CN101558357A - 使用覆盖在抗蚀剂上的保护层的沉浸光刻技术和产品 - Google Patents

使用覆盖在抗蚀剂上的保护层的沉浸光刻技术和产品 Download PDF

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Publication number
CN101558357A
CN101558357A CNA2005800013797A CN200580001379A CN101558357A CN 101558357 A CN101558357 A CN 101558357A CN A2005800013797 A CNA2005800013797 A CN A2005800013797A CN 200580001379 A CN200580001379 A CN 200580001379A CN 101558357 A CN101558357 A CN 101558357A
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CN
China
Prior art keywords
immersion
layer
photoresist layer
photoresist
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800013797A
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English (en)
Chinese (zh)
Inventor
凯尔·帕特松
柯克·施特罗泽夫斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN101558357A publication Critical patent/CN101558357A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
CNA2005800013797A 2004-02-17 2005-02-15 使用覆盖在抗蚀剂上的保护层的沉浸光刻技术和产品 Pending CN101558357A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04290429A EP1564592A1 (en) 2004-02-17 2004-02-17 Protection of resist for immersion lithography technique
EP04290429.2 2004-02-17

Publications (1)

Publication Number Publication Date
CN101558357A true CN101558357A (zh) 2009-10-14

Family

ID=34684792

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800013797A Pending CN101558357A (zh) 2004-02-17 2005-02-15 使用覆盖在抗蚀剂上的保护层的沉浸光刻技术和产品

Country Status (7)

Country Link
US (1) US20080171285A1 (https=)
EP (2) EP1564592A1 (https=)
JP (1) JP2007529881A (https=)
KR (1) KR20060133976A (https=)
CN (1) CN101558357A (https=)
TW (1) TW200538881A (https=)
WO (1) WO2005078525A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115047728A (zh) * 2022-07-01 2022-09-13 中国科学院光电技术研究所 等离子体共振腔透镜光刻的成像结构保护方法及其结构
WO2023108997A1 (zh) * 2021-12-13 2023-06-22 长鑫存储技术有限公司 光刻胶图案的形成方法和光刻胶结构
US12607935B2 (en) 2021-12-13 2026-04-21 Changxin Memory Technologies, Inc. Method of forming photoresist pattern, and photoresist structure

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050161644A1 (en) 2004-01-23 2005-07-28 Peng Zhang Immersion lithography fluids
TWI259319B (en) 2004-01-23 2006-08-01 Air Prod & Chem Immersion lithography fluids
JP4551701B2 (ja) * 2004-06-14 2010-09-29 富士フイルム株式会社 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法
WO2006009169A1 (ja) 2004-07-21 2006-01-26 Nikon Corporation 露光方法及びデバイス製造方法
JP4696558B2 (ja) * 2005-01-07 2011-06-08 Ｊｓｒ株式会社 フォトレジストパターン形成方法、及びフォトレジストパターン形成用基板
US20070084793A1 (en) * 2005-10-18 2007-04-19 Nigel Wenden Method and apparatus for producing ultra-high purity water
JP2009117832A (ja) * 2007-11-06 2009-05-28 Asml Netherlands Bv リソグラフィの基板を準備する方法、基板、デバイス製造方法、密封コーティングアプリケータ及び密封コーティング測定装置
JP6400161B1 (ja) * 2017-08-08 2018-10-03 キヤノン株式会社 成膜方法、ドライフィルムの製造方法、および液体吐出ヘッドの製造方法
PT117491B (pt) * 2021-09-30 2024-03-12 Univ De Coimbra Copolímero cromogénico, seu método de obtenção, produtos que o incorporam e método de deteção de contrafação e autenticaçao de produtos

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPH06130657A (ja) * 1991-08-20 1994-05-13 Mitsubishi Rayon Co Ltd ドライフィルムレジスト
JP3281053B2 (ja) * 1991-12-09 2002-05-13 株式会社東芝 パターン形成方法
JP3158710B2 (ja) * 1992-09-16 2001-04-23 日本ゼオン株式会社 化学増幅レジストパターンの形成方法
US6727047B2 (en) * 1999-04-16 2004-04-27 Applied Materials, Inc. Method of extending the stability of a photoresist during direct writing of an image upon the photoresist
US20010044077A1 (en) * 1999-04-16 2001-11-22 Zoilo Chen Ho Tan Stabilization of chemically amplified resist coating
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
US7432042B2 (en) * 2003-12-03 2008-10-07 United Microelectronics Corp. Immersion lithography process and mask layer structure applied in the same
US20060008746A1 (en) * 2004-07-07 2006-01-12 Yasunobu Onishi Method for manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023108997A1 (zh) * 2021-12-13 2023-06-22 长鑫存储技术有限公司 光刻胶图案的形成方法和光刻胶结构
US12607935B2 (en) 2021-12-13 2026-04-21 Changxin Memory Technologies, Inc. Method of forming photoresist pattern, and photoresist structure
CN115047728A (zh) * 2022-07-01 2022-09-13 中国科学院光电技术研究所 等离子体共振腔透镜光刻的成像结构保护方法及其结构

Also Published As

Publication number Publication date
WO2005078525A2 (en) 2005-08-25
EP1716453A2 (en) 2006-11-02
JP2007529881A (ja) 2007-10-25
US20080171285A1 (en) 2008-07-17
TW200538881A (en) 2005-12-01
KR20060133976A (ko) 2006-12-27
WO2005078525A3 (en) 2005-10-27
EP1564592A1 (en) 2005-08-17

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Open date: 20091014