CN101641003B - 散热装置 - Google Patents

散热装置 Download PDF

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CN101641003B
CN101641003B CN200810303205.1A CN200810303205A CN101641003B CN 101641003 B CN101641003 B CN 101641003B CN 200810303205 A CN200810303205 A CN 200810303205A CN 101641003 B CN101641003 B CN 101641003B
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radiating fin
buckling
junction surface
buckling parts
heat abstractor
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CN101641003A (zh
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查新祥
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置,包括互相扣合的若干散热鳍片,每一散热鳍片包括一本体及于本体中间朝向相邻前一散热鳍片设置的多数扣片,且对应每一扣片处设有一开口,每一扣片包括与本体相连的一接合部、位于扣片自由端的一扣合部,及位于接合部与扣合部之间的一抵接部,该扣合部与该接合部相平行且具高度差,该接合部上设有一扣孔,该扣合部上设有一扣钩,后一散热鳍片的扣合部穿过前一散热鳍片的开口而叠置于该前一散热鳍片的接合部的外侧,该后一散热鳍片的扣钩扣于前一散热鳍片的扣孔内且后一散热鳍片的扣合部的末端抵靠于该前一散热鳍片的抵接部上使所有散热鳍片连接为一体。本发明中扣片位于散热鳍片的中间,节省了边料,降低了材料成本。

