CN107742625B - 一种元件垂直贴装封装结构及其工艺方法 - Google Patents

一种元件垂直贴装封装结构及其工艺方法 Download PDF

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CN107742625B
CN107742625B CN201710867842.0A CN201710867842A CN107742625B CN 107742625 B CN107742625 B CN 107742625B CN 201710867842 A CN201710867842 A CN 201710867842A CN 107742625 B CN107742625 B CN 107742625B
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梁新夫
沈锦新
孔海申
周青云
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JCET Group Co Ltd
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Abstract

本发明涉及一种元件垂直贴装封装结构及其工艺方法，它包括第一封装体（1），所述第一封装体（1）包括第一基板（3），所述第一基板（3）背面设置有第一金属球（5）和被动元件（6），所述第一封装体（1）通过第一金属球（5）和被动元件（6）贴装到第二封装体（2）正面，所述第二封装体（2）包括导通柱（4），所述第一封装体（1）通过第一金属球（5）与第二封装体（2）电性连接，所述被动元件（6）垂直贴装，通过第一基板（3）和导通柱（4）电性连接，所述第一金属球（5）和被动元件（6）外围区域设置有底部填充胶（7），所述第二封装体（2）背面设置有第二金属球（8）。本发明能够应用于POP封装中，以实现充分利用两两相邻的封装体之间的空间，增加产品的集成度，使得封装体在相同尺寸下，集成度更高。

