烯酰氧基丙基三甲氧基硅烷 | Sigma-Aldrich |
合成甲基丙烯酰改性的(A-174改性的)5nm二氧化硅粒子
将Nalco 2326二氧化硅溶胶(400g)、异辛基硅烷(5.4g)、A-174硅烷(32.6g)、乙醇/甲醇的80/20混合物(320g)和ProStabTM5198(.016g)加入配备有搅拌器、真空泵、冷水冷凝器和热油浴的3颈1升圆底烧瓶中。Therm-o-Watch(TOW)控制器用于热油浴中。使分散体回流四小时,其中TOW设置在80℃。然后采用真空蒸馏法使分散体通过溶剂交换从水和醇转移至MEK中。所得表面改性纳米二氧化硅分散体为MEK中含大约35%的固体。
合成甲基丙烯酰改性的(A-174改性的)8nm二氧化硅粒子
将Nalco 1130二氧化硅溶胶(400g)、异辛基硅烷(6.0g)、A-174(36.7g)、乙醇/甲醇的80/20混合物(320g)和ProStabTM 5198(.016g)加入配备有搅拌器、真空泵、冷水冷凝器和热油浴的3颈1升圆底烧瓶中。Therm-o-Watch(TOW)控制器用于热油浴中。使分散体回流四小时,其中TOW设置在80℃。然后采用真空蒸馏法使分散体通过溶剂交换从水和醇转移至MEK中。所得表面改性纳米二氧化硅分散体为MEK中含大约32.2%的固体。
比较例1:合成SiMac/IBMA
将72g SiMac、48g IBMA、180g MEK和0.3602g VAZO-64加入细口夸脱瓶中。在所得均匀混合物中通入N25分钟。密封该瓶并将其置于55℃热水浴中振荡24小时。最终固体在MEK中的含量为39.1%。
实例1:合成S iMac/IBMA/A-174(60/35/5)改性的5nm二氧化硅:
将72g SiMac、42g IBMA(甲基丙烯酸异丁酯)、17.14g A-174改性的二氧化硅(MEK中含35%的固体)、168.86g MEK和0.3602g VAZO64加入细口夸脱瓶中。在所得均匀混合物中通入N25分钟。密封该瓶并将其置于55℃热水浴中振荡24小时。最终固体在MEK中的含量为39.4%。未观察到凝胶。
比较例2:合成MA/NVP/SiMac/AA
将23.5g MA(丙烯酸甲酯)、18.3g NVP(N-乙烯基吡咯烷酮)、2.6g AA(丙烯酸)、15.7g SiMac、160g MEK和0.1809g VAZO 64加入细口夸脱瓶中。在所得均匀混合物中通入N25分钟。密封该瓶并将其置于55℃热水浴中振荡24小时。最终固体含量为29.1%。在涂覆到聚对苯二甲酸乙二醇酯(PET)上之前,用IPA/甲苯的50/50共混物将该溶液稀释到含12.5%固体。
实例2:合成MA/NVP/SiMac/AA/A-1745nm改性的二氧化硅
将23.1g MA(丙烯酸甲酯)、17.9g NVP(N-乙烯基吡咯烷酮)、2.6g AA(丙烯酸)、15.4g SiMac、2.9g A-174改性的二氧化硅(MEK中含35%的固体)、158g MEK和0.1809g VAZO 64加入细口夸脱瓶中。在所得均匀混合物中通入N25分钟。密封该瓶并将其置于55℃热水浴中振荡24小时。最终固体含量为29.2%。在涂覆到PET上之前,用IPA/甲苯的50/50共混物将该溶液稀释到含12.5%固体。
实例3:合成MA/NVP/SiMac/AA/A-1745nm改性的二氧化硅
将22.5g MA(丙烯酸甲酯)、17.5g NVP(N-乙烯基吡咯烷酮)、2.5g AA(丙烯酸)、15g SiMac、7.2g A-174改性的二氧化硅(MEK中含35%的固体)、155.3g MEK和0.1809g VAZO 64加入细口夸脱瓶中。在所得均匀混合物中通入N25分钟。密封该瓶并将其置于55℃热水浴中振荡24小时。最终固体含量为29.1%。在涂覆到PET上之前,用IPA/甲苯的50/50共混物将该溶液稀释到含12.5%固体。
粘附力测试
使用3号Meyer棒将比较例2以及实例2和3的溶液涂覆到PET(1.4密耳2SAB,得自Mitsubishi)上,所得涂层在65℃下干燥30分钟。将该涂层紧靠Post-itTM画架垫(Post-itTMEasel Pad)(得自3M公司)层合,并在20.7MPa(3000psi)下受压30秒。在21℃恒温和50%恒湿(恒温恒湿)下老化5天以及在49℃下老化5天后,按照ASTM D3330,将被粘合剂涂覆的1″(2.54cm)带从本发明的防粘涂层上移除或剥离,然后层合到玻璃板上测量粘附力。粘附力结果列于下表。
