CN101752345A - 半导体器件p2id和sm的测试结构 - Google Patents
半导体器件p2id和sm的测试结构 Download PDFInfo
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- CN101752345A CN101752345A CN 200810044124 CN200810044124A CN101752345A CN 101752345 A CN101752345 A CN 101752345A CN 200810044124 CN200810044124 CN 200810044124 CN 200810044124 A CN200810044124 A CN 200810044124A CN 101752345 A CN101752345 A CN 101752345A
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CN 200810044124 CN101752345B (zh) | 2008-12-17 | 2008-12-17 | 半导体器件p2id和sm的测试结构 |
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CN 200810044124 CN101752345B (zh) | 2008-12-17 | 2008-12-17 | 半导体器件p2id和sm的测试结构 |
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CN101752345A true CN101752345A (zh) | 2010-06-23 |
CN101752345B CN101752345B (zh) | 2012-02-15 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103779331A (zh) * | 2012-10-25 | 2014-05-07 | 中芯国际集成电路制造(上海)有限公司 | 等离子体引入损伤检测结构及制作方法 |
CN103872017A (zh) * | 2012-12-11 | 2014-06-18 | 中芯国际集成电路制造(上海)有限公司 | 可用于pid与ild测试的测试结构及晶圆 |
CN108630669A (zh) * | 2017-03-22 | 2018-10-09 | 东芝存储器株式会社 | 半导体装置 |
CN109786363A (zh) * | 2019-02-22 | 2019-05-21 | 友达光电(昆山)有限公司 | 显示面板 |
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DE19640542A1 (de) * | 1995-10-13 | 1997-04-10 | Nordson Corp | Verfahren und Vorrichtung zum Verflüssigen von thermoplastischem Material |
JP3751598B2 (ja) * | 2003-02-20 | 2006-03-01 | 松下電器産業株式会社 | チャージアップダメージ評価用半導体装置とその評価方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103779331A (zh) * | 2012-10-25 | 2014-05-07 | 中芯国际集成电路制造(上海)有限公司 | 等离子体引入损伤检测结构及制作方法 |
CN103779331B (zh) * | 2012-10-25 | 2016-09-07 | 中芯国际集成电路制造(上海)有限公司 | 等离子体引入损伤检测结构及制作方法 |
CN103872017A (zh) * | 2012-12-11 | 2014-06-18 | 中芯国际集成电路制造(上海)有限公司 | 可用于pid与ild测试的测试结构及晶圆 |
CN103872017B (zh) * | 2012-12-11 | 2017-02-15 | 中芯国际集成电路制造(上海)有限公司 | 可用于pid与ild测试的测试结构及晶圆 |
CN108630669A (zh) * | 2017-03-22 | 2018-10-09 | 东芝存储器株式会社 | 半导体装置 |
CN108630669B (zh) * | 2017-03-22 | 2021-11-30 | 东芝存储器株式会社 | 半导体装置 |
CN109786363A (zh) * | 2019-02-22 | 2019-05-21 | 友达光电(昆山)有限公司 | 显示面板 |
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CN101752345B (zh) | 2012-02-15 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |