CN101615570B - 真空处理装置 - Google Patents

真空处理装置 Download PDF

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Publication number
CN101615570B
CN101615570B CN200910146244XA CN200910146244A CN101615570B CN 101615570 B CN101615570 B CN 101615570B CN 200910146244X A CN200910146244X A CN 200910146244XA CN 200910146244 A CN200910146244 A CN 200910146244A CN 101615570 B CN101615570 B CN 101615570B
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CN
China
Prior art keywords
container handling
lid
container
cap assembly
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200910146244XA
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English (en)
Chinese (zh)
Other versions
CN101615570A (zh
Inventor
佐佐木芳彦
田中善嗣
石田宽
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101615570A publication Critical patent/CN101615570A/zh
Application granted granted Critical
Publication of CN101615570B publication Critical patent/CN101615570B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN200910146244XA 2008-06-25 2009-06-24 真空处理装置 Expired - Fee Related CN101615570B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008166403A JP5062057B2 (ja) 2008-06-25 2008-06-25 真空処理装置
JP2008-166403 2008-06-25
JP2008166403 2008-06-25

Publications (2)

Publication Number Publication Date
CN101615570A CN101615570A (zh) 2009-12-30
CN101615570B true CN101615570B (zh) 2011-11-30

Family

ID=41495135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910146244XA Expired - Fee Related CN101615570B (zh) 2008-06-25 2009-06-24 真空处理装置

Country Status (4)

Country Link
JP (1) JP5062057B2 (ja)
KR (1) KR101059365B1 (ja)
CN (1) CN101615570B (ja)
TW (1) TW201009979A (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8562742B2 (en) * 2010-04-30 2013-10-22 Applied Materials, Inc. Apparatus for radial delivery of gas to a chamber and methods of use thereof
JP5647336B2 (ja) 2011-04-04 2014-12-24 キヤノンアネルバ株式会社 プラズマ処理装置
KR102028913B1 (ko) * 2013-05-31 2019-11-08 엘지디스플레이 주식회사 기판 탈착 장치 및 이를 이용한 평판표시장치의 제조방법
TWI600853B (zh) * 2015-06-05 2017-10-01 Hirata Spinning Chamber device and processing system
US10043689B2 (en) 2015-06-05 2018-08-07 Hirata Corporation Chamber apparatus and processing system
KR102434800B1 (ko) 2015-08-13 2022-08-22 코웨이 주식회사 태블릿형 재생제를 이용한 재생통 및 이를 이용한 재생수 생성 방법
KR102447481B1 (ko) 2015-08-13 2022-09-26 코웨이 주식회사 승하강식 통과부재를 구비한 재생통 및 이를 포함하는 연수기
KR101816120B1 (ko) 2015-08-13 2018-01-08 코웨이 주식회사 반자동 수압식 연수기
JP6774368B2 (ja) * 2017-04-21 2020-10-21 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置のメンテナンス方法
CN107610997A (zh) * 2017-07-20 2018-01-19 江苏鲁汶仪器有限公司 一种具有晶圆位置检测装置的气相腐蚀腔体
KR102400583B1 (ko) * 2017-09-22 2022-05-20 삼성전자주식회사 초임계 처리용 공정챔버 및 이를 구비하는 기판처리 장치
JP6956696B2 (ja) * 2017-10-06 2021-11-02 東京エレクトロン株式会社 パーティクル発生抑制方法及び真空装置
JP7169786B2 (ja) * 2018-06-25 2022-11-11 東京エレクトロン株式会社 メンテナンス装置
JP6818001B2 (ja) * 2018-12-12 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 処理チャンバおよび基板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63179522A (ja) * 1987-01-21 1988-07-23 Tokyo Electron Ltd アツシング装置
JPH01206625A (ja) * 1988-02-15 1989-08-18 Tokyo Electron Ltd アッシング方法
JPH06151365A (ja) * 1992-11-13 1994-05-31 Hitachi Ltd プラズマ処理装置
JP2828066B2 (ja) * 1996-09-27 1998-11-25 松下電器産業株式会社 基板のプラズマクリーニング装置
JP3451894B2 (ja) * 1997-07-29 2003-09-29 松下電器産業株式会社 電子部品のプラズマ処理装置及びプラズマ処理方法
JPH1154484A (ja) * 1997-08-06 1999-02-26 Matsushita Electric Ind Co Ltd 電子部品のプラズマ処理装置およびプラズマ処理方法
JP4767574B2 (ja) 2005-03-31 2011-09-07 東京エレクトロン株式会社 処理チャンバおよび処理装置

Also Published As

Publication number Publication date
CN101615570A (zh) 2009-12-30
KR101059365B1 (ko) 2011-08-24
JP5062057B2 (ja) 2012-10-31
KR20100002175A (ko) 2010-01-06
TW201009979A (en) 2010-03-01
JP2010010302A (ja) 2010-01-14

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Granted publication date: 20111130

Termination date: 20150624

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