CN101546133B - 曝光装置及曝光方法 - Google Patents

曝光装置及曝光方法 Download PDF

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Publication number
CN101546133B
CN101546133B CN2009101182133A CN200910118213A CN101546133B CN 101546133 B CN101546133 B CN 101546133B CN 2009101182133 A CN2009101182133 A CN 2009101182133A CN 200910118213 A CN200910118213 A CN 200910118213A CN 101546133 B CN101546133 B CN 101546133B
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Prior art keywords
belt
exposure
pressing plate
identification marking
calibration
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CN2009101182133A
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Chinese (zh)
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CN101546133A (zh
Inventor
佐藤仁
山贺胜
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Orc Manufacturing Co Ltd
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Orc Manufacturing Co Ltd
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CN2009101182133A 2008-03-27 2009-02-25 曝光装置及曝光方法 Active CN101546133B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008084251A JP5117243B2 (ja) 2008-03-27 2008-03-27 露光装置
JP2008-084251 2008-03-27
JP2008084251 2008-03-27

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CN101546133A CN101546133A (zh) 2009-09-30
CN101546133B true CN101546133B (zh) 2012-07-04

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JP (1) JP5117243B2 (ja)
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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011099563A1 (ja) * 2010-02-12 2011-08-18 株式会社ニコン 基板処理装置
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
KR101643679B1 (ko) * 2012-01-17 2016-07-28 에이에스엠엘 네델란즈 비.브이. 가요성 기판의 로딩 방법 및 리소그래피 장치
CN102692831B (zh) * 2012-05-28 2014-03-26 京东方科技集团股份有限公司 对位标识及在曝光工艺中采用该对位标识制作工件的方法
KR101600810B1 (ko) * 2014-05-12 2016-03-08 주식회사 옵티레이 노광 장치
DE102014215439B4 (de) 2014-08-05 2017-08-24 Nanoscribe Gmbh Verfahren zum Herstellen einer Struktur
CN107608177B (zh) * 2017-10-22 2024-01-02 长春工业大学 一种制造超大面积纳米压印无缝图案的装置及方法
CN112777381B (zh) * 2020-12-21 2022-09-30 江苏迪盛智能科技有限公司 尾料识别方法、装置、电子设备和存储介质
CN112693947B (zh) * 2020-12-21 2022-09-27 江苏迪盛智能科技有限公司 拉料偏差处理方法、装置、电子设备和存储介质
CN113204176A (zh) * 2021-04-27 2021-08-03 合肥芯碁微电子装备股份有限公司 用于检测和调试设备成像光路的工装、检测系统和方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0147807A2 (en) * 1983-12-27 1985-07-10 Rogers Corporation Method for forming a substrate for tape automated bonding for electronic circuit elements
JP3049785B2 (ja) * 1991-02-13 2000-06-05 松下電器産業株式会社 バンプの整形方法
CN1932646A (zh) * 2005-09-14 2007-03-21 东海商事株式会社 曝光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368378A (ja) * 2001-06-04 2002-12-20 Dainippon Screen Mfg Co Ltd 基板クランプ装置
JP3741013B2 (ja) * 2001-09-17 2006-02-01 ウシオ電機株式会社 蛇行修正機構を備えた帯状ワークの露光装置
JP4082104B2 (ja) * 2002-06-21 2008-04-30 ウシオ電機株式会社 パターン検査装置
JP4407333B2 (ja) * 2004-03-23 2010-02-03 ウシオ電機株式会社 帯状ワークの露光装置
JP4479383B2 (ja) * 2004-07-05 2010-06-09 ウシオ電機株式会社 パターン検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0147807A2 (en) * 1983-12-27 1985-07-10 Rogers Corporation Method for forming a substrate for tape automated bonding for electronic circuit elements
JP3049785B2 (ja) * 1991-02-13 2000-06-05 松下電器産業株式会社 バンプの整形方法
CN1932646A (zh) * 2005-09-14 2007-03-21 东海商事株式会社 曝光装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP平2-176662A 1990.07.09
JP特许第3049785号B2 2000.06.05

Also Published As

Publication number Publication date
JP2009237334A (ja) 2009-10-15
JP5117243B2 (ja) 2013-01-16
CN101546133A (zh) 2009-09-30

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