CN101840896A - 一种倒装焊高散热球型阵列封装结构 - Google Patents
一种倒装焊高散热球型阵列封装结构 Download PDFInfo
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- CN101840896A CN101840896A CN201010163410A CN201010163410A CN101840896A CN 101840896 A CN101840896 A CN 101840896A CN 201010163410 A CN201010163410 A CN 201010163410A CN 201010163410 A CN201010163410 A CN 201010163410A CN 101840896 A CN101840896 A CN 101840896A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201010163410.XA CN101840896B (zh) | 2010-04-29 | 2010-04-29 | 一种倒装焊高散热球型阵列封装结构 |
Applications Claiming Priority (1)
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CN201010163410.XA CN101840896B (zh) | 2010-04-29 | 2010-04-29 | 一种倒装焊高散热球型阵列封装结构 |
Publications (2)
Publication Number | Publication Date |
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CN101840896A true CN101840896A (zh) | 2010-09-22 |
CN101840896B CN101840896B (zh) | 2014-03-05 |
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CN201010163410.XA Active CN101840896B (zh) | 2010-04-29 | 2010-04-29 | 一种倒装焊高散热球型阵列封装结构 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012174833A1 (zh) * | 2011-06-21 | 2012-12-27 | 中兴通讯股份有限公司 | 塑封芯片及其制造方法 |
CN105811891A (zh) * | 2016-04-20 | 2016-07-27 | 佛山臻智微芯科技有限公司 | 减低移动通信多级功率放大器中带内噪声的结构和方法 |
CN107305875A (zh) * | 2016-04-19 | 2017-10-31 | 现代摩比斯株式会社 | 双向半导体封装件 |
CN112185916A (zh) * | 2020-09-29 | 2021-01-05 | 西安微电子技术研究所 | 一种倒装焊芯片的双通道气密性封装结构及其工艺 |
CN113192936A (zh) * | 2021-04-23 | 2021-07-30 | 泓林微电子(昆山)有限公司 | 一种双面芯片封装结构 |
CN113675093A (zh) * | 2021-07-14 | 2021-11-19 | 复旦大学 | 一种双面塑封的散热结构的封装设计及制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641865A (zh) * | 2004-01-09 | 2005-07-20 | 日月光半导体制造股份有限公司 | 覆晶封装体 |
US7615862B2 (en) * | 2004-10-20 | 2009-11-10 | Siliconware Precision Industries Co., Ltd. | Heat dissipating package structure and method for fabricating the same |
-
2010
- 2010-04-29 CN CN201010163410.XA patent/CN101840896B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1641865A (zh) * | 2004-01-09 | 2005-07-20 | 日月光半导体制造股份有限公司 | 覆晶封装体 |
US7615862B2 (en) * | 2004-10-20 | 2009-11-10 | Siliconware Precision Industries Co., Ltd. | Heat dissipating package structure and method for fabricating the same |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012174833A1 (zh) * | 2011-06-21 | 2012-12-27 | 中兴通讯股份有限公司 | 塑封芯片及其制造方法 |
CN107305875A (zh) * | 2016-04-19 | 2017-10-31 | 现代摩比斯株式会社 | 双向半导体封装件 |
CN107305875B (zh) * | 2016-04-19 | 2019-11-05 | 现代摩比斯株式会社 | 双向半导体封装件 |
CN105811891A (zh) * | 2016-04-20 | 2016-07-27 | 佛山臻智微芯科技有限公司 | 减低移动通信多级功率放大器中带内噪声的结构和方法 |
CN112185916A (zh) * | 2020-09-29 | 2021-01-05 | 西安微电子技术研究所 | 一种倒装焊芯片的双通道气密性封装结构及其工艺 |
CN113192936A (zh) * | 2021-04-23 | 2021-07-30 | 泓林微电子(昆山)有限公司 | 一种双面芯片封装结构 |
CN113192936B (zh) * | 2021-04-23 | 2024-02-13 | 泓林微电子(昆山)有限公司 | 一种双面芯片封装结构 |
CN113675093A (zh) * | 2021-07-14 | 2021-11-19 | 复旦大学 | 一种双面塑封的散热结构的封装设计及制备方法 |
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Publication number | Publication date |
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CN101840896B (zh) | 2014-03-05 |
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Inventor after: Tao Yujuan Inventor after: Wu Xiaochun Inventor before: Wu Xiaochun Inventor before: Tao Yujuan |
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Free format text: CORRECT: INVENTOR; FROM: WU XIAOCHUN TAO YUJUAN TO: TAO YUJUAN WU XIAOCHUN |
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Address after: Jiangsu province Nantong City Chongchuan road 226006 No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 30 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |