CN101626008A - 一种铜线键合ic芯片封装件的生产方法 - Google Patents

一种铜线键合ic芯片封装件的生产方法 Download PDF

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CN101626008A
CN101626008A CN200910117274A CN200910117274A CN101626008A CN 101626008 A CN101626008 A CN 101626008A CN 200910117274 A CN200910117274 A CN 200910117274A CN 200910117274 A CN200910117274 A CN 200910117274A CN 101626008 A CN101626008 A CN 101626008A
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chip
copper
lead frame
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bonding
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常红军
郭小伟
慕蔚
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Tianshui Huatian Technology Co Ltd
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Abstract

一种铜线键合IC芯片封装件的生产方法，在IC芯片的焊盘上设一金球，在金球上堆叠铜键合球，拱丝拉弧在引线框架内引脚上打一个铜焊点，使IC芯片的焊盘与引线框架引脚相连。塑封体覆盖IC芯片、焊盘上的金球、堆叠金球上的铜球、拱丝拉弧在引线框架内引脚上的铜焊点及引线框架部分引脚，构成电路的整体。本发明的生产方法包括晶圆减薄、划片、上芯、压焊、塑封、后固化、打印、冲切分离、检验、包装、入库。本发明结构简单合理，能避免产生弹坑、简单易行，而且焊点强度加强，铜焊线的拉力和焊点的剪切力要比直接打线的铜(金)键合生产方法高，而且内焊点不会脱焊，封装良率和测试良率均会提高，提高了可靠性。

Description

一种铜线键合IC芯片封装件的生产方法
技术领域
本发明涉及电子信息自动化元器件制造技术领域，尤其涉及到一种IC芯片集成电路封装，具体说是一种铜线键合IC芯片封装件，本发明还包括该封装件的生产方法。
背景技术
虽然在20世纪80年代晚期和90年代早期，几乎所有半导体制造商都在开展铜线键合研制工作，但由于成品率的问题和铜线本身的一些局限性，他们都没能进入大批量IC制造业中。目前经过铜线键合工艺的优化和在铜线及支持设备上的重要改进，已在低档和简单线路设计的IC芯片封装中得以批量生产。但对于多引脚产品，由于IC芯片焊盘(PAD)下有较复杂的线路设计，铜线键合时产生的弹坑，会给产品带来致命损伤。为了防止铜线键合焊点产生弹坑，封装工艺不得不对IC芯片提出了较高的要求，IC芯片焊盘(PAD)下的钝化层既要厚，又要坚硬，IC芯片焊盘上的铝层厚度不得小于3μm。这样的要求给芯片制造增加了成本，在芯片制造成本与性价比激烈竞争的状况下，要让芯片制造商改进的可能性很小。正常铜线键合方法是先在IC芯片焊盘(PAD)上打一个铜键合球，然后拱丝拉弧，在引线框架内引脚上打一个月牙形焊点。由于铜线相对于金线较硬，铜键合焊点直接打在IC芯片焊盘(PAD)上容易产生弹坑，影响产品的质量和可靠性。
发明内容
本发明就是为了解决铜线键合在IC芯片焊盘上产生弹坑问题，存在质量和可靠性隐患，并制约了铜线键合封装向多引脚和高端产品推广的进程的技术问题，从而提供一种能避免产生弹坑、简单易行的一种铜线键合IC芯片封装件。
本发明采用下述技术手段解决其技术问题：
一种铜线键合IC芯片封装件，包括引线框架载体、引线框架内引脚、引线框架外引脚、塑封体、粘片胶、IC芯片。所述IC芯片的焊盘上设一金球，在金球上堆叠铜键合球，拱丝拉弧在引线框架内引脚上打一个铜焊点，使IC芯片的焊盘与引线框架引脚相连。所述塑封体覆盖IC芯片、焊盘上的金球、堆叠金球上的铜球、拱丝拉弧在引线框架内引脚上的铜焊点及引线框架部分引脚，构成电路的整体。
所述铜线键合IC芯片封装件的生产方法，包括晶圆减薄、划片、上芯、压焊、塑封、后固化、打印、冲切分离、检验、包装、入库工艺，其中的压焊操作按下述工艺步骤进行：
a、先在每个需要焊线的IC芯片的焊盘上预植一个金球；
b、在每个IC芯片焊盘上已预植的金球上，堆叠一个铜键合球；
c、在金球上堆叠铜键合球后，向上拱丝拉弧到引线框架内引脚上打一个月牙形焊点。
本发明的产品结构简单合理，由于铜键合球不是直接打在芯片焊盘上，而是打在金球上，不仅不会产生弹坑，而且焊点强度加强，铜焊线的的拉力和焊点的剪切力要比直接打线的铜(金)键合生产方法高，而且内焊点不会脱焊，封装良率和测试良率均会提高，提高了可靠性。本发明的方法简单易行，现行设备完全可以满足工艺要求，不需要增加新的设备投资。既解决了铜线键合直接在IC芯片上焊盘上打线出现弹坑的难题，又可在多引脚封装中应用，还可以推广到其它高端封装，实现铜线代替金线键合，节约金线焊线成本更加明显，将产生良好的经济效益和社会效益。
附图说明
图1为现有铜线键合产品结构剖面示意图；
图2为本发明结构示意图；
图3为本发明金球上堆叠铜键合球示意图。
具体实施方式
下面结合附图对本发明做进一步详细叙述：
本发明包括引线框架载体1、引线框架内引脚6、塑封体10、粘片胶2、IC芯片3。所述引线框架载体上通过片胶2粘接IC芯片3，IC芯片3的焊盘4上先预植一个金球5，然后再在金球5上堆叠铜键合球7，拱丝拉弧8在引线框架内引脚6上打一个铜焊点9，使IC芯片3的焊盘4与引线框架内引脚6相连，构成电路的信号和电流通道。塑封料10覆盖了IC芯片3、焊盘4上的金球5、堆叠在金球5上的铜键合球7及拱丝拉弧8在引线框架内引脚6上打的铜焊点9及引线框架部分引脚，构成电路的整体，并对电路起到了保护和支撑作用。
本发明的生产方法的全线工艺流程如下：
晶圆减薄→划片→上芯→压焊→塑封→后固化→打印→冲切分离→检验→包装→入库。
其中的减薄、划片、上芯、塑封、后固化、切筋、电镀、打印、成形分离、包装与常规金线和铜线键合封装生产相同。
其中的压焊操作工艺流程如下：
植金球-叠球-拱丝打点。
1.植金球
在压焊台上将金线轴固定，穿好线后，将已粘IC芯片的框架自动传送到轨道上，预热后传送到压焊夹具上，在每个需要焊线的IC芯片3的焊盘4上植一个金球，打完金球的框架传送到收料夹；
2.叠球
在压焊台上将铜线轴固定，穿好线后，将已植金球的框架自动传送到轨道上，预热后传送到压焊夹具上，在每个IC芯片焊盘上已打金球上堆叠一个铜键合球；
3.拱丝打点
在每个IC芯片焊盘4上已打金球5上堆叠一个铜键合球7后，向上拱丝拉弧8到引线框架内引脚6上打一个月牙形焊点9。
实施例1
生产方法的全线工艺流程中的减薄、划片、上芯、塑封、后固化、切筋、电镀、打印、成形分离、包装与常规金线和铜线键合封装生产相同，其压焊操作工艺过程为
1.植金球
在压焊台上将金线轴固定，穿好线后，将已粘IC芯片的框架自动传送到轨道上，预热后传送到压焊夹具上，在每个需要焊线的IC芯片3的焊盘4上植一个金球，打完金球的框架传送到收料夹；
2.叠球
在压焊台上将铜线轴固定，穿好线后，将已植金球的框架自动传送到轨道上，预热后传送到压焊夹具上，在每个IC芯片焊盘上已打金球上堆叠一个铜键合球；
3.拱丝打点
在每个IC芯片焊盘4上已打金球5上堆叠一个铜键合球7后，向上拱丝拉弧8到引线框架内引脚6上打一个月牙形焊点9。

