CN101885096B - 锡焊装置 - Google Patents

锡焊装置 Download PDF

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Publication number
CN101885096B
CN101885096B CN201010174169.0A CN201010174169A CN101885096B CN 101885096 B CN101885096 B CN 101885096B CN 201010174169 A CN201010174169 A CN 201010174169A CN 101885096 B CN101885096 B CN 101885096B
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China
Prior art keywords
gate
jet solder
mentioned
circuit board
solder vessel
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Active
Application number
CN201010174169.0A
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English (en)
Chinese (zh)
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CN101885096A (zh
Inventor
大清水和宪
高口彰
桥本昇
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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CN201010174169.0A 2009-05-14 2010-05-13 锡焊装置 Active CN101885096B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-117667 2009-05-14
JP2009117667A JP5279606B2 (ja) 2009-05-14 2009-05-14 はんだ付け装置

Publications (2)

Publication Number Publication Date
CN101885096A CN101885096A (zh) 2010-11-17
CN101885096B true CN101885096B (zh) 2014-08-06

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CN201010174169.0A Active CN101885096B (zh) 2009-05-14 2010-05-13 锡焊装置

Country Status (2)

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JP (1) JP5279606B2 (ja)
CN (1) CN101885096B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104668707B (zh) * 2015-01-23 2016-08-17 宁夏康诚机电产品设计有限公司 一种焊接用自动浸锡剪角机
JP2017069237A (ja) * 2015-09-28 2017-04-06 千住金属工業株式会社 はんだ付けシステム
CN108941826A (zh) * 2018-09-21 2018-12-07 锐驰机器人（深圳）有限公司 环形振子自动焊锡机器人及其控制方法
JP6928018B2 (ja) * 2019-03-06 2021-09-01 ファナック株式会社 半田付けを行うロボット装置
CN113231735B (zh) * 2021-04-15 2023-06-23 大族激光科技产业集团股份有限公司 切割头避障方法、装置、计算机设备和介质

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139993A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Method and device for soldering printed board
JPH02121768A (ja) * 1988-10-31 1990-05-09 Kenji Kondo 噴流式はんだ槽
JPH0677815B2 (ja) * 1988-12-06 1994-10-05 権士 近藤 噴流式はんだ槽
JPH05102372A (ja) * 1991-10-09 1993-04-23 Hitachi Ltd 板状物はんだ処理方法および装置
JPH0629656A (ja) * 1992-07-10 1994-02-04 Japan Aviation Electron Ind Ltd 自動はんだ付け装置
CN2210511Y (zh) * 1994-09-30 1995-10-18 陈明松 改进结构的自动喷流焊锡机
US5928432A (en) * 1997-09-22 1999-07-27 Lucent Techologies Inc. Method for cleaning electronic components
JP2003158369A (ja) * 2001-11-22 2003-05-30 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法および噴流はんだ槽
JP2003332724A (ja) * 2002-05-13 2003-11-21 Nihon Dennetsu Keiki Co Ltd はんだ波形成装置
US6716290B1 (en) * 2002-12-04 2004-04-06 The United States Of America As Represented By The Secretary Of The Navy Method for removing soldering flux residue from a substrate
JP2005007401A (ja) * 2003-06-16 2005-01-13 Tamura Seisakusho Co Ltd はんだ付け装置
JP4473566B2 (ja) * 2003-12-22 2010-06-02 株式会社タムラ製作所 噴流式はんだ付け装置
BRPI0610697A2 (pt) * 2005-04-06 2010-07-20 Senju Metal Industry Co banho de solda por onda
CN201198150Y (zh) * 2008-05-08 2009-02-25 上海长园电子材料有限公司 切管机安全防护机构
CN101293297A (zh) * 2008-06-17 2008-10-29 杨国金 一种喷射流焊接装置及其应用

Also Published As

Publication number Publication date
JP2010267786A (ja) 2010-11-25
CN101885096A (zh) 2010-11-17
JP5279606B2 (ja) 2013-09-04

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