CN101730944B - 压电多层器件 - Google Patents

压电多层器件 Download PDF

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Publication number
CN101730944B
CN101730944B CN2008800156671A CN200880015667A CN101730944B CN 101730944 B CN101730944 B CN 101730944B CN 2008800156671 A CN2008800156671 A CN 2008800156671A CN 200880015667 A CN200880015667 A CN 200880015667A CN 101730944 B CN101730944 B CN 101730944B
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CN
China
Prior art keywords
layers
layer
adjacent
piezoelectric
different
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008800156671A
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English (en)
Chinese (zh)
Other versions
CN101730944A (zh
Inventor
B·多尔加斯特
A·格拉朱诺夫
O·德诺夫塞克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
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Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN101730944A publication Critical patent/CN101730944A/zh
Application granted granted Critical
Publication of CN101730944B publication Critical patent/CN101730944B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
CN2008800156671A 2007-05-11 2008-05-09 压电多层器件 Expired - Fee Related CN101730944B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007022093.8 2007-05-11
DE102007022093A DE102007022093A1 (de) 2007-05-11 2007-05-11 Piezoelektrisches Vielschichtbauelement
PCT/EP2008/055783 WO2008138906A1 (de) 2007-05-11 2008-05-09 Piezoelektrisches vielschichtbauelement

Publications (2)

Publication Number Publication Date
CN101730944A CN101730944A (zh) 2010-06-09
CN101730944B true CN101730944B (zh) 2013-07-17

Family

ID=39761031

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800156671A Expired - Fee Related CN101730944B (zh) 2007-05-11 2008-05-09 压电多层器件

Country Status (6)

Country Link
US (1) US7960899B2 (enExample)
EP (1) EP2147469B1 (enExample)
JP (1) JP5666901B2 (enExample)
CN (1) CN101730944B (enExample)
DE (1) DE102007022093A1 (enExample)
WO (1) WO2008138906A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009043220A1 (de) 2009-05-29 2010-12-02 Epcos Ag Piezoelektrisches Bauelement
DE102010005906A1 (de) * 2010-01-27 2011-07-28 Epcos Ag, 81669 Piezoelektrisches Bauelement
WO2015025642A1 (ja) * 2013-08-21 2015-02-26 株式会社村田製作所 電気化学素子用セラミック基体及びその製造方法並びに燃料電池及び燃料電池スタック
JP7087489B2 (ja) * 2018-03-14 2022-06-21 株式会社リコー ヘッド用振動板部材、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1735979A (zh) * 1999-06-19 2006-02-15 罗伯特·博施有限公司 压电执行元件
DE102005052686A1 (de) * 2005-07-26 2007-02-15 Siemens Ag Piezoaktor und Verfahren zur Herstellung desselben

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19732513C2 (de) 1997-07-29 2002-04-11 Eurocopter Deutschland Verfahren zur Herstellung einer Verbundstruktur
JP4202467B2 (ja) * 1998-07-10 2008-12-24 セイコーエプソン株式会社 アクチュエータ装置及びインクジェット式記録ヘッド並びにインクジェット式記録装置
US6512323B2 (en) * 2000-03-22 2003-01-28 Caterpillar Inc. Piezoelectric actuator device
JP3642026B2 (ja) * 2001-01-12 2005-04-27 株式会社村田製作所 加速度センサおよびその製造方法
DE50212202D1 (de) * 2001-05-11 2008-06-19 Caterpillar Inc Verfahren zur Herstellung eines flachen mehrschichtigen Biegewandlers sowie entsprechender Biegewandler
DE10201641A1 (de) 2002-01-17 2003-08-07 Epcos Ag Piezoelektrisches Bauelement und Verfahren zu dessen Herstellung
DE10234787C1 (de) 2002-06-07 2003-10-30 Pi Ceramic Gmbh Keramische Tec Verfahren zur Herstellung eines monolithischen Vielschichtaktors, monolithischer Vielschichtaktor aus einem piezokeramischen oder elektrostriktiven Material
DE10237589A1 (de) * 2002-08-16 2004-02-26 Robert Bosch Gmbh Piezoaktor
JP4422973B2 (ja) 2002-08-27 2010-03-03 京セラ株式会社 積層圧電体、アクチュエータ及び印刷ヘッド
US7067965B2 (en) * 2002-09-18 2006-06-27 Tdk Corporation Piezoelectric porcelain composition, piezoelectric device, and methods of making thereof
US7070674B2 (en) * 2002-12-20 2006-07-04 Caterpillar Method of manufacturing a multi-layered piezoelectric actuator
DE10307825A1 (de) 2003-02-24 2004-09-09 Epcos Ag Elektrisches Vielschichtbauelement und Schichtstapel
JP4381760B2 (ja) * 2003-09-22 2009-12-09 独立行政法人科学技術振興機構 可撓性セラミックス製品及びその製造方法
DE102004031404B4 (de) 2004-06-29 2010-04-08 Siemens Ag Piezoelektrisches Bauteil mit Sollbruchstelle und elektrischem Anschlusselement, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
WO2006097522A1 (en) * 2005-03-18 2006-09-21 Bae Systems Plc An actuator
DE102005015112B4 (de) * 2005-04-01 2007-05-24 Siemens Ag Monolithisches piezoelektrisches Bauteil mit mechanischer Entkopplungsschicht, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
JP4901165B2 (ja) * 2005-09-20 2012-03-21 京セラ株式会社 積層圧電体
WO2007138346A1 (en) * 2006-05-27 2007-12-06 Bae Systems Plc A bonding tool and method
EP1970975B1 (en) * 2007-03-14 2011-07-20 Delphi Technologies Holding S.à.r.l. Reducing stress gradients within piezoelectric actuators
JP5029692B2 (ja) * 2007-10-16 2012-09-19 株式会社村田製作所 圧電ポンプ
DE102009043220A1 (de) * 2009-05-29 2010-12-02 Epcos Ag Piezoelektrisches Bauelement

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1735979A (zh) * 1999-06-19 2006-02-15 罗伯特·博施有限公司 压电执行元件
DE102005052686A1 (de) * 2005-07-26 2007-02-15 Siemens Ag Piezoaktor und Verfahren zur Herstellung desselben

Also Published As

Publication number Publication date
US7960899B2 (en) 2011-06-14
EP2147469B1 (de) 2012-10-03
EP2147469A1 (de) 2010-01-27
CN101730944A (zh) 2010-06-09
WO2008138906A1 (de) 2008-11-20
US20100109488A1 (en) 2010-05-06
JP5666901B2 (ja) 2015-02-12
DE102007022093A1 (de) 2008-11-13
JP2010527143A (ja) 2010-08-05

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Granted publication date: 20130717

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