Claims (2)

1、一种铜线键合IC芯片封装件，包括引线框架载体、引线框架内引脚、引线框架外引脚、塑封体、粘片胶、IC芯片，其特征在于所述IC芯片(3)的焊盘(4)上设一金球(5)，在金球(5)上堆叠铜键合球(7)，拱丝拉弧(8)在引线框架内引脚(6)上打一个铜焊点(9)，使IC芯片(3)的焊盘(4)与框架引脚(6)相连；所述塑封体(10)覆盖IC芯片(3)、焊盘(4)上的金球(5)、堆叠在金球(5)上的铜球(7)、拱丝拉弧(8)在引线框架内引脚(6)上的铜焊点(9)及引线框架部分引脚，构成电路的整体。
2、一种生产如权利要求1所述铜线键合IC芯片封装件的生产方法，包括晶圆减薄、划片、上芯、压焊、塑封、后固化、打印、冲切分离、检验、包装、入库工艺，其特征在于其中的压焊操作按下述工艺步骤进行：
a、植金球：先在每个需要焊线的IC芯片(3)的焊盘(4)上预植一个金球(5)；
b、叠球：在每个IC芯片焊盘上已预植金球(5)上，堆叠一个铜键合球(7)；
c、拱丝打点：在金球上堆叠铜键合球(7)后，向上拱丝拉弧(8)到引线框架内引脚(6)上打一个月牙形焊点(9)。
CN200910117274A 2009-05-11 2009-05-11 一种铜线键合ic芯片封装件的生产方法 Pending CN101626008A (zh)

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