CN101801646B - 粘合基板制造装置和粘合基板制造方法 - Google Patents

粘合基板制造装置和粘合基板制造方法 Download PDF

Info

Publication number
CN101801646B
CN101801646B CN200880108048.7A CN200880108048A CN101801646B CN 101801646 B CN101801646 B CN 101801646B CN 200880108048 A CN200880108048 A CN 200880108048A CN 101801646 B CN101801646 B CN 101801646B
Authority
CN
China
Prior art keywords
infrabasal plate
pressure
upper substrate
basal part
adhesive base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200880108048.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN101801646A (zh
Inventor
佐藤诚一
矢作充
南展史
武者和博
汤山纯平
村田真朗
宫田贵裕
中村久三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN101801646A publication Critical patent/CN101801646A/zh
Application granted granted Critical
Publication of CN101801646B publication Critical patent/CN101801646B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
CN200880108048.7A 2007-11-08 2008-11-05 粘合基板制造装置和粘合基板制造方法 Active CN101801646B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-290912 2007-11-08
JP2007290912 2007-11-08
PCT/JP2008/070114 WO2009060855A1 (fr) 2007-11-08 2008-11-05 Appareil de fabrication de substrat d'assemblage et procédé de fabrication de substrat d'assemblage

Publications (2)

Publication Number Publication Date
CN101801646A CN101801646A (zh) 2010-08-11
CN101801646B true CN101801646B (zh) 2013-04-17

Family

ID=40625743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880108048.7A Active CN101801646B (zh) 2007-11-08 2008-11-05 粘合基板制造装置和粘合基板制造方法

Country Status (5)

Country Link
JP (1) JP4839407B2 (fr)
KR (1) KR101195085B1 (fr)
CN (1) CN101801646B (fr)
TW (1) TW200941614A (fr)
WO (1) WO2009060855A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101470921B1 (ko) * 2012-10-16 2014-12-10 주식회사 글로벌스탠다드테크놀로지 기판 합착장치 및 기판 합착 방법
JP6188123B2 (ja) * 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
JP6100571B2 (ja) 2013-03-22 2017-03-22 株式会社東芝 表示装置の製造装置、および表示装置の製造方法
CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックIpマネジメント株式会社 半導体装置の製造方法及び製造装置
JP6049820B1 (ja) * 2015-07-24 2016-12-21 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP6622254B2 (ja) * 2017-06-21 2019-12-18 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1669770A (zh) * 2004-02-24 2005-09-21 住友化学株式会社 透光板的生产方法
TWI250338B (en) * 2000-10-30 2006-03-01 Shinetsu Eng Co Ltd Lamination device for laminating substrate for liquid crystal panel
CN1869778A (zh) * 2005-05-25 2006-11-29 株式会社日立工业设备技术 基板组装装置和基板组装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI250338B (en) * 2000-10-30 2006-03-01 Shinetsu Eng Co Ltd Lamination device for laminating substrate for liquid crystal panel
CN1669770A (zh) * 2004-02-24 2005-09-21 住友化学株式会社 透光板的生产方法
CN1869778A (zh) * 2005-05-25 2006-11-29 株式会社日立工业设备技术 基板组装装置和基板组装方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-031500A 1994.02.08

Also Published As

Publication number Publication date
TW200941614A (en) 2009-10-01
WO2009060855A1 (fr) 2009-05-14
JPWO2009060855A1 (ja) 2011-03-24
KR20100057653A (ko) 2010-05-31
KR101195085B1 (ko) 2012-10-29
JP4839407B2 (ja) 2011-12-21
CN101801646A (zh) 2010-08-11

Similar Documents

Publication Publication Date Title
CN101801645B (zh) 粘合基板制造装置和粘合基板制造方法
CN101801646B (zh) 粘合基板制造装置和粘合基板制造方法
CN101855060A (zh) 粘合基板制造装置和粘合基板制造方法
CN100399117C (zh) 液晶显示装置的基板粘合设备
JP3492284B2 (ja) 基板貼合装置
US6892769B2 (en) Substrate bonding apparatus for liquid crystal display device panel
KR101311855B1 (ko) 기판합착장치 및 기판합착방법
CN103715125A (zh) 板状体保持机构、基板贴合装置以及基板贴合方法
CN101808810A (zh) 粘合基板制造装置和粘合基板制造方法
KR100850239B1 (ko) 기판합착장치
CN101441338A (zh) 衬底贴合设备
CN100565301C (zh) 粘合基板制造装置和粘合基板制造方法
JP4087385B2 (ja) 貼合せ基板製造装置
KR100899175B1 (ko) 기판합착장치
KR100482731B1 (ko) 기판 맞붙임 장치 및 기판 맞붙임 방법
KR101311856B1 (ko) 기판합착장치
CN212460238U (zh) 板件贴合装置
KR100850240B1 (ko) 기판합착장치
KR100921996B1 (ko) 기판 합착 장치
JP5047201B2 (ja) 基板合着装置
JPH05290788A (ja) クランプ機構

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant