CN101796658B - 半导体发光器件及其制造方法 - Google Patents
半导体发光器件及其制造方法 Download PDFInfo
- Publication number
- CN101796658B CN101796658B CN200880105858.7A CN200880105858A CN101796658B CN 101796658 B CN101796658 B CN 101796658B CN 200880105858 A CN200880105858 A CN 200880105858A CN 101796658 B CN101796658 B CN 101796658B
- Authority
- CN
- China
- Prior art keywords
- layer
- nitride
- type semiconductor
- light emitting
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0090685 | 2007-09-06 | ||
| KR1020070090685A KR101459754B1 (ko) | 2007-09-06 | 2007-09-06 | 반도체 발광소자 및 그 제조방법 |
| PCT/KR2008/005266 WO2009031858A2 (en) | 2007-09-06 | 2008-09-05 | Semiconductor light emitting device and method of fabricating the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310022156.5A Division CN103050590B (zh) | 2007-09-06 | 2008-09-05 | 半导体发光器件 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101796658A CN101796658A (zh) | 2010-08-04 |
| CN101796658B true CN101796658B (zh) | 2013-03-13 |
Family
ID=40429560
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880105858.7A Expired - Fee Related CN101796658B (zh) | 2007-09-06 | 2008-09-05 | 半导体发光器件及其制造方法 |
| CN201310022156.5A Expired - Fee Related CN103050590B (zh) | 2007-09-06 | 2008-09-05 | 半导体发光器件 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310022156.5A Expired - Fee Related CN103050590B (zh) | 2007-09-06 | 2008-09-05 | 半导体发光器件 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8299493B2 (enExample) |
| EP (1) | EP2195862B1 (enExample) |
| JP (1) | JP2010538491A (enExample) |
| KR (1) | KR101459754B1 (enExample) |
| CN (2) | CN101796658B (enExample) |
| WO (1) | WO2009031858A2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8994052B2 (en) * | 2008-03-04 | 2015-03-31 | Epistar Corporation | High-efficiency light-emitting device and manufacturing method thereof |
| US8481411B2 (en) | 2009-06-10 | 2013-07-09 | Seoul Opto Device Co., Ltd. | Method of manufacturing a semiconductor substrate having a cavity |
| US8860183B2 (en) * | 2009-06-10 | 2014-10-14 | Seoul Viosys Co., Ltd. | Semiconductor substrate, semiconductor device, and manufacturing methods thereof |
| KR101220433B1 (ko) * | 2009-06-10 | 2013-02-04 | 서울옵토디바이스주식회사 | 반도체 기판, 그 제조 방법, 반도체 소자 및 그 제조 방법 |
| EP2472604B1 (en) | 2009-08-26 | 2020-09-09 | Seoul Viosys Co., Ltd | Method for manufacturing a light-emitting device |
| US8597961B2 (en) * | 2009-10-20 | 2013-12-03 | Walsin Lihwa Corporation | Method for improving internal quantum efficiency of group-III nitride-based light emitting device |
| KR100999684B1 (ko) * | 2009-10-21 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
| JP5570838B2 (ja) * | 2010-02-10 | 2014-08-13 | ソウル バイオシス カンパニー リミテッド | 半導体基板、その製造方法、半導体デバイス及びその製造方法 |
| KR20120092325A (ko) | 2011-02-11 | 2012-08-21 | 서울옵토디바이스주식회사 | 광 결정 구조를 갖는 발광 다이오드 및 그것을 제조하는 방법 |
| WO2013063020A1 (en) * | 2011-10-24 | 2013-05-02 | The Regents Of The University Of California | SUPPRESSION OF RELAXATION BY LIMITED AREA EPITAXY ON NON-C-PLANE (In,Al,B,Ga)N |
| WO2013133593A1 (ko) * | 2012-03-08 | 2013-09-12 | 서울옵토디바이스주식회사 | 광추출 효율이 개선된 발광다이오드 및 그 제조방법 |
| CN102738334B (zh) * | 2012-06-19 | 2015-07-08 | 厦门市三安光电科技有限公司 | 具有电流扩展层的发光二极管及其制作方法 |
| JP6181661B2 (ja) * | 2012-10-22 | 2017-08-16 | シャープ株式会社 | 窒化物半導体発光素子 |
| TWI539625B (zh) * | 2013-10-22 | 2016-06-21 | 璨圓光電股份有限公司 | 半導體發光元件及其製造方法 |
| CN113363358B (zh) * | 2021-05-31 | 2022-06-03 | 厦门乾照光电股份有限公司 | 一种led芯片 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1461499A (zh) * | 2001-03-09 | 2003-12-10 | 索尼公司 | 显示装置及其制造方法 |
| CN1881630A (zh) * | 2005-05-24 | 2006-12-20 | Lg电子株式会社 | 杆型发光器件及其制造方法 |
| TW200705706A (en) * | 2005-07-25 | 2007-02-01 | Formosa Epitaxy Inc | Light emitting diode structure |
