CN101734849B - 切断装置用传送单元、切断装置以及切断方法 - Google Patents

切断装置用传送单元、切断装置以及切断方法 Download PDF

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Publication number
CN101734849B
CN101734849B CN2009102106118A CN200910210611A CN101734849B CN 101734849 B CN101734849 B CN 101734849B CN 2009102106118 A CN2009102106118 A CN 2009102106118A CN 200910210611 A CN200910210611 A CN 200910210611A CN 101734849 B CN101734849 B CN 101734849B
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mother substrate
substrate assembly
adsorption section
main part
line
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Chinese (zh)
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CN101734849A (zh
Inventor
金民雄
梁真赫
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Semes Co Ltd
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Semes Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009102106118A 2008-11-05 2009-11-03 切断装置用传送单元、切断装置以及切断方法 Active CN101734849B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0109461 2008-11-05
KR1020080109461A KR101160166B1 (ko) 2008-11-05 2008-11-05 절단 장치용 이송 유닛, 이를 갖는 절단 장치 및 이를 이용한 절단 방법

Publications (2)

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CN101734849A CN101734849A (zh) 2010-06-16
CN101734849B true CN101734849B (zh) 2013-04-24

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JP (1) JP5088637B2 (ko)
KR (1) KR101160166B1 (ko)
CN (1) CN101734849B (ko)
TW (1) TWI388487B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101435136B1 (ko) * 2012-12-28 2014-09-01 (주)모아텍 기판 또는 필름 고정을 위한 고정구
US9418894B2 (en) * 2014-03-21 2016-08-16 Semiconductor Components Industries, Llc Electronic die singulation method
KR101558249B1 (ko) 2015-07-31 2015-10-12 주식회사 톱텍 터치패널의 에지스크랩 분리장치
CN107009265A (zh) * 2017-03-28 2017-08-04 江苏京创先进电子科技有限公司 切割机真空吸盘工作台装置及其工作过程
KR102490923B1 (ko) 2017-09-28 2023-01-26 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
KR102500677B1 (ko) * 2017-11-24 2023-02-16 삼성디스플레이 주식회사 표시 장치의 가공 장치 및 표시 장치의 가공 방법
KR20200144168A (ko) * 2019-06-17 2020-12-29 주식회사 탑 엔지니어링 기판 반송 헤드
CN110182640B (zh) * 2019-06-21 2020-08-28 温州海蓝工业设计有限公司 一种印刷品下料码垛机械及其码垛方法
CN112624589B (zh) * 2020-12-18 2022-12-20 湖北骏腾拓达光电有限公司 一种计算机屏幕面板加工用切割设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398803A (zh) * 2001-07-23 2003-02-26 川崎重工业株式会社 玻璃板切割机构及切边装置
CN1890074A (zh) * 2003-12-04 2007-01-03 三星钻石工业股份有限公司 基板加工方法、基板加工装置、基板输送方法、基板输送机构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834099B2 (ja) * 1996-04-05 2006-10-18 中村留精密工業株式会社 液晶ガラス板の切断装置
JP3368246B2 (ja) * 2000-02-23 2003-01-20 株式会社白井▲鉄▼工所 液晶パネルの折割装置
KR100563836B1 (ko) 2003-08-30 2006-03-28 주식회사 에쎌텍 취성재료 절단장치 및 그 절단방법
KR100663865B1 (ko) 2005-08-31 2007-01-03 엘지전자 주식회사 평판 디스플레이용 글래스 스크라이빙장치 및 방법
JP5100156B2 (ja) * 2007-03-02 2012-12-19 シャープ株式会社 廃液晶パネルのガラス基板を回収する方法
KR100855876B1 (ko) 2007-04-12 2008-09-03 세메스 주식회사 스크라이빙 유닛 및 상기 유닛을 가지는 평판 디스플레이용패널 스크라이빙 장치, 그리고 스크라이빙 방법 및 이를이용한 기판 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398803A (zh) * 2001-07-23 2003-02-26 川崎重工业株式会社 玻璃板切割机构及切边装置
CN1890074A (zh) * 2003-12-04 2007-01-03 三星钻石工业股份有限公司 基板加工方法、基板加工装置、基板输送方法、基板输送机构

Also Published As

Publication number Publication date
CN101734849A (zh) 2010-06-16
TWI388487B (zh) 2013-03-11
KR101160166B1 (ko) 2012-06-28
JP5088637B2 (ja) 2012-12-05
TW201022117A (en) 2010-06-16
KR20100050254A (ko) 2010-05-13
JP2010113351A (ja) 2010-05-20

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