CN101527287A - 打线结构及其制作方法 - Google Patents

打线结构及其制作方法 Download PDF

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Publication number
CN101527287A
CN101527287A CN200910133707A CN200910133707A CN101527287A CN 101527287 A CN101527287 A CN 101527287A CN 200910133707 A CN200910133707 A CN 200910133707A CN 200910133707 A CN200910133707 A CN 200910133707A CN 101527287 A CN101527287 A CN 101527287A
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China
Prior art keywords
projection
chip
soldered ball
bond structure
wire bond
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CN200910133707A
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English (en)
Inventor
资重兴
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PINESTAR CO Ltd
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PINESTAR CO Ltd
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Publication of CN101527287A publication Critical patent/CN101527287A/zh
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Abstract

本发明涉及一种打线结构，尤其涉及半导体元件的打线结构及其制作方法，主要包括有一芯片，且该芯片透过一导电线与一导电部相连接，其中芯片的主动表面上设置有至少一焊垫，并于焊垫上设置有一凸块，且该凸块的组成材料包括金，此外，凸块上还设置有一焊球，借由焊垫及凸块的设置可将焊球及芯片进行隔离，并避免在打线过程当中所产生的高温对芯片造成损害。

Description

打线结构及其制作方法
技术领域
本发明涉及一种打线结构，尤其涉及半导体元件的打线结构及其制作方法，可有效避免在打线过程当中所产生的高温对芯片造成损害。
背景技术
图1所示为现有的打线结构的侧视图。传统的打线结构10包括有一基板11及一芯片13，其中芯片13设置于基板11的上表面，且芯片13包括有一主动表面131及一背面133。芯片13的主动表面131上设置有一焊垫15，并透过一焊球171及一导电线173进行焊垫15与一导电部19的连接。
在打线结构10的制作过程中，芯片13设置在基板11的上表面，并透过粘合层12进行连接，例如，芯片13的背面133透过粘合层12与基板11的上表面相连接。此外，亦可以透过焊针18于焊垫15上形成焊球171，并以焊针形成导电线173以连接焊球171及导电部19。
一般而言，焊球171及导电线173两者都是由铜制成的，借此将有利于降低打线结构10的制作成本。然而，在焊球171及导电线173的设置过程中，将有可能会对芯片13或焊垫15的结构造成影响，例如，当焊球171及导电线173是由铜所构成时，在焊垫15上设置焊球171时将会产生高温，且高温会经由焊垫15传递至芯片13，使得芯片13或焊垫15遭到损害，并进一步造成打线结构10的良率下降。
发明内容
本发明的主要目的，在于提供一种打线结构，其中焊垫及焊球之间增设有一凸块，使得焊球不会与芯片及/或焊垫直接接触，借此将可有效避免在打线的制造过程中对芯片及/或焊垫造成损害。
本发明的次要目的，在于提供一种打线结构，其中凸块是由金所制成，由于金的硬度远低于铜、锡或铝等材质，因此可有效避免芯片的构造或功能在打线的制造过程中造成损害。
本发明的又一目的，在于提供一种打线结构，其中凸块设置在焊垫及焊球之间，借此将可以增加焊球与焊垫之间的间距，而有利于提高打线结构的产品良率。
