CN101657292B - 激光加工 - Google Patents

激光加工 Download PDF

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Publication number
CN101657292B
CN101657292B CN200780049577.XA CN200780049577A CN101657292B CN 101657292 B CN101657292 B CN 101657292B CN 200780049577 A CN200780049577 A CN 200780049577A CN 101657292 B CN101657292 B CN 101657292B
Authority
CN
China
Prior art keywords
laser
pulses
substrate
processing
scan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200780049577.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN101657292A (zh
Inventor
卡利·邓恩
西利安·奥布赖恩法伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irecto Science Industry Co ltd
Original Assignee
Irecto Science Industry Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irecto Science Industry Co ltd filed Critical Irecto Science Industry Co ltd
Publication of CN101657292A publication Critical patent/CN101657292A/zh
Application granted granted Critical
Publication of CN101657292B publication Critical patent/CN101657292B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. by grinding, polishing or smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
CN200780049577.XA 2006-11-27 2007-11-27 激光加工 Expired - Fee Related CN101657292B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0623642.6 2006-11-27
GB0623642A GB2444037A (en) 2006-11-27 2006-11-27 Laser Machining
PCT/EP2007/010291 WO2008064863A1 (en) 2006-11-27 2007-11-27 Laser machining

Publications (2)

Publication Number Publication Date
CN101657292A CN101657292A (zh) 2010-02-24
CN101657292B true CN101657292B (zh) 2016-03-16

Family

ID=37636595

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780049577.XA Expired - Fee Related CN101657292B (zh) 2006-11-27 2007-11-27 激光加工

Country Status (8)

Country Link
US (1) US7947575B2 (https=)
EP (1) EP2097209B1 (https=)
JP (1) JP2010510885A (https=)
KR (1) KR101260752B1 (https=)
CN (1) CN101657292B (https=)
GB (1) GB2444037A (https=)
TW (1) TWI448345B (https=)
WO (1) WO2008064863A1 (https=)

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JP5620669B2 (ja) * 2009-10-26 2014-11-05 東芝機械株式会社 レーザダイシング方法およびレーザダイシング装置
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
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JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
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JP5981094B2 (ja) 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
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KR20150096718A (ko) 2012-12-20 2015-08-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 이미지 내의 미생물 콜로니를 구분하는 방법
US20140268134A1 (en) * 2013-03-15 2014-09-18 Electro Scientific Industries, Inc. Laser sampling methods for reducing thermal effects
KR101999336B1 (ko) * 2013-04-09 2019-07-11 엘지디스플레이 주식회사 액정표시장치 및 그 제조 방법
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DE102014210611A1 (de) * 2014-06-04 2015-12-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Markieren eines DataMatrix-Codes auf einem Werkstück mittels eines Laserstrahls
CN107850554B (zh) 2015-08-26 2021-09-07 伊雷克托科学工业股份有限公司 相对于气流的镭射扫描定序及方向
US10794663B2 (en) 2017-05-11 2020-10-06 ZPE Licensing Inc. Laser induced friction surface on firearm
US10640837B2 (en) * 2017-09-27 2020-05-05 Faurecia Interior Systems, Inc. Vehicle interior panel with laser-formed tear seam
CN109048047B (zh) * 2018-07-09 2020-09-25 江苏峰钛激光科技有限公司 一种硬脆材料的激光打标方法
DE102018120763A1 (de) * 2018-08-24 2020-02-27 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung wenigstens eines Schlitzes in ein flächenhaftes Werkstück mittels Laserstrahl
CN109262147A (zh) * 2018-09-29 2019-01-25 北京工业大学 一种陶瓷增强金属基复合材料脉冲激光刻蚀加工方法
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
CN110681988A (zh) * 2019-09-17 2020-01-14 北京兆维电子(集团)有限责任公司 一种激光加工方法及系统
CN111992545B (zh) * 2020-08-28 2023-09-08 格力电器（武汉）有限公司 一种热水器内胆下环缝氧化皮清洗装置及清洗方法
KR102311246B1 (ko) * 2021-01-28 2021-10-14 이노덴 주식회사 유동형 어버트먼트 및 이를 구비한 임플란트
US12368053B2 (en) 2022-01-06 2025-07-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for laser drilling process for an integrated circuit package
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US12384009B2 (en) 2022-11-15 2025-08-12 ZPE Licensing Inc. Socket with laser induced friction surfaces
CN117718611A (zh) * 2024-01-22 2024-03-19 华中科技大学 一种间隔脉冲与扫描轨迹的协同激光制孔方法及系统
CN118559190B (zh) * 2024-07-31 2025-03-07 北京镭科光电科技有限公司 一种提升分布密度的焦点平移方法及相应的激光加工装置
CN119347171A (zh) * 2024-10-28 2025-01-24 河北工程大学 一种脉冲激光打孔方法

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CN1663038A (zh) * 2002-04-19 2005-08-31 Xsil技术有限公司 激光加工

Also Published As

Publication number Publication date
US7947575B2 (en) 2011-05-24
GB0623642D0 (en) 2007-01-03
WO2008064863A1 (en) 2008-06-05
JP2010510885A (ja) 2010-04-08
KR20090104003A (ko) 2009-10-05
KR101260752B1 (ko) 2013-05-06
GB2444037A (en) 2008-05-28
EP2097209A1 (en) 2009-09-09
EP2097209B1 (en) 2014-04-09
CN101657292A (zh) 2010-02-24
TWI448345B (zh) 2014-08-11
TW200922727A (en) 2009-06-01
US20100099239A1 (en) 2010-04-22

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160316

Termination date: 20171127