CN101740492B - 功能区域的移设方法和led阵列、打印机头及打印机 - Google Patents

功能区域的移设方法和led阵列、打印机头及打印机 Download PDF

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Publication number
CN101740492B
CN101740492B CN2009102115333A CN200910211533A CN101740492B CN 101740492 B CN101740492 B CN 101740492B CN 2009102115333 A CN2009102115333 A CN 2009102115333A CN 200910211533 A CN200910211533 A CN 200910211533A CN 101740492 B CN101740492 B CN 101740492B
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China
Prior art keywords
substrate
layer
functional area
releasing layer
led
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Expired - Fee Related
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CN2009102115333A
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English (en)
Chinese (zh)
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CN101740492A (zh
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米原隆夫
高井康好
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)
CN2009102115333A 2008-11-04 2009-11-04 功能区域的移设方法和led阵列、打印机头及打印机 Expired - Fee Related CN101740492B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-282680 2008-11-04
JP2008282680A JP5276412B2 (ja) 2008-11-04 2008-11-04 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ

Publications (2)

Publication Number Publication Date
CN101740492A CN101740492A (zh) 2010-06-16
CN101740492B true CN101740492B (zh) 2012-09-05

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CN2009102115333A Expired - Fee Related CN101740492B (zh) 2008-11-04 2009-11-04 功能区域的移设方法和led阵列、打印机头及打印机

Country Status (5)

Country Link
US (1) US8420501B2 (enExample)
EP (1) EP2182553A3 (enExample)
JP (1) JP5276412B2 (enExample)
KR (1) KR101160137B1 (enExample)
CN (1) CN101740492B (enExample)

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JP5390832B2 (ja) * 2008-11-04 2014-01-15 キヤノン株式会社 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ
KR101651927B1 (ko) * 2010-03-15 2016-08-29 엘지전자 주식회사 디스플레이 장치 및 디스플레이 모듈
EP2492979A4 (en) * 2010-12-27 2012-11-28 Panasonic Corp LIGHT EMITTING DEVICE AND LAMP
KR102048905B1 (ko) * 2011-06-01 2019-11-27 루미리즈 홀딩 비.브이. 지지 기판에 발광 디바이스를 부착하는 방법
DE102012112530A1 (de) * 2012-12-18 2014-06-18 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
US9768271B2 (en) 2013-02-22 2017-09-19 Micron Technology, Inc. Methods, devices, and systems related to forming semiconductor power devices with a handle substrate
FR3005895B1 (fr) * 2013-05-27 2015-06-26 Commissariat Energie Atomique Procede d'assemblage de deux substrats de nature differente via une couche intermediaire ductile
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
JP6322059B2 (ja) * 2014-06-12 2018-05-09 日本電信電話株式会社 光デバイスの作製方法
TWI814461B (zh) * 2014-06-18 2023-09-01 愛爾蘭商艾克斯展示公司技術有限公司 微組裝發光二極體顯示器及照明元件
US20160133486A1 (en) * 2014-11-07 2016-05-12 International Business Machines Corporation Double Layer Release Temporary Bond and Debond Processes and Systems
CN108431971B (zh) * 2015-12-23 2021-07-27 歌尔股份有限公司 微发光二极管转移方法及制造方法
US10297711B2 (en) * 2015-12-30 2019-05-21 Globalfoundries Singapore Pte. Ltd. Integrated LED and LED driver units and methods for fabricating the same
US10002856B1 (en) * 2017-01-26 2018-06-19 International Business Machines Corporation Micro-LED array transfer
CN109728142B (zh) * 2017-10-31 2021-02-02 展晶科技(深圳)有限公司 发光二极管晶粒的制造方法
KR102179165B1 (ko) 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
US11575006B2 (en) * 2018-03-20 2023-02-07 The Regents Of The University Of California Van der Waals integration approach for material integration and device fabrication
CN112582343B (zh) * 2019-09-29 2022-12-06 成都辰显光电有限公司 一种生长基板及微元件的转移方法
FR3123499B1 (fr) * 2021-05-31 2025-02-14 Aledia Procédé de fabrication d’un dispositif électronique comprenant une phase de liaison

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CN1447958A (zh) * 2000-07-18 2003-10-08 索尼株式会社 图像显示装置及制造图像显示装置的方法

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JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
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Also Published As

Publication number Publication date
JP5276412B2 (ja) 2013-08-28
EP2182553A3 (en) 2015-12-02
KR101160137B1 (ko) 2012-06-27
JP2010114105A (ja) 2010-05-20
US20100110157A1 (en) 2010-05-06
KR20100054723A (ko) 2010-05-25
US8420501B2 (en) 2013-04-16
EP2182553A2 (en) 2010-05-05
CN101740492A (zh) 2010-06-16

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