本发明的又一目的，在于提供一种打线结构的制作方法，其主要是透过焊针进行焊球及导电线的设置，并有利于打线的加工效率的提升。
本发明的又一目的，在于提供一种打线结构的制作方法，其主要是在焊垫上形成金制成的凸块，之后再于凸块上形成焊球及导电线，借此将可避免焊球直接与焊垫接触。
为达成上述目的，本发明提供一种打线结构，包括有：一芯片，包括有一第一表面及一第二表面；一焊垫，设置于芯片的第一表面上；一凸块，设置于焊垫上，且凸块内包括金；一焊球，设置在凸块上；及一导电线，用以连接焊球及一导电部。
本发明还提供一种打线结构，包括有：至少一第一焊垫，设置于一第一芯片上；至少一第二焊垫，设置于一第二芯片上；一第一凸块，设置于第一焊垫上；一第二凸块，设置于第二焊垫上，且第一凸块及第二凸块内都包括金；一焊球，设置于第一凸块上；及一导电线，用以连接焊球及第二凸块。
本发明还提供一种打线结构的制作方法，其中打线结构包括有一芯片，而芯片上设置有一焊垫，并包括有以下步骤：于焊垫上形成一凸块，且凸块内包括金；于凸块上形成一焊球；及形成一导电线，并以导电线连该焊球及一导电架。
附图说明
图1为现有的打线结构的侧视图；
图2为本发明打线结构一较佳实施例的侧视图；
图3A至图3C分别为本发明打线结构一实施例的制作方法流程图；
图4为本发明打线结构又一实施例的侧视图；
图5为本发明打线结构又一实施例的侧视图；
图6为本发明打线结构又一实施例的侧视图；
图7A至图7D分别为本发明打线结构又一实施例的制作方法流程图；
图8为本发明打线结构又一实施例的侧视图。
附图标记说明：10-打线结构；11-基板；12-粘合层；13-芯片；131-主动表面；133-背面；15-焊垫；171-焊球；173-导电线；18-焊针；19-导电部；20-打线结构；200-打线结构；21-基板；22-粘合层；23-芯片；231-第一表面；233-第二表面；25-焊垫；26-凸块；27-导线；271-焊球；273-导电线；281-焊针；283-焊针；29-导电部；30-打线结构；331-第一芯片；333-第二芯片；351-第一焊垫；353-第二焊垫；361-第一凸块；363-第二凸块；365-凸块；37-导线；371-焊球；373-导电线；381-焊针；383-焊针；40-打线结构；411-基板；413-导电架；43-芯片；431-第一表面；433-第二表面；45-焊垫；46-凸块；471-焊球；473-导电线；49-导电部。
具体实施方式
以下结合附图，对本发明上述的和另外的技术特征和优点作更详细的说明。
图2为本发明打线结构一较佳实施例的侧视图。如图所示，打线结构20包括有一芯片23，该芯片23主要是透过导电线273与导电部29相连接。此外，芯片23包括有一第一表面231及一第二表面233，其中第一表面231可为主动表面，而第二表面233则是背面。
芯片23的第一表面231上设置有至少一焊垫25，并于焊垫25上设置有一凸块26，其中凸块26内包括金或是由金所制成。凸块26上设置有一焊球271，并可透过一导电线273进行导电部29及焊球271的连接。
在本发明另一实施例中焊球271及导电线273可由相同材质所制成，例如铜、锡或铝等。由于凸块26内包括金，且金的硬度远低于铜、锡及铝等材质，借此在设置凸块26的过程中将不会对焊垫25及/或芯片23造成损害。由于焊球271是设置在凸块26的上方，且不会与焊垫25及/或芯片23接触，因此在将焊球271及导电线273设置在凸块26的过程中，将不会如现有构造一般对芯片23及/或焊垫25的结构及功能造成影响。
图3A至图3C分别为本发明打线结构一实施例的制作方法流程图。如图所示，芯片23的第一表面231上设置有一焊垫25，并于焊垫25上设置有一凸块26，其中凸块26可以金属扩散的超音波振动技术(ultrasonic vibration of metaldiffusion technology)进行设置。例如可透过焊针281在焊垫25上设置凸块26，且凸块26的材质包括金或是由金所组成，如图3A所示。在不同实施例中也可以电镀的方式将凸块26设置在焊垫25上。
之后可透过焊针283在凸块26上设置焊球271，如第3B图所示。例如焊针283内设置有一导线27，并使得导线27穿过焊针283。导线27的其中一端凸出于焊针283，并可以氢焰(hydrogen torch)或放电(electrical discharge)等方式加热凸出焊针283的导线27并使的熔化。焊针283可用以对熔化的导线27施加压力，使得熔化的导线27压迫凸块26，并在凸块26上形成焊球271。
