CN101804516A - 激光加工方法、激光加工装置及太阳能电池板制造方法 - Google Patents

激光加工方法、激光加工装置及太阳能电池板制造方法 Download PDF

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Publication number
CN101804516A
CN101804516A CN200910215837A CN200910215837A CN101804516A CN 101804516 A CN101804516 A CN 101804516A CN 200910215837 A CN200910215837 A CN 200910215837A CN 200910215837 A CN200910215837 A CN 200910215837A CN 101804516 A CN101804516 A CN 101804516A
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China
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laser
speed
power
laser processing
platform
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Chinese (zh)
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荒木正树
片桐贤司
井崎良
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
  • Lasers (AREA)
CN200910215837A 2009-02-13 2009-12-30 激光加工方法、激光加工装置及太阳能电池板制造方法 Pending CN101804516A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009031902A JP5392943B2 (ja) 2009-02-13 2009-02-13 レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
JP2009-031902 2009-02-13

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CN101804516A true CN101804516A (zh) 2010-08-18

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JP (1) JP5392943B2 (ja)
CN (1) CN101804516A (ja)
TW (1) TW201029789A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106001910A (zh) * 2015-03-31 2016-10-12 发那科株式会社 具备间隙控制功能的激光加工机及其控制装置
CN109434279A (zh) * 2017-09-04 2019-03-08 Hb技术有限公司 运用电机编码器信号信息的激光系统
CN111195779A (zh) * 2018-10-31 2020-05-26 大族激光科技产业集团股份有限公司 一种激光切割的方法及装置
CN111644767A (zh) * 2020-06-19 2020-09-11 北京博创朔方科技有限公司 工业激光切割机

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012146723A (ja) * 2011-01-07 2012-08-02 Disco Abrasive Syst Ltd ダイシング加工装置
KR101688805B1 (ko) * 2012-05-31 2016-12-22 한국기계연구원 스테이지-스캐너 연동 레이저 가공을 위한 제로 오프셋 방법
JP2015054330A (ja) * 2013-09-10 2015-03-23 株式会社片岡製作所 レーザ加工機
JP7122559B2 (ja) * 2018-08-08 2022-08-22 パナソニックＩｐマネジメント株式会社 レーザ加工方法及びレーザ加工装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346687B1 (en) * 1998-02-19 2002-02-12 Ricoh Microelectronics Company, Ltd. Energy beam processing method and processing apparatus therefor
JP2002336980A (ja) * 2001-03-16 2002-11-26 Ricoh Microelectronics Co Ltd レーザ加工方法及びその装置
CN1470355A (zh) * 2002-07-24 2004-01-28 星云电脑股份有限公司 激光加工机中光学镜座配合射出激光的控制方法
JP2006119691A (ja) * 2004-10-19 2006-05-11 Mitsubishi Heavy Ind Ltd 多目的ｅｔｃ車載器及び多目的料金決済システム
JP2007108605A (ja) * 2005-10-17 2007-04-26 Yaskawa Electric Corp ガルバノ制御用コントローラ装置および制御方法
CN101342636A (zh) * 2008-08-11 2009-01-14 昆山思拓机器系统有限公司 激光加工系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6376780A (ja) * 1986-09-18 1988-04-07 Fujitsu Ltd レ−ザ加工装置
JP3035366B2 (ja) * 1991-02-08 2000-04-24 ヤマザキマザック株式会社 レーザ加工機の数値制御方法
DE10026499A1 (de) * 2000-05-27 2001-12-06 Isola Ag Vorrichtung und Verfahren zur Beschriftung von kupferkaschierten Laminaten
JP2006054255A (ja) * 2004-08-10 2006-02-23 Kaneka Corp 太陽電池製造装置
JP2006159254A (ja) * 2004-12-07 2006-06-22 Disco Abrasive Syst Ltd レーザー加工装置
JP4808460B2 (ja) * 2005-09-30 2011-11-02 芝浦メカトロニクス株式会社 レーザ加工装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346687B1 (en) * 1998-02-19 2002-02-12 Ricoh Microelectronics Company, Ltd. Energy beam processing method and processing apparatus therefor
JP2002336980A (ja) * 2001-03-16 2002-11-26 Ricoh Microelectronics Co Ltd レーザ加工方法及びその装置
CN1470355A (zh) * 2002-07-24 2004-01-28 星云电脑股份有限公司 激光加工机中光学镜座配合射出激光的控制方法
JP2006119691A (ja) * 2004-10-19 2006-05-11 Mitsubishi Heavy Ind Ltd 多目的ｅｔｃ車載器及び多目的料金決済システム
JP2007108605A (ja) * 2005-10-17 2007-04-26 Yaskawa Electric Corp ガルバノ制御用コントローラ装置および制御方法
CN101342636A (zh) * 2008-08-11 2009-01-14 昆山思拓机器系统有限公司 激光加工系统

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106001910A (zh) * 2015-03-31 2016-10-12 发那科株式会社 具备间隙控制功能的激光加工机及其控制装置
CN106001910B (zh) * 2015-03-31 2019-06-28 发那科株式会社 具备间隙控制功能的激光加工机及其控制装置
CN109434279A (zh) * 2017-09-04 2019-03-08 Hb技术有限公司 运用电机编码器信号信息的激光系统
CN111195779A (zh) * 2018-10-31 2020-05-26 大族激光科技产业集团股份有限公司 一种激光切割的方法及装置
CN111195779B (zh) * 2018-10-31 2022-04-01 大族激光科技产业集团股份有限公司 一种激光切割的方法及装置
CN111644767A (zh) * 2020-06-19 2020-09-11 北京博创朔方科技有限公司 工业激光切割机
CN111644767B (zh) * 2020-06-19 2021-04-09 临沂泓泽激光设备有限公司 工业激光切割机

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TW201029789A (en) 2010-08-16
JP5392943B2 (ja) 2014-01-22
JP2010184289A (ja) 2010-08-26

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Application publication date: 20100818