CN101877938B - 薄板印制电路板加工方法及薄板印制电路板 - Google Patents
薄板印制电路板加工方法及薄板印制电路板 Download PDFInfo
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- CN101877938B CN101877938B CN2009102523559A CN200910252355A CN101877938B CN 101877938 B CN101877938 B CN 101877938B CN 2009102523559 A CN2009102523559 A CN 2009102523559A CN 200910252355 A CN200910252355 A CN 200910252355A CN 101877938 B CN101877938 B CN 101877938B
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- copper bar
- printed circuit
- circuit board
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CN2009102523559A CN101877938B (zh) | 2009-11-26 | 2009-11-26 | 薄板印制电路板加工方法及薄板印制电路板 |
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CN2009102523559A CN101877938B (zh) | 2009-11-26 | 2009-11-26 | 薄板印制电路板加工方法及薄板印制电路板 |
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CN101877938A CN101877938A (zh) | 2010-11-03 |
CN101877938B true CN101877938B (zh) | 2012-05-16 |
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CN2009102523559A Active CN101877938B (zh) | 2009-11-26 | 2009-11-26 | 薄板印制电路板加工方法及薄板印制电路板 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102548198A (zh) * | 2012-03-09 | 2012-07-04 | 昆山亿富达电子有限公司 | 一种适于打件的柔性线路板 |
CN105228336A (zh) * | 2015-08-27 | 2016-01-06 | 深圳崇达多层线路板有限公司 | 一种防成品板翘曲的电路板的制备方法及其电路板 |
CN105611722A (zh) * | 2016-03-21 | 2016-05-25 | 安捷利电子科技(苏州)有限公司 | 一种mems产品的印制电路板 |
CN113784502B (zh) * | 2021-09-06 | 2024-05-28 | 联宝(合肥)电子科技有限公司 | 防弯翘印制电路板及改善印制电路板弯翘的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6380633B1 (en) * | 2000-07-05 | 2002-04-30 | Siliconware Predision Industries Co., Ltd. | Pattern layout structure in substrate |
GB2394365A (en) * | 2002-10-19 | 2004-04-21 | Motorola Inc | Circuit board constructions |
CN101154645A (zh) * | 2006-09-27 | 2008-04-02 | 三星电子株式会社 | 防止翘曲的电路基板及使用它的封装 |
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- 2009-11-26 CN CN2009102523559A patent/CN101877938B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6380633B1 (en) * | 2000-07-05 | 2002-04-30 | Siliconware Predision Industries Co., Ltd. | Pattern layout structure in substrate |
GB2394365A (en) * | 2002-10-19 | 2004-04-21 | Motorola Inc | Circuit board constructions |
CN101154645A (zh) * | 2006-09-27 | 2008-04-02 | 三星电子株式会社 | 防止翘曲的电路基板及使用它的封装 |
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Publication number | Publication date |
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CN101877938A (zh) | 2010-11-03 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518000, Nanshan District, Guangdong, Shenzhen, China bridge, South Shahe City Industrial Zone Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20190305 Address after: 214000 No. 18 Changjiang East Road, Wuxi New District, Jiangsu Province Patentee after: WUXI SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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Effective date of registration: 20230411 Address after: Building 15, No. 18 Changjiang East Road, Shuofang Street, Xinwu District, Wuxi City, Jiangsu Province, 214142 Patentee after: Wuxi Guangxin Packaging Substrate Co.,Ltd. Address before: 214000 No. 18 Changjiang East Road, Wuxi New District, Jiangsu Province Patentee before: WUXI SHENNAN CIRCUITS Co.,Ltd. |
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