焊针283也可用来形成导电线273，并以导电线273连接焊球271及导电部29，如图3C所示。例如在凸块26上形成焊球271后，可将焊针283由凸块26移动至导电部29，并以导线27对导电部29施加压力，使得导线27与导电部29相连接，借此将可以在凸块26及导电部29之间形成一导电线273。在本发明实施例中，导线27可以是铜线、锡线或铝线等，则焊球271与导电线273是由铜、锡或铝等材料所制成。
在打线的过程中还可以对芯片23、焊垫25及导电部29进行加热而有利于熔化导线27。焊针283可包括有一超音波振动单元，并可以透过超音波振动单元形成焊球271及导电线273。此外也可将金属扩散技术(metal diffusiontechnology)应用在焊针283上，以完成焊球271及导电线273的设置。
凸块26内部包括金或由金所制成，由于金的硬度远低于铜、锡或铝等材质，并可避免在将凸块26设置在焊垫25的过程中对芯片23及/或焊垫25造成影响。此外，设置在焊垫25上的凸块26还可以具有缓冲的功用，使得焊球271不会与芯片23及/或焊垫25直接接触，并可以保护芯片23及/或焊垫25，同时可避免制造过程中的高温对芯片23及/或焊垫25造成损坏。
在本发明另一实施例中，也可将芯片23设置在基板21的上表面。例如可使得芯片23的第二表面233经由粘合层22与基板21的上表面连接，而导电部29则可以设置在同一个基板21或不同的基板上。此外，本发明所述的基板21还可以是导电架(leadframe)，并将芯片23及/或导电部29设置在导电架上。
图4为本发明打线结构又一实施例的侧视图。如图所示，打线结构200包括有一芯片23及一基板21，其中芯片23可以透过粘合层22与基板21相连接。此外芯片23包括有一第一表面231及一第二表面233，第一表面231可以是主动表面，第二表面233则是背面。
导电部29可以设置在基板21上，而焊垫25则设置在芯片23的第一表面231。凸决26包括金或是由金所制成，并设置在焊垫25上，此外亦可于凸块26上形成一焊球271，并以一导电线273完成焊球271与导电部29的连接。
图5为本发明打线结构又一实施例的侧视图。如图所示，打线结构30包括有一相连接的第一芯片331及第二芯片333。并于第一芯片331上设置有至少一第一焊垫351，而第二芯片333上则设置有至少一第二焊垫353。
第一焊垫351及第二焊垫353上分别设置有一第一凸块361及一第二凸块363，其中第一凸块361及第二凸块363都包括金或是由金所制成。第二凸块363上设置有一凸块365，而第一凸块361上则设置有一焊球371，并透过一导电线373进行焊球371及凸块365之间的连接，其中焊球371及凸块365都由铜、锡或铝所制成。
在本发明不同实施例中，设置在第二凸块363上的凸块365可以省略，借此焊球371将会透过导电线373直接与第二凸块363进行连接，如图6所示。
图7A至图7D分别为本发明打线结构又一实施例的制作方法流程图。如图所示，第一焊垫351及第二焊垫353分别设置在第一芯片331及第二芯片333上。之后可以透过焊针381于第一焊垫351上形成第一凸块361，并于第二焊垫353上形成第二凸块363，其中第一凸块363及第二凸块363都包括金或是由金所制成，如图7A所示。
在完成第一凸块361及第二凸块363的设置后，可再以焊针383于第二凸块363上形成凸块365，如图7B所示。此外焊针383也可用来在第一凸块361上形成焊球371，其中凸块365及焊球371都可由铜、锡或铝所制成，如图7C所示。
在于第一凸块361上完成焊球371的设置后，可将焊针383由第一凸块361移动至凸块365。其中焊针383内设置有导线37，并可以焊针383将导线37相对于凸块365施加压力，使得导线37与凸块365相连接，借此在第一芯片331及第二芯片333之间形成导电线373，如图7D所示。此外，导线37可为铜线、锡线或铝线等，而焊球371、导电线373及/或凸块365是由铜、锡或铝等材料所制成。
图8为本发明打线结构又一实施例的侧视图。如图所示，打线结构40包括有一与导电部49相连接的芯片43，其中芯片43可以被设置在基板411上，而导电部49则被设置在导电架413上。芯片43包括有一第一表面431及一第二表面433，且第一表面431为主动表面，第二表面433则为背面。
芯片43的第一表面431上设置有至少一焊垫45，并于焊垫45上设置有一凸块46，且凸块46包括金或是由金所制成。凸块46上尚设置有一焊球471，并可透过一导电线473进行导电部49及焊球471之间的连接。
以上所述仅为本发明的较佳实施例，对本发明而言仅仅是说明性的，而非限制性的。本专业技术人员理解，在本发明权利要求所限定的精神和范围内可对其进行许多改变，修改，甚至等效，但都将落入本发明的保护范围内。

