CN101676931B - 半导体器件以及防止用户伪造物体的方法 - Google Patents
半导体器件以及防止用户伪造物体的方法 Download PDFInfo
- Publication number
- CN101676931B CN101676931B CN2009101736524A CN200910173652A CN101676931B CN 101676931 B CN101676931 B CN 101676931B CN 2009101736524 A CN2009101736524 A CN 2009101736524A CN 200910173652 A CN200910173652 A CN 200910173652A CN 101676931 B CN101676931 B CN 101676931B
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- Prior art keywords
- memory element
- electrodes
- pair
- antenna
- organic compound
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/202—Integrated devices comprising a common active layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0059—Security or protection circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/22—Safety or protection circuits preventing unauthorised or accidental access to memory cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/045—Manufacture or treatment of PN junction diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/051—Manufacture or treatment of Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/611—Charge transfer complexes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Security & Cryptography (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004303595 | 2004-10-18 | ||
| JP2004303595 | 2004-10-18 | ||
| JP2004-303595 | 2004-10-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800356119A Division CN100557813C (zh) | 2004-10-18 | 2005-10-12 | 半导体器件及其驱动方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101676931A CN101676931A (zh) | 2010-03-24 |
| CN101676931B true CN101676931B (zh) | 2012-06-27 |
Family
ID=36202988
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101736524A Expired - Fee Related CN101676931B (zh) | 2004-10-18 | 2005-10-12 | 半导体器件以及防止用户伪造物体的方法 |
| CNB2005800356119A Expired - Fee Related CN100557813C (zh) | 2004-10-18 | 2005-10-12 | 半导体器件及其驱动方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800356119A Expired - Fee Related CN100557813C (zh) | 2004-10-18 | 2005-10-12 | 半导体器件及其驱动方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US7499305B2 (enExample) |
| EP (2) | EP1812893A4 (enExample) |
| JP (1) | JP5019737B2 (enExample) |
| KR (3) | KR20140015128A (enExample) |
| CN (2) | CN101676931B (enExample) |
| TW (2) | TWI446606B (enExample) |
| WO (1) | WO2006043573A1 (enExample) |
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| US7781758B2 (en) * | 2004-10-22 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101219749B1 (ko) | 2004-10-22 | 2013-01-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
| WO2006051996A1 (en) | 2004-11-11 | 2006-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN100576557C (zh) * | 2004-11-26 | 2009-12-30 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| WO2006085633A1 (en) * | 2005-02-10 | 2006-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
| CN101615623B (zh) | 2005-03-25 | 2012-07-04 | 株式会社半导体能源研究所 | 存储器电路 |
| US7926726B2 (en) * | 2005-03-28 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Survey method and survey system |
| US8030643B2 (en) | 2005-03-28 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and manufacturing method the same |
| WO2006118294A1 (en) | 2005-04-27 | 2006-11-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| EP1717862A3 (en) | 2005-04-28 | 2012-10-10 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| US7700984B2 (en) | 2005-05-20 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device including memory cell |
| US7868320B2 (en) | 2005-05-31 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| WO2006129739A1 (en) | 2005-05-31 | 2006-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US7905397B2 (en) * | 2005-06-01 | 2011-03-15 | Semiconductor Energy Laboratory Co., Ltd. | Data management method and data management system |
| KR101369864B1 (ko) | 2005-08-12 | 2014-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그 제조방법 |
| US7684781B2 (en) | 2005-11-25 | 2010-03-23 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device |
