CN101529582A - 半导体装置、显示装置以及电子设备 - Google Patents
半导体装置、显示装置以及电子设备 Download PDFInfo
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Abstract
本发明涉及一种半导体装置,其具备与半导体元件(1)进行电连接的中介层(2),其特征在于,上述中介层(2)形成有标识(5),该标识(5)是用于表示与上述半导体元件(1)相关的预定信息。
Description
技术领域
本发明涉及一种安装有小型半导体元件的半导体装置、具备该半导体装置的显示装置以及电子设备。
背景技术
液晶显示装置广泛被用在诸如电视机或个人计算机的监视器、便携式电话等各种设备中。近年来,随着要求显示的信息量的增大,从而要求实现液晶显示装置的高精细化以及高性能化。由此,要求液晶显示装置所具备的、作为半导体元件的液晶驱动器进一步实现多输出化。这样,通过对驱动器电路实施缩小化、或对设置在半导体元件芯片上的凸点进行细间距(细微)化等来缩小芯片尺寸大小,与此同时实现液晶驱动器的多输出化。
上述多输出化半导体元件被安装在适于形成细间距化端子(引线)的、TCP(Tape Carrier Package:带载封装)或COF(Chip On Film:薄膜覆晶)型封装等。TCP、COF型封装均是通过倒装芯片的方式直接使内引线与半导体元件进行键合的封装,该内引线由形成在载带上的金属图形来构成。TCP的内引线与COF的内引线的不同之处在于:TCP的内引线是一种从载带基材上的贯通口(Device hole:设备孔)突出而形成的分离式引线(flying lead);而COF的内引线是在载带基材上形成。在COF型封装中,由于内引线受载带基材支持,因此,能够更进一步进行引线配线的薄膜化,更适合于细间距化的引线形成。
但是,由于低成本省资源的需求,需要对半导体元件的芯片进行更进一步的缩小化。在这种情况下,封装中内引线的间距限度将制约芯片缩小。以下举例说明:由于下述因素导致内引线的细间距化达到其极限,从而制约芯片的缩小化。在COF型封装或TCP型封装中,以倒装芯片的方式在载带上键合半导体元件时,通过加热加压使半导体元件的凸点和内引线相键合。此时,考虑到载带发生热变形,为避免由于该变形而导致上述半导体元件的凸点位置和上述载带的引线位置之间发生错位,在设定内引线间的最小间距时就有必要留有一定余地,所以,这将限制最小间距的缩小。形成在半导体元件上的连接端子(凸点)被设置于半导体元件的芯片周边部,其间距相同于载带上与连接端子连接的内引线的间距,从而可缩小电路面积。即便如此,因为在半导体元件上也需要以大于一定尺寸的间距来设置上述连接端子的区域,从而导致芯片缩小受到制约。
为了解决上述问题,专利文献1揭示了一种借助于中间基板(中介层:interposer)实现电路基板和半导体元件相连接的方法。图6是专利文献1中所说明的半导体装置的剖面图。半导体元件101通过倒装芯片的方式连接中介层102,中介层102则通过凸点来连接电路基板120的电极图形104。在中介层102上的电极108以相同于半导体元件101的电极110的细间距来形成,其中,电极108与半导体元件101相连接,另一方面,根据电路基板120的电极图形104的电极间距,在中介层102上形成与上述电路基板120相连接的电极109。然后,在中介层102上进行配线以连接相对应的电极108和电极109,其中,电极108与半导体元件101相连接,电极109与电路基板120相连接。另外,能够使用载带作为电路基板120。
由于能够选择热伸缩率充分小的基材作为中介层102,因此,以热变形为因的限制将变小,较之于在电路基板120上可形成的电极间距,能够将用于连接半导体元件101的电极108的间距进行大幅度缩小从而实现细间距化。即,通过由热伸缩率更小的基材来形成中介层102时,能够在封装上搭载其连接端子进一步细间距化的半导体元件101,且半导体元件101的电极间距超过在电路基板120上可形成的电极间距的极限。
因此,能够有效地缓解为了确保上述连接端子的面积而使芯片尺寸缩小受到制约这样的问题,从而能够缩小半导体元件101。尤其是,在使用Si基板作为中介层102的情况下,由于可通过与半导体元件制造工序相同的Si晶圆形成工序来形成中介层102,因此,能够以相同于半导体元件101的LSI级细间距来形成与半导体元件101相连接的电极108,从而有效地缩小半导体元件101的尺寸。
另一方面,在安装有半导体元件的半导体装置中,需要在预定位置上设置标识,该标识是用于识别产品的固定信息,例如有用于表示制造者、产品名以及批号和制造日期等的由多个文字构成的编码。在COF、TCP等膜安装型的半导体装置中,通常实施标识形成(Marking:打码)时,该标识是形成在通过倒装芯片的方式所安装的半导体元件背面的平坦面上。例如,在专利文献2至4中对此类示例进行了阐述。
即使对于在上述图6中所说明的、借助于中介层102将电路基板120和半导体元件101进行连接的半导体装置,其也是在半导体元件1的背面112,即形成有电路的面的背面上形成标识105,其中,该半导体元件1以正面朝下的方式被安装在中介层102。
专利文献1:日本国专利申请公开特开2004-207566号公报,公开日:2004年7月22日。
专利文献2:日本国专利申请公开特开昭63-263748号公报,公开日:1988年10月31日。
专利文献3:日本国专利申请公开特开平4-53249号公报,公开日:1992年2月20日。
专利文献4:日本国专利申请公开特开2005-203696号公报,公开日:2005年7月28日。
发明内容
但是,近年来,随着设计规格进一步缩小化,半导体元件的芯片尺寸也越趋于缩小化,从而越来越难于在半导体元件的背面上以通过肉眼或者机器可识别的文字来实施打码。因此,在安装有半导体元件的半导体装置作为部件而进行产品组装的工序中,出现了难以读取用于确认管理部件的标识这样的问题。另外,为了实现对半导体装置的更高度的品质管理,要求能够对每件产品的制造工序履历进行追溯,实现标识的追溯性,但是由于打码面积的限制,导致标识编码的位数受限,从而导致无法充分运用编码系统。
尤其是对于液晶显示装置等显示装置中的驱动器IC的安装,由于多数情况下是采用可对应多输出并可提高安装精度的TCP或者COF型封装,因此,在上述半导体装置中难以识别标识和追溯性不充分等将对显示装置产品的可靠性也造成影响。
本发明的半导体装置具备与半导体元件电连接的中介层,其特征在于:上述中介层形成有用于表示与上述半导体元件相关的预定信息等的标识。
本发明的半导体装置具备半导体元件、中介层和电路基板,其中,上述中介层与上述半导体元件电连接,上述电路基板借助于上述中介层与上述半导体元件电连接,上述半导体装置的特征在于:上述中介层在其与上述半导体元件连接的面的背面形成有用于表示与上述半导体元件相关的预定信息等的标识。
本发明的半导体装置具备与半导体元件电连接的中介层,其特征在于:上述中介层形成有用于识别上述半导体元件的标识。
本发明的半导体装置具备半导体元件、中介层和电路基板,其中,上述中介层与上述半导体元件电连接,上述电路基板借助于上述中介层与上述半导体元件电连接,上述半导体装置的特征在于:上述中介层在其与上述半导体元件连接的面的背面形成有用于识别上述半导体元件的标识。
另外,本发明的半导体装置的特征在于:上述电路基板是载带。
另外,在本发明的半导体装置中,上述中介层优选由Si基板构成。
本发明的半导体装置的特征还在于:上述中介层在其与上述半导体元件连接的面上形成有配线,并且上述配线不形成在上述标识所形成的区域的背面。
另外,本发明的半导体装置的特征在于:上述半导体元件是用于驱动显示体的驱动器IC,该显示体根据电信号进行动作。
本发明的显示装置的特征在于,包括:半导体装置和显示体,其中,该半导体装置具备作为上述半导体元件的驱动器IC,该驱动器IC用于驱动上述显示体,上述显示体根据电信号进行动作。
本发明的电子设备的特征在于,具备:上述半导体装置的任何一个。
在本发明的半导体装置中,由于与半导体元件连接的中介层的面积大于半导体元件的面积,因此,能够提供更大的标识形成区域。从而,能够显示其尺寸大小相对较大的文字,由此,能够形成易于读取且识别性优良的标识。另外,由于能够有效地缓解对可打码文字数量的限制,从而,能够提供充分的、用于追溯制造履历的信息,因此,能够简单地实现具有良好追溯性的编码系统。
另外,在具有本发明的半导体装置的显示装置等电子设备中,由于半导体装置部件具备识别性和追溯性优良的标识,因此,能够提高部件组装工序中操作的可靠性,并使产品的品质管理更简单化。上述追溯性是指易于进行产品追溯的特性。
本发明的其他目的、特征和优点在以下的描述中会变得十分明了。此外,以下参照附图来明确本发明的优点。
附图说明
图1是表示本发明的一实施方式的半导体装置的平面说明图。
图2是表示图1所示的半导体装置的A-A′断面的要部剖面图。
图3是说明本发明的半导体装置的一制造方法示例的图。
图4是表示本发明的一实施方式的显示装置的结构的斜视说明图。
图5是表示本发明的其他实施方式的半导体装置的结构的要部剖面图。
图6是表示现有的半导体装置的结构的要部剖面图。
具体实施方式
以下,参照附图说明本发明的半导体装置的实施方式。在以下的说明当中,设有种种优选实施本发明的技术限定,但是本发明的范围并不仅限定于以下的实施方式以及图面。
(实施方式1)
图1表示了作为本发明的一实施方式的半导体装置中的液晶驱动器封装的平面图。
在本实施方式中的液晶驱动器封装1a是一种COF型封装,其通过中介层2电连接半导体元件(液晶驱动器)1和电路基板(载带)20。在图1中,液晶驱动器1配置在中介层2的背面。因此,以虚线表示了实际上无法看到的液晶驱动器1。
图1所示的部分是表示在长载带上形成的其中一个单位封装,在载带两侧边缘部形成有用于传送该长载带的输送孔6。载带包括:以聚酰亚胺(polyimide)为主要成分的薄膜基材3、在薄膜基材3的一侧形成的由铜箔构成的配线图形4、用于保护配线图形4的抗蚀树脂7。配线图形4的一部分裸露在抗蚀树脂7之外而形成与中介层2连接的内引线和与外部电路连接的外引线。
图2是表示沿着A-A′切线切开图1所示的液晶驱动器封装1a时的剖面图。中介层2与内引线连接,液晶驱动器1通过倒装芯片的方式与中介层2连接,其中,在薄膜基材3上形成的配线图形4裸露在抗蚀树脂7之外而形成上述内引线。中介层2由具有Al配线的Si基板构成,在其配线面,形成有半导体元件连接用凸点电极8和电路基板连接用凸点电极9,其中,半导体元件连接用凸点电极8用于连接液晶驱动器1,电路基板连接用凸点电极9用于连接载带20。半导体元件连接用凸点电极8和与其对应的电路基板连接用凸点电极9通过中介层2上形成的Al配线互相连接。半导体元件连接用凸点电极8和电路基板连接用凸点电极9为金凸点。
使液晶驱动器1上形成的金凸点10和中介层2上的半导体元件连接用凸点电极8进行位置对准,其后,进行热压接处理,由此实现液晶驱动器1和中介层2之间的连接。中介层2和薄膜基材3是通过中介层2上的电路基板连接用凸点电极9和薄膜基材3上的配线图形4之间的Au-Sn键合来实现连接。
然后,注入热硬化性树脂11,该热硬化性树脂11包覆液晶驱动器1和中介层2的连接部、中介层2和薄膜基材3的连接部,以强化上述各连接并且确保了液晶驱动器1和中介层2的电路面的耐湿性。由于液晶驱动器1的背面12以及中介层2的背面13并非是必须加强保护的部分,因此不被热硬化性树脂11所包覆,各平坦的背面裸露在外。
在中介层2的背面13上,利用激光打码来形成标识5。由于中介层2的面积大于液晶驱动器1的面积,因此,较之于现有的在液晶驱动器1的背面12形成标识的方法,能够以更大字体的文字来进行打码,还能够确保更大的最大可打码文字数。另外,较之于液晶驱动器1,中介层2不易发生由于热硬化性树脂11的溢出而造成背面平坦部面积减少的问题,因此能够实现安定的打码。
