CN101631832A - 用于制备类似abs的制品的可光固化组合物 - Google Patents

用于制备类似abs的制品的可光固化组合物 Download PDF

Info

Publication number
CN101631832A
CN101631832A CN200880008235A CN200880008235A CN101631832A CN 101631832 A CN101631832 A CN 101631832A CN 200880008235 A CN200880008235 A CN 200880008235A CN 200880008235 A CN200880008235 A CN 200880008235A CN 101631832 A CN101631832 A CN 101631832A
Authority
CN
China
Prior art keywords
ethyl
trimethylene oxide
ether
weight
ylmethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880008235A
Other languages
English (en)
Chinese (zh)
Inventor
L·梅斯
C·查佩拉特
R·C·帕特尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Huntsman Advanced Materials Switzerland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Switzerland GmbH filed Critical Huntsman Advanced Materials Switzerland GmbH
Publication of CN101631832A publication Critical patent/CN101631832A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037Production of three-dimensional images
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200880008235A 2007-03-14 2008-03-07 用于制备类似abs的制品的可光固化组合物 Pending CN101631832A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07005267 2007-03-14
EP07005267.5 2007-03-14

Publications (1)

Publication Number Publication Date
CN101631832A true CN101631832A (zh) 2010-01-20

Family

ID=38336839

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880008235A Pending CN101631832A (zh) 2007-03-14 2008-03-07 用于制备类似abs的制品的可光固化组合物

Country Status (6)

Country Link
US (1) US20100119835A1 (enExample)
EP (1) EP2118197A1 (enExample)
JP (1) JP2010520947A (enExample)
KR (1) KR20100014901A (enExample)
CN (1) CN101631832A (enExample)
WO (1) WO2008110512A1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108977071A (zh) * 2018-06-26 2018-12-11 武汉长盈鑫科技有限公司 一种互穿网络聚合物结构的光纤外层涂料及其制备方法
WO2019019924A1 (zh) * 2017-07-27 2019-01-31 常州强力先端电子材料有限公司 一种氧杂环丁烷类单体化合物及其制备方法
CN110713594A (zh) * 2018-07-12 2020-01-21 常州强力电子新材料股份有限公司 环氧改性醇酸树脂及其制备方法、包含该环氧改性醇酸树脂的组合物及其应用
CN110845702A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的超支化环氧树脂、含有其的可能量固化组合物及应用
CN110845628A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的环氧接枝改性硝酸纤维素、含有其的可能量固化组合物及应用
CN111491776A (zh) * 2017-12-19 2020-08-04 佩什托普公司 用于增材制造的杂合光聚合物组合物
CN113148439A (zh) * 2016-12-28 2021-07-23 株式会社Lg化学 阳离子可聚合组合物的包装容器以及使用该包装容器的包装方法
CN114509914A (zh) * 2020-11-16 2022-05-17 常州强力先端电子材料有限公司 光固化组合物、光学膜及其制备方法和光学产品
CN114507479A (zh) * 2020-11-16 2022-05-17 常州强力先端电子材料有限公司 光固化组合物、粘结剂及其制备方法、基材的粘结方法
CN114507416A (zh) * 2020-11-16 2022-05-17 常州强力先端电子材料有限公司 光固化组合物、涂料及其制备方法、碳纤维预浸料及其制备方法和纤维复合材料

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007031505A1 (en) * 2005-09-13 2007-03-22 Huntsman Advanced Materials (Switzerland) Gmbh Photocurable compositions for preparing abs-like articles
JP5881948B2 (ja) * 2007-11-27 2016-03-09 スリーディー システムズ インコーポレーテッド 高透明性を有する三次元物品を製造するための光硬化型樹脂組成物
US20100190881A1 (en) * 2009-01-28 2010-07-29 3D Systems, Incorporated Radiation Curable Compositions Useful in Solid Freeform Fabrication Systems
JP5302022B2 (ja) * 2009-01-28 2013-10-02 シーメット株式会社 光学的立体造形用樹脂組成物
JP5308398B2 (ja) * 2010-05-11 2013-10-09 日東電工株式会社 光導波路形成用樹脂組成物およびそれを用いた光導波路
CN103246164A (zh) * 2013-06-04 2013-08-14 苏州太速雷电子科技有限公司 一种用于立体光刻成型的光敏树脂及其制备方法
WO2014204450A1 (en) 2013-06-19 2014-12-24 Hewlett-Packard Development Company, L.P. Compositions for three-dimensional (3d) printing
DE102014221715A1 (de) 2014-10-24 2016-04-28 Siemens Aktiengesellschaft Tränkharz, Leiteranordnung, elektrische Spule und elektrische Maschine
WO2016106062A1 (en) 2014-12-23 2016-06-30 Bridgestone Americas Tire Operations, Llc Actinic radiation curable polymeric mixtures, cured polymeric mixtures and related processes
GB201508178D0 (en) * 2015-05-13 2015-06-24 Photocentric Ltd Method for making an object
EP3305825B1 (en) * 2015-05-27 2022-11-16 Daicel Corporation Photocurable composition, cured product and optical component using same
JP2018536731A (ja) 2015-11-17 2018-12-13 ディーエスエム アイピー アセッツ ビー.ブイ.Dsm Ip Assets B.V. 改善された付加造形用アンチモンフリー放射線硬化性組成物およびインベストメント鋳造プロセスにおけるその用途
WO2017105960A1 (en) 2015-12-17 2017-06-22 Bridgestone Americas Tire Operations, Llc Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing
EP3532267B1 (en) 2016-10-27 2023-03-01 Bridgestone Americas Tire Operations, LLC Processes for producing cured polymeric products by additive manufacturing
CN107118502A (zh) * 2017-06-19 2017-09-01 合肥斯科尔智能科技有限公司 一种医疗产品用抗菌3d打印材料
CN107382719B (zh) * 2017-06-23 2020-07-14 武汉长盈鑫科技有限公司 一种酸酐改性联苯氧杂环丁烷丙烯酸酯预聚物的制备方法
KR102337035B1 (ko) * 2017-06-30 2021-12-08 교리쯔 가가꾸 산교 가부시키가이샤 유기 el 소자의 밀봉용의 양이온 중합 경화형 잉크젯용 수지 조성물
EP4206820A1 (en) * 2021-12-30 2023-07-05 Arkema France Hybrid photocurable composition
WO2024070348A1 (ja) * 2022-09-26 2024-04-04 東レ株式会社 樹脂組成物、硬化物、シンチレータパネルおよびインダクタ
CN116515123B (zh) * 2023-04-03 2025-02-18 同济大学 一类超支化聚合物、制备方法和应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158581A (ja) * 1996-12-05 1998-06-16 Kansai Paint Co Ltd 紫外線硬化型缶用塗料組成物
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Jsr株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
KR20120086737A (ko) * 2002-05-03 2012-08-03 디에스엠 아이피 어셋츠 비.브이. 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법
US20040137368A1 (en) * 2003-01-13 2004-07-15 3D Systems, Inc. Stereolithographic resins containing selected oxetane compounds
SE529306C2 (sv) * 2005-03-18 2007-06-26 Perstorp Specialty Chem Ab Ultravioletthärdande hartskomposition
SE0501028L (sv) * 2005-05-04 2006-11-05 Perstorp Specialty Chem Ab Hybrid radiation curable composition and use thereof
WO2007031505A1 (en) * 2005-09-13 2007-03-22 Huntsman Advanced Materials (Switzerland) Gmbh Photocurable compositions for preparing abs-like articles