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| EP1993781A4 (en) * | 2006-02-03 | 2016-11-09 | Semiconductor Energy Lab Co Ltd | MANUFACTURING METHOD FOR MEMORY ELEMENT, LASER RADIATION APPARATUS AND LASER RADIATION METHOD |
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| US7551471B2 (en) * | 2006-04-28 | 2009-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
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| US7719001B2 (en) * | 2006-06-28 | 2010-05-18 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device with metal oxides and an organic compound |
| EP1883109B1 (en) | 2006-07-28 | 2013-05-15 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and method of manufacturing thereof |
| EP2064732A4 (en) * | 2006-10-19 | 2012-07-25 | Semiconductor Energy Lab | Semiconductor device and method for manufacturing the same |
| US7988057B2 (en) * | 2006-11-28 | 2011-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| EP2084745A4 (en) | 2006-11-29 | 2012-10-24 | Semiconductor Energy Lab | DEVICE AND METHOD FOR THE PRODUCTION THEREOF |
| US8283724B2 (en) | 2007-02-26 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device, and method for manufacturing the same |
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| US8469271B2 (en) | 2009-10-22 | 2013-06-25 | Intellipaper, Llc | Electronic storage devices, programming methods, and device manufacturing methods |
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2005
- 2005-10-12 KR KR1020127005780A patent/KR20140015128A/ko not_active Ceased
- 2005-10-12 EP EP05795303A patent/EP1812893A4/en not_active Ceased
- 2005-10-12 CN CN2009101736524A patent/CN101676931B/zh not_active Expired - Fee Related
- 2005-10-12 EP EP11001461.0A patent/EP2348460B1/en not_active Expired - Lifetime
- 2005-10-12 KR KR1020117025808A patent/KR101201698B1/ko not_active Expired - Fee Related
- 2005-10-12 WO PCT/JP2005/019156 patent/WO2006043573A1/en not_active Ceased
- 2005-10-12 CN CNB2005800356119A patent/CN100557813C/zh not_active Expired - Fee Related
- 2005-10-12 KR KR1020077011426A patent/KR101164437B1/ko not_active Expired - Fee Related
- 2005-10-12 US US11/547,304 patent/US7499305B2/en not_active Expired - Fee Related
- 2005-10-17 JP JP2005302175A patent/JP5019737B2/ja not_active Expired - Fee Related
- 2005-10-18 TW TW094136342A patent/TWI446606B/zh not_active IP Right Cessation
- 2005-10-18 TW TW97139934A patent/TWI472071B/zh not_active IP Right Cessation
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2009
- 2009-01-07 US US12/349,650 patent/US8089799B2/en not_active Expired - Fee Related
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2011
- 2011-06-02 US US13/151,299 patent/US8223531B2/en not_active Expired - Fee Related
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| WO2002037500A1 (en) * | 2000-10-31 | 2002-05-10 | The Regents Of The University Of California | Organic bistable device and organic memory cells |
| US20030183699A1 (en) * | 2002-03-29 | 2003-10-02 | Fujitsu Limited | Semiconductor integrated circuit, radio frequency identification transponder, and non-cotact IC card |
| US20040112964A1 (en) * | 2002-09-30 | 2004-06-17 | Nanosys, Inc. | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
Also Published As
| Publication number | Publication date |
|---|---|
| US7499305B2 (en) | 2009-03-03 |
| EP2348460B1 (en) | 2014-04-23 |
| KR101201698B1 (ko) | 2012-11-15 |
| US20070153565A1 (en) | 2007-07-05 |
| CN101044623A (zh) | 2007-09-26 |
| CN101676931A (zh) | 2010-03-24 |
| KR20140015128A (ko) | 2014-02-06 |
| KR20110127286A (ko) | 2011-11-24 |
| US8089799B2 (en) | 2012-01-03 |
| CN100557813C (zh) | 2009-11-04 |
| US8223531B2 (en) | 2012-07-17 |
| WO2006043573A1 (en) | 2006-04-27 |
| KR101164437B1 (ko) | 2012-07-13 |
| JP5019737B2 (ja) | 2012-09-05 |
| US20110227137A1 (en) | 2011-09-22 |
| EP1812893A1 (en) | 2007-08-01 |
| TWI472071B (zh) | 2015-02-01 |
| JP2006148080A (ja) | 2006-06-08 |
| EP2348460A1 (en) | 2011-07-27 |
| TW200908406A (en) | 2009-02-16 |
| US20090121874A1 (en) | 2009-05-14 |
| EP1812893A4 (en) | 2008-12-10 |
| KR20070084394A (ko) | 2007-08-24 |
| TWI446606B (zh) | 2014-07-21 |
| TW200633281A (en) | 2006-09-16 |
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