根据上述,即使是对于安装有小型液晶驱动器的液晶驱动器封装,也能够形成易于读取的标识5,从而能够改善标识的识别性。另外,由于能够缓解对于可打码文字数的限制,因此,能够简单地实现一种具有充分的、用于追溯制造履历的信息量且追溯性良好的编码系统。
此外,由于不必在作为功能元件的液晶驱动器1上实施打码,因此能够在标识5的形成工序中避免发生由于加热或者刻入等而造成产品不良的问题。即使在标识5的形成方法为通过盖戳形成喷墨打码的情况下,由于盖戳时的冲击力没有直接施加在液晶驱动器1上,因此,能够减少发生不良的要因。
另外,还能够在中介层的背面13上的除与中介层正面(连接液晶驱动器1的面)的配线区域相对置的区域之外的区域形成标识5。在对液晶驱动器封装的中介层的配线有无断线进行确认时,尽管可从中介层的背面13侧,利用能透过Si等的红外线进行检测,但如果标识形成在中介层的配线区域的背面,那么由于红外线受到标识部分的散射,有时难以观察出配线是否断线。本发明通过在中介层的无配线的区域的背面形成标识,易于利用红外线对中介层的全配线区域有无断线进行检测。
此外,本实施方式所示的具有配线的板状中介层,有时称作中介层基板。
图3是表示液晶驱动器封装1a的制造过程的一个示例的图。对于与图1和图2相同的结构,赋予相同的标号,在说明中将引用图1和图2的标号。
首先,如图3中的虚线部分(a)所示,通过切割(dicing)方法将驱动器用晶圆32切分成单片,形成液晶驱动器1,该驱动器用晶圆32是已图形化形成作为液晶驱动器的液晶驱动用电路等的晶圆。作为切割方法,可采用现有公知的方法,例如,能够将驱动器用晶圆32放置在载台35上,使用切割刀片34切割成预定的芯片大小。与此相同,如图3中的虚线部分(b)所示,对已图形化而形成有半导体元件连接用凸点电极8、电路基板连接用凸点电极9和基板上配线的中介层晶圆33进行切割,切割成单片而形成中介层2。
虚线部分(c)表示液晶驱动器封装的安装工序。
使电路基板连接用凸点电极9和载带20的内引线的位置对准,其后使单片化后的中介层2与载带20进行连接。中介层2已搭载于载带20,然后,使中介层2的半导体元件连接用凸点电极8和液晶驱动器1的金凸点10的位置进行对准,再通过热压接处理实现与液晶驱动器1的电连接。
然后,出于强化和保护连接部的目的,使用配量器36注入热硬化性树脂11,由此密封中介层2和液晶驱动器1、以及载带20和中介层2的连接部。最后,在中介层2的背面利用激光打码来形成标识5,则完成形成液晶驱动器封装1a,其中,该标识5由用于识别制造者、产品名、制造批号、制造日期等的多个文字构成。作为打码方法,还能够采用盖戳或者喷墨打码等现有公知的方法。
另外,在本实施方式说明了载带型的液晶驱动器封装,但是本发明的半导体装置并不仅限于此。即,作为半导体元件的其他示例,在权力要求所示的范围之内可实现各种变更,例如有等离子显示体和EL(电致发光:electro luminescence)显示体的驱动元件、在各种便携式电子设备等内部所搭载元件的安装用封装等。另外,在半导体元件上也可打码的情况下,可在中介层和半导体元件两者上打码。
以下,参照图4对具备了本实施方式的液晶驱动器封装1a的液晶驱动器型显示装置(显示装置)进行说明。液晶驱动器型显示装置用途广泛,能够用于显示文字和图像、或者用于可发出各种光的照明设备和窗的调光等。
图4是表示本发明的一实施方式的液晶驱动器型显示装置的结构的斜视图。本实施方式的液晶驱动器型显示装置51如图4所示,包括:液晶显示部(显示体)52和液晶驱动器封装1a。
液晶驱动器封装1a通过中介层2在载带20上安装了液晶驱动器1并且在中介层2的背面上形成有标识5。在图4中,表示液晶驱动器1位于上部时可观察到的液晶驱动器封装1a,在该液晶驱动器封装1a背面存在有中介层2(虚线所示),在中介层2的背面上形成有标识5。载带20上形成有输出端子部45和输入端子部46。
液晶显示部52包括:有源矩阵基板65、液晶层66、形成有对置电极的对置基板67。