Description

散热装置
技术领域
本发明涉及一种散热装置,尤指一种用于给电子元件散热的散热装置。
背景技术
随着计算机产业的迅速发展,微处理芯片等发热电子元件产生的热量愈来愈多,为了将这些热量散发出去以保障电子元件的正常运行,业界采用在电子元件上贴设散热器以对发热电子元件进行散热。
传统散热器包括一基板和装设于该基板上的若干散热鳍片,这些散热鳍片呈L形,这种散热器遭到侧向冲击力时,散热鳍片易于因受挤压而变形。为了克服以上问题,业界出现了具有互锁结构的散热片,此种散热片的顶端与底端分别设有一扣接机构,这种扣接机构为凹口状,通过前后扣合的方式与相邻散热片的扣接机构配合而达到散热片间的互锁功效。进而在一定程度上防止了散热片在遭受外力时发生形变。但是,这种散热片的扣接机构位于散热片底端且呈凹口状,这种结构会影响散热片底端的光滑度,进而对散热片与基板间的连接造成不良影响,不仅影响连接的稳固性,也影响热量的传导,且扣接机构设置于散热片底端,浪费边料多。
发明内容
有鉴于此,有必要提供一种连接稳固、散热效果更佳,且能降低成本的散热装置。
本发明的散热装置包括互相扣合的若干散热鳍片,每一散热鳍片包括一本体及于本体中间朝向相邻前一散热鳍片设置的多数扣片,且对应每一扣片处设有一开口,每一扣片包括与本体相连的一接合部、位于扣片自由端的一扣合部,及位于接合部与扣合部之间的一抵接部,该扣合部与该接合部相平行且具高度差,该接合部上设有一扣孔,该扣合部上设有一扣钩,后一散热鳍片的扣合部穿过前一散热鳍片的开口而叠置于该前一散热鳍片的接合部的外侧,该后一散热鳍片的扣钩扣于前一散热鳍片的扣孔内且后一散热鳍片的扣合部的末端抵靠于该前一散热鳍片的抵接部上使所有散热鳍片连接为一体,组装方便。
与现有技术相比,本发明的散热鳍片连接稳固,且避免了现有技术中将扣接机构设置于散热片上下底端而影响了散热片底端光滑度进而影响了散热效率,散热效果佳。此外本发明的扣片位于本体中间,可经冲压一体成型,节省了边料,降低了材料成本。
附图说明
图1为本发明散热装置的较佳实施例的立体组合图。
图2为图1的立体分解图。
图3为图1中散热鳍片的立体示意图。
图4为图3中扣片的立体示意图。
图5为图1中散热器的立体剖视图。
图6为图5中圈V的局部放大图。
具体实施方式
请参阅图1至图3,该散热装置包括一散热器10、两热管70、一散热风扇90及两个风扇固定件80。
该散热器10包括一底板12及一散热鳍片组14,散热鳍片组14设于底板12上方,是由若干散热鳍片140相互卡扣而成,其下方形成两半圆形凹槽146,底板12上方对应该两凹槽146处设有两半圆形收容槽122,该两凹槽146与两收容槽122于组合后形成两圆形槽。每一热管70包括一冷凝段和一蒸发段,其冷凝段穿设于散热鳍片组14中,蒸发段收容于所述两圆形槽中,风扇固定件80固接于散热鳍片组14上,散热风扇90螺接于风扇固定件80上。
构成散热鳍片组14的每一散热鳍片140包括一本体142及若干扣片144。本体142中央形成一竖直的开槽1422将本体142分成对称的两部分,本体142于开槽1422的两侧分别形成一通孔1423,所有散热鳍片140上的通孔1423相互对应设置以供热管70的冷凝段插设。所述开槽1422未上、下贯穿本体142,本体142的底部中央设有两弧形孔。散热鳍片140于组合后所有弧形孔共同形成了所述两凹槽146。本体142的上端于左右两侧分别同向垂直延伸形成一折边1421,所有散热鳍片140的折边1421于组合后共同构成一水平的接触平面以设置风扇固定件80。
请同时参阅图3及图4,所述若干扣片144自本体142中间朝向相邻的前一散热鳍片140延伸设置,于所述开槽1422的左右两侧各设有两个,且均位于所述通孔1423的附近。每一扣片144呈倾斜状自上而下向着开槽1422的方向延伸,且位于开槽1422同侧的两扣片144相互平行。本体142对应每一扣片144处形成一开口1425,开口1425呈方形,位于开槽1422同侧的两扣片144分别位于该两开口1425相靠近的侧边上,即位于开口1425中靠近通孔1423的侧边上。该扣片144和开口1425可经对散热鳍片140冲压而同时一体形成。每一扣片144包括与本体142相连的一接合部1441、位于扣片144的自由端的一扣合部1443,及位于接合部1441与扣合部1443之间的一抵接部1442,接合部1441与扣合部1443的长度大致相等。接合部1441为一长方形片体,自本体142向外垂直延伸,接合部1441的中央设有一方形扣孔1445,扣孔1445经冲压而成,为避免完全冲孔造成扣片144变形,而采用了三边冲裁的方式,从而对应该扣孔1445处于另一侧相应形成一弹片1447,该弹片1447与接合部1441靠近抵接部1442的前端相连,并朝向本体142向开口1425的外侧倾斜延伸。所述抵接部1442自接合部1441的末端朝向开口1425的一侧垂直于接合部1441延伸形成。扣合部1442也为一长方形片体,自抵接部1442的末端沿垂直于抵接部1442的方向朝向相邻前一散热鳍片140延伸形成,扣合部1443与接合部1441大致相平行,且具有一定的高度差,该高度差即为抵接部1442的高度。扣合部1443上设有一扣钩1448,该扣钩1448的顶端靠近该扣合部1443的末端,其底端朝向抵接部1442的方向向开口1425的外侧倾斜延伸形成,该扣钩1448与弹片1447结构相同,且相平行。扣合部1443上对应该扣钩1448处于另一侧形成一收容孔1446,扣钩1448与收容孔1446可经冲压一体成型,扣钩1448受挤压变形时可避让于该收容孔1446内,外力卸除后扣钩1448恢复形变向外凸出。扣钩1448于散热鳍片140扣合后勾扣于前一散热鳍片140上相应扣片144的扣孔1445内。
请同时参阅图5及图6,组装时,将散热鳍片140间隔平行排列,因接合部1441与扣合部1443具有高度差,后一散热鳍片140的扣合部1443置于前一散热鳍片140的接合部1441的内端1440的外侧,施力于后一散热鳍片140使之前移,当后一散热鳍片140的扣合部1443的末端1449穿过开口1425滑过前一散热鳍片的接合部1441的内端1440的外侧时,扣钩1448与接合部1441的内端1440的外侧产生接触,扣钩1448受挤压发生弹性形变向内缩而避让于收容孔1446内,整个扣合部1443形成一平板而沿接合部1441的外侧前移,在扣钩1448滑至与接合部1441的扣孔1445相对时,扣钩1448恢复形变而嵌入扣孔1445内,此时,后一散热鳍片140的扣合部1443叠置于前一散热鳍片140的接合部1441的外侧,由于扣钩1448与弹片1447相平行,后一散热鳍片140的扣钩1448叠置于前一散热鳍片140的弹片1447上。后一散热鳍片140的扣合部1443的末端1449顶靠于前一散热鳍片140的抵接部1442的外侧。从而限制了前一散热鳍片140的后移,而勾扣于扣孔1445内的扣钩1448限制了前一散热鳍片140的前移,从而限制了前一散热鳍片140的前后方向的移动。此外,后一散热鳍片140的四扣片144分别倾斜位于本体142的两侧且穿设于开口1425内,限制了前一散热鳍片140上下左右方向的移动,因此散热鳍片140各个方向的运动都受到限制,从而使所有散热鳍片140牢固地组装为一体。
如此,组装方便,散热器10连接稳固,且避免了现有技术中将扣接机构设置于散热片上下底端而影响了散热片底端光滑度进而影响了散热效率,散热效果佳。而且,因扣片144位于本体142中央,相对现有技术中位于散热片边缘的扣接机构,节省了边料,降低了材料成本。此外,因风扇90正中央下方处即转子轮毂下方处易产生热漩涡而使该处的热量不易散发,而散热鳍片140中容置热管70冷凝段的通孔1423附近的温度又较高,因而,位于每一通孔1423附近的两个扣片144从上至下向着开槽1422的方向倾斜有利于将风扇90轮毂外周下方的强风导至本体142的中央高温位置处,即将气流从散热鳍片140的两侧导向散热鳍片140的中部,以此加强对流,加速热量的散发。

