CN101545614A - 发光二极管灯具 - Google Patents

发光二极管灯具 Download PDF

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CN101545614A
CN101545614A CN200810066341A CN200810066341A CN101545614A CN 101545614 A CN101545614 A CN 101545614A CN 200810066341 A CN200810066341 A CN 200810066341A CN 200810066341 A CN200810066341 A CN 200810066341A CN 101545614 A CN101545614 A CN 101545614A
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light emitting
emitting diode
led lamp
support
diode module
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CN101545614B (zh
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周志勇
丁巧利
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QUANYIDA TECHNOLOGY (FOSHAN) Co Ltd
Hon Hai Precision Industry Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to US12/202,394 priority patent/US7841740B2/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种发光二极管灯具,其包括若干发光二极管模组,每一发光二极管模组包括一电路板及若干安装于电路板上的发光二极管,该发光二极管灯具还包括一开设若干开口的支架,这些发光二极管模组彼此独立地固定至支架上并使其发光二极管暴露于开口内。本发明的发光二极管灯具采用相互独立的发光二极管模组固定在支架上,即使部分发光二极管损坏,只需单独更换损坏的发光二极管所处的发光二极管模组即可,而不需将所有的发光二极管模组均替换掉,从而节省了维修成本,并有效地减少了零组件的浪费。

Description

发光二极管灯具
技术领域
本发明涉及一种发光二极管灯具,特别是指一种维修成本较低的的发光二极管灯具。
背景技术
随着发光效率的提升,发光二极管已被越来越广泛地应用到各个领域当中,如住宅照明灯、工业照明灯及交通指示灯等等。在这些应用当中,通常将大量的发光二极管串接到一块电路板上组成一发光二极管模组,然后再将该发光二极管模组固定于一散热器上,从而组装成一完整的发光二极管灯具。
但是,上述所有的发光二极管均被整合在一块电路板上而形成一体的发光二极管模组,由于发光二极管与电路板间一般采用焊接方式固定,二者间极难拆卸。如若发光二极管模组的部分发光二极管不慎损坏而需进行更换,就只能将这一发光二极管模组从散热器上卸下而整块替换成一新的发光二极管模组,导致灯具的维修成本极为高昂。此外,替换下的发光二极管模组由于其损坏的发光二极管无法与电路板分离,导致其不能再被重新利用,而只能作报废处理。但是,尽管发光二极管模组有部分发光二极管损坏,其还保留有大量可正常工作的发光二极管,如若就此将更换下的整个发光二极管模组废弃不用将导致未损坏的发光二极管亦不能再被重新利用,造成极大的浪费。
发明内容
有鉴于此,实有必要提供一种维修成本较低并可有效减少浪费的发光二极管灯具。
一种发光二极管灯具,其包括若干发光二极管模组,每一发光二极管模组包括一电路板及若干安装于电路板上的发光二极管,该发光二极管灯具还包括一开设若干开口的支架,这些发光二极管模组彼此独立地固定至支架上并使其发光二极管暴露于开口内。
与现有技术相比,本发明的发光二极管灯具采用相互独立的发光二极管模组固定在支架上,即使部分发光二极管损坏,只需单独更换损坏的发光二极管所处的发光二极管模组即可,而不需将所有的发光二极管模组全部替换掉,从而节省了维修成本,并有效地减少了浪费。
下面参照附图,结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明的第一实施例的发光二极管灯具的立体组装图。
图2是图1的部分分解图。
图3是图1中发光二极管灯具的支架及发光二极管模组的分解图。
图4是图3中的单个发光二极管模组的立体放大图。
图5是图4的倒置图。
图6是本发明的第二实施例的发光二极管灯具的立体组装图。
图7是图6的分解图。
图8是本发明的第三实施例的发光二极管灯具的立体组装图。
图9是图8的分解图。
具体实施方式
请参阅图1-2,本发明的第一实施例的发光二极管灯具包括一水平设置的支架10、若干装设于支架10上的发光二极管模组20及若干覆盖住发光二极管模组20的保护盖30。
请参阅图3,该支架10包括一矩形的外框12及若干形成于外框12内的肋条14。这些肋条14包括二沿横向设置的第一肋条142及三沿纵向设置的第二肋条144,该二第一肋条142与三第二肋条144彼此垂直交错并分别连接至外框12的相应内壁,以共同将外框12所围设出的矩形空间分割成若干方形的开口100。外框12在对应于相应开口100的一边的位置处开设二螺孔120,第一肋条142及第二肋条144在对应于相应开口100的一边的位置处开设四螺孔140,以供螺丝(图未示)穿设而将发光二极管模组20固定至支架10上。
请一并参阅图4-5,每一发光二极管模组20包括一矩形的电路板22、一固定于电路板22底面的散热器26及若干设置于电路板22顶面的发光二极管24。该电路板22呈方形,其面积与一开口100的面积相等,以充分地将发光二极管24暴露于开口100内(如图2)。该散热器26包括一顶面与电路板22接触的基座(图未标)及若干自基座底面垂直向下延伸的鳍片264。该基座平行于支架10,其包括一与电路板22面积等大的板体260及分别自板体260四侧壁水平向外凸伸出的四矩形的凸梁262。这些凸梁262环设于板体260的周缘,且每一凸梁262均开设与支架10的螺孔120、140相对应的螺孔266,以供螺丝穿设而将发光二极管模组20固定于支架10上。每一凸梁262的长度小于板体260的每一边的长度,其一端与板体260的一侧壁面齐平,另一端则与板体260相对的另一侧壁面隔出超过板体260二分之一边长的距离,以防止在固定至支架10上之后与相邻发光二极管模组20的凸梁262发生干涉(如图3)。
请再参阅图2,每一保护盖30的轮廓与散热器26基座的轮廓大致相同,其周缘向外形成与每一散热器26凸梁262对应的四固定部32,以供螺丝穿过而将保护盖30固定于支架10的相应的开口100上,从而保护暴露于开口100内的发光二极管24,防止其受到外界碰撞而损坏。
组装该发光二极管灯具时,将每一发光二极管模组20置放于支架10的每一开口100的下方,使其四凸梁262的螺孔266与支架10上的相应螺孔120、140对齐,此时每一发光二极管模组20的凸梁262与相邻发光二极管模组20的凸梁262彼此隔开一小段距离。然后再将保护盖30分别置设于每一开口100的上方,使其四固定部32与发光二极管模组20的凸梁262对齐。最后将螺丝从下至上依次穿过散热器26的凸梁262、支架10及保护盖30的固定部32,从而将发光二极管灯具锁固成一体。
与现有技术相比,由于本发明的每一发光二极管模组20均为独立地固定至支架10上,相邻的发光二极管模组20间不存在任何连接关系。即使一发光二极管模组20中的部分发光二极管24损坏,只需单独更换该发光二极管模组20即可,而不需将所有发光二极管模组20均替换掉。由此,相比于传统的发光二极管灯具而言,本发明的发光二极管灯具的维修成本较低,并可有效地减少浪费。
可以理解地,上述支架10可根据不同的需求变换成不同的形状,如图6-7示出的本发明第二实施例,其支架10a的中部仍保持水平,其支架10a的相对两侧则向上弯折,以使固定至支架10a上的发光二极管模组20所发出的光线向内会聚;或是如图8-9示出的本发明的第三实施例,其支架10b的中部保持水平,其支架10b的相对两侧则向下弯折,以使固定至支架10b上的发光二极管模组20所发出的光线向外扩散。
由于采用分离的发光二极管模组20,当需要在上述三个实施例之间进行变换时,只需单独替换支架10、10a、10b即可,而不需更换发光二极管模组20,从而极大地节约了更换成本。