有源矩阵基板65如图4所示,包括:玻璃基板60、在该玻璃基板60上形成的信号配线61、像素64等。像素64由作为开关元件的薄膜晶体管(以下简称为TFT)62、像素电极63等构成,且呈XY矩阵(2维行列)地排列。TFT62的数据电极和栅极电极分别连接数据电极线61a和栅极电极线61b。
另外,数据电极线61a和栅极电极线61b分别向有源矩阵基板65的行方向和列方向延伸,并在玻璃基板60的端部与用于驱动各电极线的多个液晶驱动器相连接。以下,为了简化说明,只对图4所示的数据电极线61a侧的结构进行了说明,但显然,栅极电极线61b侧也具有相同的结构。
数据电极线61a延伸至玻璃基板60的端部,在该端部与驱动信号输出用端子相连接,该驱动信号输出用端子设置在液晶驱动器封装1a的输出端子部45。至于连接,例如,能够通过ACF(异向性导电薄膜:Anisotropic Conductive Film)使驱动信号输出用端子和玻璃基板60的端部所形成的多个数据电极线进行叠合并通过热压接处理来实现连接,其中,上述驱动信号输出用端子是按预定间距在输出端子部45上形成,上述多个数据电极线与上述驱动信号输出用端子具有相同的间距。
另外,在液晶驱动器封装1a的输入端子部46所设置的输入信号用端子与在外部配线基板47上设置的配线相连接。对于外部配线基板47上的配线,其提供显示数据等的控制信号或电源电位,并通过载带(载体)20和中介层2将其传送到液晶驱动器1。
根据上述显示数据,液晶驱动器1生成的驱动信号通过中介层2被输出到液晶驱动器封装1a的驱动信号输出用端子,因此,该驱动信号被传送到数据电极线61a,从而能够控制与其相对应的像素64的点亮。
如上所述,在本发明的液晶驱动器封装中,即使在安装有小型液晶驱动器的情况下,也能够形成字体较大易于读取的、识别性良好的标识,且还能够缓解对可打码文字数的限制,因此适用于信息量充分的、追溯性良好的编码系统,该信息是指,用于追溯制造履历的信息。
如上所述,本发明的液晶驱动器型显示装置由于能够使用其中具有良好识别性和追溯性的标识的液晶驱动器封装部件,因此,能够提高部件组装工序中操作的可靠性,且能够促进产品的品质管理的简单化。其结果,能够确保充分的可靠性,同时实现液晶驱动器型显示装置的高性能化和低成本化。
在本实施方式的有源矩形基板65中,使用的是玻璃基板60,但是本发明并不仅限于此,只要是透明基板即可,所以可使用现有公知的基板。另外,在本实施方式中,作为数据电极线侧的驱动器,使用的是液晶驱动器1,但是本发明并不限于此,也可作为栅极电极线侧的液晶驱动器来使用。
另外,在本实施方式中,说明了需要对液晶显示体进行驱动的液晶驱动器型显示装置,但是本发明的显示装置并不限于此,例如有,EL(电致发光)显示体或等离子显示体等,其可在技术方案的范围内进行各种变更。
(实施方式2)
图5表示本发明的半导体装置的其它示例,例如安装有半导体元件的BGA(球栅阵列:Ball Grid Array)型的安装体。在图中,对与前面所说明的液晶驱动器封装的结构具有等同功能的结构,赋予与前面相同的符号,并省略其说明。
半导体元件(IC芯片)81通过倒装芯片的方式与中介层2连接,中介层2与设在电路基板90上的配线图形4连接,半导体元件(IC芯片)81和中介层2被安装于BGA型安装体1b。
电路基板90由玻璃环氧树脂或陶瓷等绝缘基材83构成,形成在绝缘基材83上的配线图形4通过导通孔(via hole)84与焊接凸点85连接,其中,导通孔84贯通上述绝缘基板83,焊接凸点85呈格子状排列地形成在上述绝缘基板83的背面。焊接凸点85还具备端子的功能,其作为用于连接BGA型安装体1b与外部的电路基板的端子。配线图形4的表面由抗蚀树脂7所包覆,并且该配线图形4的一部分裸露在上述树脂7之外,构成连接引线。
此外,电路基板90上的配线图形4还构成IC芯片81的外部电路的一部分,并且连接作为外部部件的芯片部件86。芯片部件86能够通过凸点87或者导电性焊膏等进行连接。如上所述,通过将外部电路或外部部件内置于封装内部,形成模块,从而能够缩小包括外部部件在内的电路面积,并且能够减少BGA型安装体1b的端子数量,进一步说,有利于实现其中安装有上述模块的系统的小型化。