Description

一种元件垂直贴装封装结构及其工艺方法
技术领域
本发明涉及一种元件垂直贴装封装结构及其工艺方法，属于半导体封装技术领域。
背景技术
当前电子产品，特别是消费类电子产品，正朝着多功能、高集成化及微型化的方向不断发展。为此，电子产品在兼顾多功能的同时，还需要不断缩小产品的总体尺寸。
现有被动元件主要通过表面贴装方式实现，需要占用较多的平面空间；对于POP堆叠封装，封装体之间的空间通常利用率较低，而且封装体之间的连接焊球受热容易坍塌，导致短路桥接的问题。
发明内容
本发明所要解决的技术问题是针对上述现有技术提供一种元件垂直贴装封装结构及其工艺方法，它能够应用于POP封装中，以实现充分利用两两相邻的封装体之间的空间，增加产品的集成度，使得封装体在相同尺寸下，集成度更高。
本发明解决上述问题所采用的技术方案为：一种元件垂直贴装封装结构，它包括第一封装体，所述第一封装体包括第一基板，所述第一基板背面设置有第一金属球和被动元件，所述第一封装体通过第一金属球和被动元件贴装到第二封装体正面，所述第二封装体包括导通柱，所述第一封装体通过第一金属球与第二封装体电性连接，所述被动元件垂直贴装，通过第一基板和导通柱电性连接，所述第一金属球和被动元件外围区域设置有底部填充胶，所述第二封装体背面设置有第二金属球。
所述被动元件与第一金属球垂直方向的尺寸相同。
所述被动元件可以采用垂直贴装或者横向贴装方式。
所述被动元件可以单独与第一封装体电性连接，或者电性连接第一封装体和第二封装体。
所述第一封装体可以贴装在基板上，基板上可以设置有其他所需芯片。
一种元件垂直贴装封装结构的工艺方法，所述方法包括如下步骤：
步骤一、取第一封装体；
步骤二、在第一封装体的第一基板背面进行植球以及贴装被动元件，所述被动元件垂直贴装，被动元件顶部与第一封装体的第一基板的线路电性连接，所述被动元件垂直高度需一致，所述植球的材料可以是锡或铜；
步骤三、取第二封装体，将植完第一金属球和被动元件的第一封装体贴装到第二封装体，所述第一金属球与第二封装体的导通柱电性连接，所述被动元件底部与第二封装体的导通柱电性连接；
步骤四、第一封装体背面进行底部填充胶作业，将第一金属球与被动元件之间用底部填充胶填满。
所述金属球的材料可以是锡或铜。
与现有技术相比，本发明的优点在于：
1、目前被动元件表面贴装均采用常规平面贴装方式，会占用大量平面空间，而本发明结构采用部分元件垂直贴装结构，可以节省大量的平面空间，减少封装尺寸；
2、封装体之间放置被动元件，可以提高产品的集成度；
3、传统封装堆叠结构中，上下封装体通常只利用四周区域进行互连，而本发明结构中可以将部分元件放置在封装体之间，既提高了空间利用率，还可以利用被动元件起到支撑作用。
附图说明
图1为本发明一种元件垂直贴装封装结构的示意图。
图2~图5为本发明一种元件垂直贴装封装结构的工艺流程示意图。
图6~图7为本发明一种元件垂直贴装封装结构的其他实施例的结构示意图。
其中：
第一封装体1
第二封装体2
第一基板3
导通柱4
第一金属球5
被动元件6
底部填充胶7
第二金属球8
横向被动元件9
芯片10
第二基板11
塑封料12。
具体实施方式
以下结合附图实施例对本发明作进一步详细描述。
实施例1：元件垂直贴装正装封装结构
如图1所示，本实施例中的一种元件垂直贴装封装结构，它包括第一封装体1，所述第一封装体1包括第一基板3，所述第一基板3背面设置有第一金属球5和被动元件6，所述第一封装体1通过第一金属球5和被动元件6贴装到第二封装体2正面，所述第二封装体2包括导通柱4，所述第一封装体1通过第一金属球5与第二封装体2电性连接，所述被动元件6垂直贴装，通过第一基板3和导通柱4电性连接，所述第一金属球5和被动元件6外围区域设置有底部填充胶7，所述第二封装体2背面设置有第二金属球8。
其工艺方法包括以下步骤：
步骤一、参见图2，取第一封装体；
步骤二、参见图3，在第一封装体的第一基板背面进行植球以及贴装被动元件，所述被动元件垂直贴装，被动元件顶部与第一封装体的第一基板的线路电性连接，所述被动元件垂直高度需一致，所述植球的材料可以是锡或铜；
步骤三、参见图4，取第二封装体，将植完第一金属球和被动元件的第一封装体贴装到第二封装体，所述第一金属球与第二封装体的导通柱电性连接，所述被动元件底部与第二封装体的导通柱电性连接；
步骤四、参见图5，第一封装体背面进行底部填充胶作业，将第一金属球与被动元件之间用底部填充胶填满。
实施例2：
参见图6，实施例2与实施例1的区别在于：所述第一封装体1和第二封装体2之间有垂直贴装的被动元件6和横向被动元件9，两者垂直高度一致，所述被动元件6顶部与第一封装体1电性连接，底部与第二封装体2电性连接，所述横向被动元件9可以与第一封装体1电性连接，也可以与第一封装体1和第二封装体2电性连接。
实施例3：
参见图7，实施例3与实施例1的区别在于：所述第一封装体1通过第一金属球和被动元件贴装在第二基板11表面，所述第二基板11表面贴装有其他所需芯片10，所述第一封装体1、芯片10、第二基板11表面均被包封与塑封料12内。
除上述实施例外，本发明还包括有其他实施方式，凡采用等同变换或者等效替换方式形成的技术方案，均应落入本发明权利要求的保护范围之内。

Claims (2)

1.一种元件垂直贴装封装结构的工艺方法，其特征在于所述方法包括如下步骤：
步骤一、取第一封装体；
步骤二、在第一封装体的第一基板背面进行植球以及贴装被动元件，所述被动元件垂直贴装，被动元件顶部与第一封装体的第一基板的线路电性连接，所述被动元件垂直高度需一致，所述植球的材料是锡或铜；
步骤三、取第二封装体，将植完第一金属球和被动元件的第一封装体贴装到第二封装体，所述第一金属球与第二封装体的导通柱电性连接，所述被动元件底部与第二封装体的导通柱电性连接；
步骤四、第一封装体背面进行底部填充胶作业，将第一金属球与被动元件之间用底部填充胶填满。
2.根据权利要求1所述的一种元件垂直贴装封装结构的工艺方法，其特征在于：所述第一基板是有机基板、金属基板或者陶瓷基板。
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