Claims (12)

1.一种发光二极管灯具,其包括若干发光二极管模组,每一发光二极管模组包括一电路板及若干安装于电路板上的发光二极管,其特征在于:该发光二极管灯具还包括一开设若干开口的支架,这些发光二极管模组彼此独立地固定至支架上并使其发光二极管暴露于开口内。
2.如权利要求1所述的发光二极管灯具,其特征在于:所述支架包括一外框及若干形成于外框内的肋条,这些发光二极管模组固定在支架的外框及肋条上。
3.如权利要求2所述的发光二极管灯具,其特征在于:这些肋条彼此交错并相互垂直。
4.如权利要求2所述的发光二极管灯具,其特征在于:这些肋条将外框分隔出开口,每一发光二极管模组均固定至一对应的开口上。
5.如权利要求2所述的发光二极管灯具,其特征在于:每一发光二极管模组还包括一与电路板相固定的散热器,每一发光二极管模组通过其散热器固定至支架的外框及肋条上。
6.如权利要求5所述的发光二极管灯具,其特征在于:所述散热器包括一板体及若干自板体周缘向外凸伸出的凸梁,这些凸梁分别与支架的外框及肋条相互固定。
7.如权利要求6所述的发光二极管灯具,其特征在于:所述散热器的板体呈方形,其面积与支架的开口面积相等。
8.如权利要求6所述的发光二极管灯具,其特征在于:每一凸梁的一端与板体的一侧面齐平,另一端与板体的一相对侧面隔开距离。
9.如权利要求8所述的发光二极管灯具,其特征在于:所述凸梁的另一端与板体的相对侧面隔开的距离大于板体的边长的一半。
10.如权利要求6所述的发光二极管灯具,其特征在于:所述支架具有一平坦的构造,其完全平行于发光二极管模组的散热器的板体。
11.如权利要求1所述的发光二极管灯具,其特征在于:所述支架的相对两侧相对于其中部倾斜弯折。
12.如权利要求1至11任一项所述的发光二极管灯具,其特征在于:所述发光二极管灯具还包括若干安装于支架上的保护盖,每一保护盖对应地固设于相应的开口上以与相应的发光二极管模组共同将支架夹置于其间。
CN2008100663413A 2008-03-26 2008-03-26 发光二极管灯具 Expired - Fee Related CN101545614B (zh)

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CN2008100663413A CN101545614B (zh) 2008-03-26 2008-03-26 发光二极管灯具
US12/202,394 US7841740B2 (en) 2008-03-26 2008-09-01 LED assembly for LED lamp consisting of multiple LED units each having a heat sink

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CN103511883A (zh) * 2012-06-14 2014-01-15 三菱电机株式会社 光源装置
CN104913229A (zh) * 2015-06-15 2015-09-16 安徽中晨照明科技股份有限公司 一种led洗墙灯

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CN101539278B (zh) * 2008-03-19 2010-11-10 富准精密工业(深圳)有限公司 发光二极管组合
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