为了强化或者保护中介层2和IC芯片81的连接部、以及电路基板90和中介层2的连接部,对于上述连接部,注入热硬化性树脂11。此时,中介层2的搭载有IC芯片81的面的背面13裸露在热硬化性树脂11之外。另外,IC芯片81形成在绝缘基材83中的贯通孔的内部,且由热硬化性树脂11完全包覆,从而构成最不易受外部环境影响的结构。
标识5形成在中介层2的背面13。根据上述结构,与上述实施方式1中所说明的液晶驱动器封装相同,能够确保大面积的标识形成区域,因此能够实现易于读取的大字体标识,且能够确保更大的最大可打码文字数。
另外,BGA型安装体1b还与外部的电路基板连接并发挥功能,此时,由于IC芯片81位于与外部电路基板的表面相对的一侧,因此,从外部看不到该IC芯片81。通过在中介层2的背面13进行标示IC芯片81的识别信息,即使将BGA型安装体1b组装在外部电路基板之后,也能够容易地确认出IC芯片81的识别信息。
本实施方式可适用于各种半导体元件,例如作为IC芯片81的液晶驱动器、存储器IC、DSP等。另外,电路基板90并不仅限于单层基板,还能够是多层基板。
以上,通过实施方式1和实施方式2说明了在一个半导体装置上安装一个中介层的示例。在采用同时安装多个中介层时,本发明也具有同样的效果。另外,还适用于一个中介层搭载多个半导体元件的半导体装置。
另外,中介层并不仅限于本实施方式所示的以Si基板为材料的硬材料结构,也可使用诸如带状的可挠性材料,也可以使用具有伸缩性的基材。其形状也并不仅限于板状,可根据用途采用各种形状,例如,棱柱形或者搭载半导体元件的面大致呈圆形的形状。
此外,上述具体实施方式或实施例仅仅是用于说明本发明技术内容的示例。本发明不限于上述具体示例,不应对本发明进行狭义的解释,可在本发明的精神和技术方案的范围内进行各种变更来实施之。
Claims (12)
1.一种半导体装置,具备与半导体元件电连接的中介层,其特征在于:
上述中介层形成有用于表示与上述半导体元件相关的预定信息等的标识。
2.一种半导体装置,具备半导体元件、中介层和电路基板,其中,上述中介层与上述半导体元件电连接,上述电路基板借助于上述中介层与上述半导体元件电连接,其特征在于:
上述中介层在其与上述半导体元件连接的面的背面形成有用于表示与上述半导体元件相关的预定信息等的标识。
3.一种半导体装置,具备与半导体元件电连接的中介层,其特征在于:
上述中介层形成有用于识别上述半导体元件的标识。
4.一种半导体装置,具备半导体元件、中介层和电路基板,其中,上述中介层与上述半导体元件电连接,上述电路基板借助于上述中介层与上述半导体元件电连接,其特征在于:
上述中介层在其与上述半导体元件连接的面的背面形成有用于识别上述半导体元件的标识。
5.根据权利要求2或4所述的半导体装置,其特征在于:
上述电路基板是载带。
6.根据权利要求1至4中的任意一项所述的半导体装置,其特征在于:
上述中介层由Si基板构成。
7.根据权利要求1至4中的任意一项所述的半导体装置,其特征在于:
上述标识是通过喷墨打码所形成的标识。
8.根据权利要求1至4中的任意一项所述的半导体装置,其特征在于:
上述标识是通过激光打码所形成的标识。
9.根据权利要求1至4中的任意一项所述的半导体装置,其特征在于:
上述中介层在其与上述半导体元件连接的面形成有配线,并且上述配线不形成在上述标识所形成的区域的背面。
10.根据权利要求1至4中的任意一项所述的半导体装置,其特征在于:
上述半导体元件是用于驱动显示体的驱动器IC,该显示体根据电信号进行动作。
11.一种显示装置,其特征在于:
具备权利要求10所述的半导体装置和根据电信号进行动作的显示体。
12.一种电子设备,其特征在于:
具备权利要求1至4中的任意一项所述的半导体装置。