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113148439A (zh) * 2016-12-28 2021-07-23 株式会社Lg化学 阳离子可聚合组合物的包装容器以及使用该包装容器的包装方法
CN113148439B (zh) * 2016-12-28 2022-11-08 株式会社Lg化学 阳离子可聚合组合物的包装容器以及使用该包装容器的包装方法
WO2019019924A1 (zh) * 2017-07-27 2019-01-31 常州强力先端电子材料有限公司 一种氧杂环丁烷类单体化合物及其制备方法
CN109305947A (zh) * 2017-07-27 2019-02-05 常州强力先端电子材料有限公司 一种氧杂环丁烷类单体化合物及其制备方法
CN111491776B (zh) * 2017-12-19 2022-06-03 佩什托普公司 用于增材制造的杂合光聚合物组合物
CN111491776A (zh) * 2017-12-19 2020-08-04 佩什托普公司 用于增材制造的杂合光聚合物组合物
CN108977071A (zh) * 2018-06-26 2018-12-11 武汉长盈鑫科技有限公司 一种互穿网络聚合物结构的光纤外层涂料及其制备方法
CN110713594A (zh) * 2018-07-12 2020-01-21 常州强力电子新材料股份有限公司 环氧改性醇酸树脂及其制备方法、包含该环氧改性醇酸树脂的组合物及其应用
CN110845628A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的环氧接枝改性硝酸纤维素、含有其的可能量固化组合物及应用
CN110845702B (zh) * 2018-08-21 2022-09-30 常州强力电子新材料股份有限公司 可能量固化的超支化环氧树脂、含有其的可能量固化组合物及应用
CN110845702A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的超支化环氧树脂、含有其的可能量固化组合物及应用
CN114509914A (zh) * 2020-11-16 2022-05-17 常州强力先端电子材料有限公司 光固化组合物、光学膜及其制备方法和光学产品
CN114507479A (zh) * 2020-11-16 2022-05-17 常州强力先端电子材料有限公司 光固化组合物、粘结剂及其制备方法、基材的粘结方法
CN114507416A (zh) * 2020-11-16 2022-05-17 常州强力先端电子材料有限公司 光固化组合物、涂料及其制备方法、碳纤维预浸料及其制备方法和纤维复合材料
CN114507479B (zh) * 2020-11-16 2023-12-15 常州强力先端电子材料有限公司 光固化组合物、粘结剂及其制备方法、基材的粘结方法

Also Published As

Publication number Publication date
KR20100014901A (ko) 2010-02-11
WO2008110512A1 (en) 2008-09-18
US20100119835A1 (en) 2010-05-13
JP2010520947A (ja) 2010-06-17
EP2118197A1 (en) 2009-11-18

Similar Documents

Publication Publication Date Title
CN101631832A (zh) 用于制备类似abs的制品的可光固化组合物
KR101507184B1 (ko) 경화성 조성물
CN103809377B (zh) 用于制备类似abs的制品的可光固化组合物
EP2215525B1 (en) Photocurable resin composition for producing three dimensional articles having high clarity
US8334025B2 (en) Antimony-free photocurable resin composition and three dimensional article
JP3765896B2 (ja) 光学的立体造形用光硬化性樹脂組成物
JP3820289B2 (ja) 樹脂製成形用型製造用光硬化性樹脂組成物および樹脂製成形用型の製造方法
JP2013166893A (ja) 光学的立体造形用放射線硬化性組成物
JP4627587B2 (ja) 樹脂組成物および立体形状物
JP4017236B2 (ja) 光硬化性液状樹脂組成物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20100120