Claims (18)

1.一种打线结构，其特征在于包括有：
一芯片，包括有一第一表面及一第二表面；
一焊垫，设置于该芯片的第一表面上；
一凸块，设置于所述焊垫上，且所述凸块内包括金；
一焊球，设置在所述凸块上；及
一导电线，用以连接所述焊球及一导电部。
2.如权利要求1所述的打线结构，其特征在于包括有一基板用以连接该芯片的第二表面。
3.如权利要求1所述的打线结构，其特征在于所述焊球及所述导电线是由相同的材质所制成。
4.如权利要求3所述的打线结构，其特征在于所述焊球及所述导电线的材质为铜、锡或铝。
5.如权利要求1所述的打线结构，其特征在于所述焊球及所述导电线是透过一焊针所形成。
6.如权利要求1所述的打线结构，其特征在于所述芯片的第一表面为一主动表面。
7.一种打线结构，包括有：
至少一第一焊垫，设置于一第一芯片上；
至少一第二焊垫，设置于一第二芯片上；
一第一凸块，设置于所述第一焊垫上；
一第二凸块，设置于所述第二焊垫上，且所述第一凸块及所述第二凸块内都包括金；
一焊球，设置于所述第一凸块上；及
一导电线，用以连接所述焊球及所述第二凸块。
8.如权利要求7所述的打线结构，其特征在于包括有一凸块设置于所述第二凸块上，且所述导电线透过所述凸块与所述第二凸块相连接。
9.如权利要求7所述的打线结构，其特征在于所述焊球及所述导电线是由相同的材质所制成。
10.如权利要求9所述的打线结构，其特征在于所述焊球及所述导电线的材质为铜、锡或铝。
11.如权利要求7所述的打线结构，其特征在于所述焊球及所述导电线是透过一焊针所形成。
12.一种打线结构的制作方法，其特征在于所述打线结构包括有一芯片，而所述芯片上设置有一焊垫，并包括有以下步骤：
于所述焊垫上形成一凸块，且所述凸块内包括金；
于所述凸块上形成一焊球；及
形成一导电线，并以所述导电线连接所述焊球及一导电架。
13.如权利要求12所述的制作方法，其特征在于包括有以下步骤：以一焊针形成所述焊球及所述导电线。
14.如权利要求12所述的制作方法，其特征在于所述焊球及所述导电线的材质为铜、锡或铝。
15.如权利要求12所述的制作方法，其特征在于所述凸块是以电镀的方式形成。
16.如权利要求12所述的制作方法，其特征在于所述凸块是以一焊针并透过金属扩散的方式形成。
17.一种打线结构，包括有：
一基板；
一导电部，设置于所述基板上；
一芯片，设置于所述基板上，且所述芯片包括有一第一表面及一第二表面；
一焊垫，设置于所述芯片的第一表面上；
一凸块，设置于所述焊垫上，且所述凸块内包括金；
一焊球，设置于所述凸块上；及
一导电线，用以连接所述导电部及所述焊球。
18.如权利要求17所述的打线结构，其特征在于包括有一粘合层设置于所述基板及所述芯片之间。
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