Claims (10)

1.一种散热装置,包括互相扣合的若干散热鳍片,其特征在于:每一散热鳍片包括一本体及于本体中间朝向相邻前一散热鳍片设置的多数扣片,且对应每一扣片处设有一开口,每一扣片包括与本体相连的一接合部、位于扣片自由端的一扣合部,及位于接合部与扣合部之间的一抵接部,该扣合部与该接合部相平行且具高度差,该接合部上设有一扣孔,该扣合部上设有一扣钩,后一散热鳍片的扣合部穿过前一散热鳍片的开口而叠置于该前一散热鳍片的接合部的外侧,该后一散热鳍片的扣钩扣于前一散热鳍片的扣孔内且后一散热鳍片的扣合部的末端抵靠于该前一散热鳍片的抵接部上使所有散热鳍片连接为一体。
2.如权利要求1所述的散热装置,其特征在于:所述多个扣片中包括至少两互相平行的扣片,该本体上对应该至少两扣片处形成至少两开口,该两扣片分别位于该两开口相互靠近的侧边上。
3.如权利要求1所述的散热装置,其特征在于:该接合部自该本体向外垂直延伸,该抵接部自接合部的末端沿垂直于接合部的方向朝向开口的一侧延伸,该扣合部自抵接部的末端沿垂直于抵接部的方向朝前一散热鳍片延伸形成。
4.如权利要求3所述的散热装置,其特征在于:该扣钩的顶端靠近该扣合部的末端,该扣钩的底端朝向所述抵接部向外倾斜凸出形成。
5.如权利要求1所述的散热装置,其特征在于:该扣合部上对应该扣钩处于另一侧形成一收容孔,该收容孔于扣合过程中提供扣钩弹性变形所需的避让空间。
6.如权利要求5所述的散热装置,其特征在于:该接合部上对应该扣孔处于另一侧形成一弹片,前一散热鳍片的弹片于扣合状态下与后一散热鳍片的扣钩相重叠。
7.如权利要求1所述的散热装置,其特征在于:该本体为一平板,其中央形成一竖直的开槽,该多数扣片对称分布在开槽两侧的本体上,且位于开槽同侧的多个扣片相互平行。
8.如权利要求7所述的散热装置,其特征在于:位于开槽同侧的该多个扣片从上至下向开槽的方向倾斜延伸。
9.如权利要求8所述的散热装置,其特征在于:还包括一风扇,该风扇设置在该若干散热鳍片上,该风扇产生的气流经由该多个扣片导引至散热鳍片的中部。
10.如权利要求8所述的散热装置,其特征在于:还包括至少一热管,该至少一热管的冷凝段穿插在散热鳍片内,位于开槽同侧的该多个扣片分布在热管的冷凝段附近。
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CN101646330B (zh) * 2008-08-07 2013-06-05 富准精密工业(深圳)有限公司 散热装置
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
PL2384108T3 (pl) * 2010-04-27 2014-06-30 Giga Byte Tech Co Ltd Usuwające kurz urządzenie rozpraszające ciepło z dwoma wentylatorami chłodzącymi
CN102236397B (zh) * 2010-04-30 2015-04-01 技嘉科技股份有限公司 具有除尘功能的双风扇式散热装置及其控制电路与鳍片组
RU2469374C2 (ru) * 2010-08-25 2012-12-10 Гига-Байт Текнолоджи Ко., Лтд. Пылеудаляющее теплорассеивающее устройство с двумя охлаждающими вентиляторами
US8746325B2 (en) * 2011-03-22 2014-06-10 Tsung-Hsien Huang Non-base block heat sink
US10209388B2 (en) * 2013-12-20 2019-02-19 Schlumberger Technology Corporation Method and apparatus to generate a crosswell data set
CN106793672B (zh) * 2016-11-18 2019-02-05 深圳市超频三科技股份有限公司 堆叠式散热器及其散热片
CN108281831B (zh) * 2018-01-23 2020-05-12 泰科电子(上海)有限公司 插座组件和传热组件
CN108200746B (zh) * 2018-01-26 2023-08-25 惠州市华贯电子科技有限公司 一种散热片连接结构及使用该散热片的散热器
CN110972443B (zh) * 2018-09-30 2023-09-15 泰科电子(上海)有限公司 散热装置和壳体组件
CN111987523A (zh) * 2019-05-24 2020-11-24 泰科电子(上海)有限公司 连接器、散热器

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