CN101542675A - 具有安装在可移动安装件中的电极的离子束加速设备 - Google Patents
具有安装在可移动安装件中的电极的离子束加速设备 Download PDFInfo
- Publication number
- CN101542675A CN101542675A CNA200880000419XA CN200880000419A CN101542675A CN 101542675 A CN101542675 A CN 101542675A CN A200880000419X A CNA200880000419X A CN A200880000419XA CN 200880000419 A CN200880000419 A CN 200880000419A CN 101542675 A CN101542675 A CN 101542675A
- Authority
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- China
- Prior art keywords
- electrode
- equipment
- movable mount
- hole
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010884 ion-beam technique Methods 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims description 12
- 230000001133 acceleration Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000000284 extract Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008485 antagonism Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000005596 ionic collisions Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/022—Details
- H01J27/024—Extraction optics, e.g. grids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/024—Moving components not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/032—Mounting or supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/036—Spacing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/038—Insulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/045—Diaphragms
- H01J2237/0456—Supports
- H01J2237/0458—Supports movable, i.e. for changing between differently sized apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3142—Ion plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
- H01J2237/3151—Etching
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Combustion & Propulsion (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0703044.8 | 2007-02-15 | ||
| GBGB0703044.8A GB0703044D0 (en) | 2007-02-16 | 2007-02-16 | Apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101542675A true CN101542675A (zh) | 2009-09-23 |
Family
ID=37908761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200880000419XA Pending CN101542675A (zh) | 2007-02-16 | 2008-02-15 | 具有安装在可移动安装件中的电极的离子束加速设备 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100044579A1 (enExample) |
| EP (1) | EP2111630A1 (enExample) |
| JP (1) | JP2010519681A (enExample) |
| CN (1) | CN101542675A (enExample) |
| GB (1) | GB0703044D0 (enExample) |
| WO (1) | WO2008099218A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101602517B1 (ko) | 2008-08-04 | 2016-03-10 | 에이지씨 플랫 글래스 노스 아메리카, 인코퍼레이티드 | Pecvd를 이용한 박막 코팅을 증착하기 위한 플라즈마 소스 및 방법 |
| DE102009048400A1 (de) * | 2009-10-06 | 2011-04-14 | Siemens Aktiengesellschaft | HF-Resonatorkavität und Beschleuniger |
| JP2013098003A (ja) * | 2011-10-31 | 2013-05-20 | Nissin Ion Equipment Co Ltd | イオンビーム引出し用電極およびこれを備えたイオン源 |
| MY191327A (en) | 2014-12-05 | 2022-06-16 | Agc Flat Glass Na Inc | Plasma source utilizing a macro-particle reduction coating and method of using a plasma source utilizing a macro-particle reduction coating for deposition of thin film coatings and modification of surfaces |
| ES2883288T3 (es) | 2014-12-05 | 2021-12-07 | Agc Glass Europe Sa | Fuente de plasma de cátodo hueco |
| US9721764B2 (en) | 2015-11-16 | 2017-08-01 | Agc Flat Glass North America, Inc. | Method of producing plasma by multiple-phase alternating or pulsed electrical current |
| US9721765B2 (en) | 2015-11-16 | 2017-08-01 | Agc Flat Glass North America, Inc. | Plasma device driven by multiple-phase alternating or pulsed electrical current |
| BR112018012413A2 (pt) * | 2015-12-18 | 2018-12-18 | Agc Flat Glass Na Inc | fonte de íons de catodo oco e método de extração e aceleração de íons |
| US10573499B2 (en) | 2015-12-18 | 2020-02-25 | Agc Flat Glass North America, Inc. | Method of extracting and accelerating ions |