在不脱离本发明的范围和精神的前提下,对本发明的各种修改和更改对于本领域技术人员将是显而易见的。应该理解,本发明不限于以上提供的示例性实施例和实例,上述实例和实施例仅以举例的方式提出,而且本发明的范围仅受以下所附的权利要求书的限制。
Claims (27)
1.一种共聚物,包含以下物质的反应产物:
(a)(甲基)丙烯酸酯官能化纳米粒子,所述(甲基)丙烯酸酯官能化纳米粒子选自二氧化硅纳米粒子、氧化锆纳米粒子、二氧化钛纳米粒子以及它们的组合,
(b)乙烯基单体,以及
(c)有机硅大分子单体,所述有机硅大分子单体由下式表示:
X-(Y)n-Si(R)3-mZm
其中:
X为乙烯基,
Y为二价连接基团,
n为0或1,
R为氢、烷基、芳基或烷氧基,
m为1至3的整数,以及
Z为具有1,000以上数均分子量的单价有机硅聚合物部分,并且在共聚条件下不起化学反应。
2.根据权利要求1所述的共聚物,其中所述(甲基)丙烯酸酯官能化纳米粒子为二氧化硅纳米粒子。
3.根据权利要求2所述的共聚物,其中所述(甲基)丙烯酸酯官能化纳米粒子为二氧化硅纳米粒子和3-甲基丙烯酰氧基丙基三甲氧基硅烷的反应产物。
5.根据权利要求2所述的共聚物,其中所述纳米粒子具有介于5nm和100nm之间的平均粒径尺寸。
6.根据权利要求5所述的共聚物,其中所述纳米粒子具有5nm、8nm或20nm的平均粒径尺寸。
8.根据权利要求1所述的共聚物,其中R为甲基、乙基或丙基。
10.根据权利要求9所述的共聚物,其中R3和R5独立地为甲基、乙基或丙基。
12.根据权利要求1或权利要求11所述的共聚物,其中所述有机硅大分子单体具有1,000至50,000的数均分子量。
13.根据权利要求1所述的共聚物,其中所述乙烯基单体选自(甲基)丙烯酸酯、苯乙烯、(甲基)丙烯酸、丙烯腈、N-乙烯基吡咯烷酮以及它们的混合物。
14.根据权利要求13所述的共聚物,其中所述乙烯基单体选自(甲基)丙烯酸甲酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸十八烷基酯、苯乙烯、(甲基)丙烯酸、丙烯腈、N-乙烯基吡咯烷酮以及它们的混合物。
15.根据权利要求1所述的共聚物,其中所述共聚物的所述乙烯基单体的聚合链段具有500至100,000的平均分子量。
16.根据权利要求1所述的共聚物,其中(甲基)丙烯酸酯官能化二氧化硅纳米粒子与乙烯基单体和有机硅大分子单体的重量比为10∶90或更低。
17.根据权利要求16所述的共聚物,其中(甲基)丙烯酸酯官能化二氧化硅纳米粒子与乙烯基单体和有机硅大分子单体的所述重量比为5∶95或更低。
18.根据权利要求17所述的共聚物,其中(甲基)丙烯酸酯官能化二氧化硅纳米粒子与乙烯基单体和有机硅大分子单体的所述重量比为2∶98。
19.根据权利要求1所述的共聚物,其中有机硅大分子单体与乙烯基单体的重量比介于10∶90和40∶60之间。
20.一种组合物,其包含根据权利要求1所述的共聚物,其中所述组合物为可涂覆型。
21.根据权利要求20所述的组合物,其中所述组合物为防粘涂层。
22.一种制品,其包括具有一个或多个表面的基底,所述表面涂覆有根据权利要求20所述的组合物。
23.根据权利要求22所述的制品,其中所述基底选自纸张、金属片、无纺布或热塑性树脂膜。
24.根据权利要求23所述的制品,其中所述金属片是金属箔。
25.根据权利要求23所述的制品,其中所述基底为纸片。
26.根据权利要求22所述的制品,其中所述制品为隔离衬垫。
27.一种包含柔性片材的涂层片材,所述柔性片材具有覆盖其第一主表面的至少一部分的根据权利要求21所述的防粘涂层和覆盖其第二主表面的至少一部分的粘合剂。
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WO2009086079A2 (en) | 2009-07-09 |
KR20100114046A (ko) | 2010-10-22 |
EP2238182A4 (en) | 2011-05-04 |
WO2009086079A3 (en) | 2009-10-08 |
CN101910224A (zh) | 2010-12-08 |
EP2238182A2 (en) | 2010-10-13 |
EP2238182B1 (en) | 2012-08-15 |
US20100323570A1 (en) | 2010-12-23 |
US8492496B2 (en) | 2013-07-23 |
KR101542638B1 (ko) | 2015-08-06 |
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