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CN103700642A (zh) * | 2013-12-26 | 2014-04-02 | 颀中科技(苏州)有限公司 | 覆晶封装结构 |
CN111223413A (zh) * | 2020-01-03 | 2020-06-02 | 江苏铁锚玻璃股份有限公司 | 适用于交通领域的低成本显示屏面板制造方法 |
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KR101896348B1 (ko) * | 2011-07-22 | 2018-09-07 | 삼성전자주식회사 | 칩 온 필름 패키지 및 이를 포함하는 장치 어셈블리 |
US11562928B2 (en) * | 2019-01-25 | 2023-01-24 | Omnivision Technologies, Inc. | Laser marked code pattern for representing tracing number of chip |
US11302614B2 (en) * | 2019-08-23 | 2022-04-12 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Chip on film and display device |
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JPH10321754A (ja) * | 1997-05-15 | 1998-12-04 | Mitsui High Tec Inc | 半導体装置 |
JP3642765B2 (ja) * | 2002-04-19 | 2005-04-27 | 沖電気工業株式会社 | 半導体装置、その製造方法、及び半導体装置の位置測定方法 |
JP3726115B2 (ja) * | 2002-05-20 | 2005-12-14 | 新日本無線株式会社 | 半導体装置の製造方法 |
JP3967263B2 (ja) * | 2002-12-26 | 2007-08-29 | セイコーインスツル株式会社 | 半導体装置及び表示装置 |
JP4257844B2 (ja) * | 2003-11-04 | 2009-04-22 | パナソニック株式会社 | 半導体装置およびその製造方法 |
US7291900B2 (en) * | 2005-08-25 | 2007-11-06 | Micron Technology, Inc. | Lead frame-based semiconductor device packages incorporating at least one land grid array package |
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CN103700642A (zh) * | 2013-12-26 | 2014-04-02 | 颀中科技(苏州)有限公司 | 覆晶封装结构 |
CN103700642B (zh) * | 2013-12-26 | 2017-05-10 | 颀中科技(苏州)有限公司 | 覆晶封装结构 |
CN111223413A (zh) * | 2020-01-03 | 2020-06-02 | 江苏铁锚玻璃股份有限公司 | 适用于交通领域的低成本显示屏面板制造方法 |
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JP2008108987A (ja) | 2008-05-08 |
WO2008050582A1 (fr) | 2008-05-02 |
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