| US10242846B2 (en) | 2015-12-18 | 2019-03-26 | Agc Flat Glass North America, Inc. | Hollow cathode ion source |
| US9807864B1 (en) * | 2016-08-04 | 2017-10-31 | Varian Semiconductor Equipment Associates Inc. | Electrode, accelerator column and ion implantation apparatus including same |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4149055A (en) * | 1977-05-02 | 1979-04-10 | Hughes Aircraft Company | Focusing ion accelerator |
| JPS6043620B2 (ja) * | 1982-11-25 | 1985-09-28 | 日新ハイボルテージ株式会社 | マイクロ波イオン源 |
| JPS59207553A (ja) * | 1983-05-11 | 1984-11-24 | Hitachi Ltd | 荷電粒子線軸合せ装置 |
| JPH0746588B2 (ja) * | 1986-09-09 | 1995-05-17 | 日本電信電話株式会社 | マイクロ波イオン源 |
| JPH01204341A (ja) * | 1988-02-08 | 1989-08-16 | Japan Steel Works Ltd:The | イオンビーム装置 |
| US4933551A (en) * | 1989-06-05 | 1990-06-12 | The United State Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Reversal electron attachment ionizer for detection of trace species |
| US5365070A (en) * | 1992-04-29 | 1994-11-15 | The Regents Of The University Of California | Negative ion beam injection apparatus with magnetic shield and electron removal means |
| JPH0668806A (ja) * | 1992-08-21 | 1994-03-11 | Japan Steel Works Ltd:The | イオン源 |
| US5608773A (en) * | 1993-11-30 | 1997-03-04 | Canon Kabushiki Kaisha | Mask holding device, and an exposure apparatus and a device manufacturing method using the device |
| JP3243168B2 (ja) * | 1996-02-06 | 2002-01-07 | キヤノン株式会社 | 原版保持装置およびこれを用いた露光装置 |
| DE19851097A1 (de) * | 1997-11-05 | 1999-05-06 | Ims Ionen Mikrofab Syst | Mechanisch einstellbare, elektrostatische Linse |
| JPH11283552A (ja) * | 1998-03-31 | 1999-10-15 | Tadamoto Tamai | イオン注入装置、イオン注入方法、イオンビーム源、及び可変スリット機構 |
| US6458723B1 (en) * | 1999-06-24 | 2002-10-01 | Silicon Genesis Corporation | High temperature implant apparatus |
| EP1245036B1 (en) * | 1999-12-13 | 2013-06-19 | Semequip, Inc. | Ion implantation ion source |
| US6501078B1 (en) * | 2000-03-16 | 2002-12-31 | Applied Materials, Inc. | Ion extraction assembly |
| KR100843805B1 (ko) * | 2000-11-20 | 2008-07-03 | 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. | 이온 비임을 생성하기 위한 이온 광학 장치 및 방법 |
| US6768120B2 (en) * | 2001-08-31 | 2004-07-27 | The Regents Of The University Of California | Focused electron and ion beam systems |
| US6936981B2 (en) * | 2002-11-08 | 2005-08-30 | Applied Materials, Inc. | Retarding electron beams in multiple electron beam pattern generation |
| JP3858092B2 (ja) | 2002-11-14 | 2006-12-13 | 独立行政法人航空宇宙技術研究所 | イオン抽出装置 |
| US7145157B2 (en) * | 2003-09-11 | 2006-12-05 | Applied Materials, Inc. | Kinematic ion implanter electrode mounting |
| JP4316394B2 (ja) * | 2004-01-21 | 2009-08-19 | 株式会社東芝 | 荷電ビーム装置 |
| JP5068928B2 (ja) * | 2004-11-30 | 2012-11-07 | 株式会社Sen | 低エネルギービーム増大化方法及びビーム照射装置 |
| US7279687B2 (en) * | 2005-08-26 | 2007-10-09 | Varian Semiconductor Equipment Associates, Inc. | Technique for implementing a variable aperture lens in an ion implanter |
| WO2008000836A2 (en) | 2006-06-30 | 2008-01-03 | Nordiko Technical Services Limited | Apparatus for accelerating an ion beam |
-
2007
- 2007-02-16 GB GBGB0703044.8A patent/GB0703044D0/en not_active Ceased
-
2008
- 2008-02-15 EP EP08709618A patent/EP2111630A1/en not_active Withdrawn
- 2008-02-15 JP JP2009549482A patent/JP2010519681A/ja active Pending
- 2008-02-15 US US12/304,251 patent/US20100044579A1/en not_active Abandoned
- 2008-02-15 CN CNA200880000419XA patent/CN101542675A/zh active Pending
- 2008-02-15 WO PCT/GB2008/050098 patent/WO2008099218A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008099218A1 (en) | 2008-08-21 |
| JP2010519681A (ja) | 2010-06-03 |
| EP2111630A1 (en) | 2009-10-28 |
| GB0703044D0 (en) | 2007-03-28 |
| US20100044579A1 (en) | 2010-02-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20090923 |