| CN101009342A (zh) * | 2006-01-26 | 2007-08-01 | 璨圆光电股份有限公司 | 发光二极管结构 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4888300A (en) * | 1985-11-07 | 1989-12-19 | Fairchild Camera And Instrument Corporation | Submerged wall isolation of silicon islands |
| JP3158869B2 (ja) * | 1993-06-30 | 2001-04-23 | 日立電線株式会社 | 発光ダイオード及びその製造方法 |
| JPH08335684A (ja) * | 1995-06-08 | 1996-12-17 | Toshiba Corp | 半導体装置 |
| JP2000101135A (ja) | 1998-09-24 | 2000-04-07 | Toshiba Corp | 化合物半導体素子 |
| JP2001267242A (ja) * | 2000-03-14 | 2001-09-28 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体及びその製造方法 |
| US6627974B2 (en) * | 2000-06-19 | 2003-09-30 | Nichia Corporation | Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate |
| JP4556300B2 (ja) * | 2000-07-18 | 2010-10-06 | ソニー株式会社 | 結晶成長方法 |
| TW486829B (en) * | 2000-11-16 | 2002-05-11 | United Epitaxy Co Ltd | Epitaxial growth of nitride semiconductor |
| US7170097B2 (en) * | 2003-02-14 | 2007-01-30 | Cree, Inc. | Inverted light emitting diode on conductive substrate |
| KR100568299B1 (ko) * | 2004-03-31 | 2006-04-05 | 삼성전기주식회사 | 질화갈륨계 반도체 발광소자 |
| US7768024B2 (en) * | 2005-12-02 | 2010-08-03 | The Regents Of The University Of California | Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers fabricated by growth over a patterned substrate with multiple overgrowth |
| JP2006096620A (ja) * | 2004-09-29 | 2006-04-13 | ▲さん▼圓光電股▲ふん▼有限公司 | 窒化物エピタキシャル層製造方法及びその構造 |
| KR100580751B1 (ko) | 2004-12-23 | 2006-05-15 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| JP4645225B2 (ja) * | 2005-02-24 | 2011-03-09 | 豊田合成株式会社 | 半導体素子の製造方法 |
| KR100638818B1 (ko) * | 2005-05-19 | 2006-10-27 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
| KR100797180B1 (ko) * | 2005-06-25 | 2008-01-23 | (주)에피플러스 | 휘도가 향상된 반도체 발광 소자 및 그 제조 방법 |
| TWI270222B (en) * | 2005-10-07 | 2007-01-01 | Formosa Epitaxy Inc | Light emitting diode chip |
| KR100700529B1 (ko) * | 2005-10-17 | 2007-03-28 | 엘지전자 주식회사 | 전류 확산층을 구비한 발광 다이오드 및 그 제조 방법 |
-
2007
- 2007-09-06 KR KR1020070090685A patent/KR101459754B1/ko not_active Expired - Fee Related
-
2008
- 2008-09-05 EP EP08829429.3A patent/EP2195862B1/en not_active Not-in-force
- 2008-09-05 WO PCT/KR2008/005266 patent/WO2009031858A2/en not_active Ceased
- 2008-09-05 JP JP2010523955A patent/JP2010538491A/ja active Pending
- 2008-09-05 US US12/676,785 patent/US8299493B2/en active Active
- 2008-09-05 CN CN200880105858.7A patent/CN101796658B/zh not_active Expired - Fee Related
- 2008-09-05 CN CN201310022156.5A patent/CN103050590B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1461499A (zh) * | 2001-03-09 | 2003-12-10 | 索尼公司 | 显示装置及其制造方法 |
| CN1881630A (zh) * | 2005-05-24 | 2006-12-20 | Lg电子株式会社 | 杆型发光器件及其制造方法 |
| TW200705706A (en) * | 2005-07-25 | 2007-02-01 | Formosa Epitaxy Inc | Light emitting diode structure |
| CN101009342A (zh) * | 2006-01-26 | 2007-08-01 | 璨圆光电股份有限公司 | 发光二极管结构 |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2006-237254A 2006.09.07 |
| JP特开2006-324669A 2006.11.30 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2195862A2 (en) | 2010-06-16 |
| EP2195862A4 (en) | 2014-01-08 |
| KR101459754B1 (ko) | 2014-11-13 |
| WO2009031858A3 (en) | 2009-05-14 |
| KR20090025670A (ko) | 2009-03-11 |
| CN103050590A (zh) | 2013-04-17 |
| US8299493B2 (en) | 2012-10-30 |
| CN101796658A (zh) | 2010-08-04 |
| US20100252859A1 (en) | 2010-10-07 |
| WO2009031858A2 (en) | 2009-03-12 |
| EP2195862B1 (en) | 2017-01-18 |
| JP2010538491A (ja) | 2010-12-09 |
| CN103050590B (zh) | 2016-06-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210811 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG INNOTEK Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Liyu Semiconductor Co.,Ltd. Country or region after: China Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Leyu Semiconductor Co.,Ltd. Country or region before: China |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 |