CN101685105B - 探针尖端 - Google Patents

探针尖端 Download PDF

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Publication number
CN101685105B
CN101685105B CN2009102116406A CN200910211640A CN101685105B CN 101685105 B CN101685105 B CN 101685105B CN 2009102116406 A CN2009102116406 A CN 2009102116406A CN 200910211640 A CN200910211640 A CN 200910211640A CN 101685105 B CN101685105 B CN 101685105B
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CN
China
Prior art keywords
probe
elastomeric element
probe assembly
exemplary embodiment
probe tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2009102116406A
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English (en)
Chinese (zh)
Other versions
CN101685105A (zh
Inventor
J·C·考迪尔
E·C·马卢夫
山口政纪
水田慎一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Co Ltd
Lake Shore Cryotronics Inc
Original Assignee
Toyo Co Ltd
Lake Shore Cryotronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Co Ltd, Lake Shore Cryotronics Inc filed Critical Toyo Co Ltd
Publication of CN101685105A publication Critical patent/CN101685105A/zh
Application granted granted Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN2009102116406A 2008-08-26 2009-08-25 探针尖端 Active CN101685105B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9196208P 2008-08-26 2008-08-26
US61/091,962 2008-08-26

Publications (2)

Publication Number Publication Date
CN101685105A CN101685105A (zh) 2010-03-31
CN101685105B true CN101685105B (zh) 2013-09-04

Family

ID=41401830

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009102116406A Active CN101685105B (zh) 2008-08-26 2009-08-25 探针尖端

Country Status (4)

Country Link
US (1) US8327727B2 (enExample)
EP (1) EP2159580B1 (enExample)
JP (1) JP5501697B2 (enExample)
CN (1) CN101685105B (enExample)

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EP2932229A2 (en) * 2012-12-17 2015-10-21 National Taiwan University Sampling assembly, microscope module, and microscope apparatus
US9417266B2 (en) 2014-01-16 2016-08-16 International Business Machines Corporation Implementing handheld transfer impedance probe
CN106338625B (zh) * 2015-07-06 2019-07-26 创意电子股份有限公司 探针卡
US10060950B2 (en) * 2016-01-15 2018-08-28 Formfactor Beaverton, Inc. Shielded probe systems
US10877070B2 (en) 2018-01-19 2020-12-29 Formfactor Beaverton, Inc. Probes with fiducial targets, probe systems including the same, and associated methods
US11313883B2 (en) * 2020-09-10 2022-04-26 Mpi Corporation Probe station capable of maintaining position of probe tip upon temperature change
CN114811432A (zh) * 2021-01-19 2022-07-29 中国航天科工飞航技术研究院（中国航天海鹰机电技术研究院） 用于液氦杜瓦的温度补偿支撑结构及具有其的低温容器
CN113075128B (zh) * 2021-04-06 2024-09-10 武汉佰力博科技有限公司 一种探针机构和可变温真空探针平台
US11927603B2 (en) 2021-10-20 2024-03-12 Formfactor, Inc. Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes
US12169208B2 (en) 2021-11-30 2024-12-17 Innovatum Instruments Inc. Probe tip X-Y location identification using a charged particle beam
US12306241B2 (en) 2022-02-14 2025-05-20 Innovatum Instruments Inc. Automated probe landing
CN116298863B (zh) * 2023-02-01 2024-05-10 深圳市致诚达科技有限公司 一种bldc电机生产线快速检验系统及控制方法
EP4439101A1 (en) * 2023-03-31 2024-10-02 kiutra GmbH Apparatus for testing and/or operating electronic devices
CN116430088B (zh) * 2023-06-13 2023-11-24 南方科技大学 探针及其制备方法

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US5309088A (en) 1990-08-10 1994-05-03 Texas Instruments Incorporated Measurement of semiconductor parameters at cryogenic temperatures using a spring contact probe
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JPH088455Y2 (ja) * 1992-12-08 1996-03-06 日本電子材料株式会社 加熱又は冷却テストに適したプローブカード
US5312188A (en) * 1993-04-05 1994-05-17 Figgie International Inc. Temperature sensing apparatus
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US6784663B2 (en) * 2001-08-27 2004-08-31 Tristan Technologies, Inc. Self-adjusting assembly and method for close tolerance spacing
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
DE10154495C5 (de) * 2001-11-07 2018-01-11 Infineon Technologies Ag Konzept zur Kompensation der Einflüsse externer Störgrößen auf physikalische Funktionsparameter von integrierten Schaltungen
US7239158B2 (en) * 2002-04-16 2007-07-03 Nhk Spring Co., Ltd. Holder for conductive contact
JP4170023B2 (ja) * 2002-06-07 2008-10-22 アルプス電気株式会社 回転型センサ
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DE10254720A1 (de) * 2002-11-23 2004-06-03 Endress + Hauser Gmbh + Co. Kg Messgerät
JP2006524798A (ja) * 2003-02-13 2006-11-02 ネクセンス リミテッド 様々なパラメータの高感度測定を行なうための装置、およびそのような装置で特に有用なセンサ
JP4400909B2 (ja) * 2003-04-04 2010-01-20 日本サーモスタット株式会社 サーモスタット装置
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Also Published As

Publication number Publication date
EP2159580A1 (en) 2010-03-03
US20100064784A1 (en) 2010-03-18
JP2010056553A (ja) 2010-03-11
JP5501697B2 (ja) 2014-05-28
EP2159580B1 (en) 2015-10-07
US8327727B2 (en) 2012-12-11
CN101685105A (zh) 2010-03-31

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