CN101505576B - 多层刚挠结合印刷线路板的制作方法 - Google Patents
多层刚挠结合印刷线路板的制作方法 Download PDFInfo
- Publication number
- CN101505576B CN101505576B CN2009101059463A CN200910105946A CN101505576B CN 101505576 B CN101505576 B CN 101505576B CN 2009101059463 A CN2009101059463 A CN 2009101059463A CN 200910105946 A CN200910105946 A CN 200910105946A CN 101505576 B CN101505576 B CN 101505576B
- Authority
- CN
- China
- Prior art keywords
- rigidity
- conjunction
- printed substrate
- manufacture method
- multilayered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000945 filler Substances 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 238000004080 punching Methods 0.000 claims abstract description 10
- 238000012546 transfer Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007689 inspection Methods 0.000 claims abstract description 5
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 40
- 238000003825 pressing Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 239000003814 drug Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- 238000005242 forging Methods 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000013019 agitation Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000007781 pre-processing Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 claims description 3
- 208000032443 Masked facies Diseases 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 12
- 238000011049 filling Methods 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101059463A CN101505576B (zh) | 2009-03-09 | 2009-03-09 | 多层刚挠结合印刷线路板的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101059463A CN101505576B (zh) | 2009-03-09 | 2009-03-09 | 多层刚挠结合印刷线路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101505576A CN101505576A (zh) | 2009-08-12 |
CN101505576B true CN101505576B (zh) | 2011-09-21 |
Family
ID=40977563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101059463A Active CN101505576B (zh) | 2009-03-09 | 2009-03-09 | 多层刚挠结合印刷线路板的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101505576B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102215642B (zh) * | 2010-04-01 | 2013-11-27 | 富葵精密组件(深圳)有限公司 | 软硬结合板的制作方法 |
CN101977486B (zh) * | 2010-10-29 | 2012-02-29 | 东莞红板多层线路板有限公司 | 线路板的过孔制作方法 |
CN102209442B (zh) * | 2010-11-16 | 2012-11-14 | 博罗县精汇电子科技有限公司 | 铜箔覆盖法生产软硬结合多层电路板的工艺 |
CN102045949B (zh) * | 2011-01-14 | 2013-05-15 | 深圳市兴森快捷电路科技股份有限公司 | 刚挠结合印制电路板的制作方法 |
CN102325432B (zh) * | 2011-06-30 | 2013-05-01 | 中山市达进电子有限公司 | 一种阴阳铜箔电路板的制造方法 |
CN102325426B (zh) * | 2011-06-30 | 2013-04-03 | 中山市达进电子有限公司 | 一种多层板外层再压合不对称光板的制作方法 |
CN102510678A (zh) * | 2011-10-27 | 2012-06-20 | 景旺电子(深圳)有限公司 | 软硬结合线路板的扰折区的加工方法及软硬结合线路板 |
CN102427676B (zh) * | 2011-11-18 | 2013-08-14 | 景旺电子(深圳)有限公司 | 一种散热型刚挠结合板及其制作方法 |
CN102523693A (zh) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种高频-低频混合板材结构印制电路板制作工艺 |
CN103260349A (zh) * | 2012-02-15 | 2013-08-21 | 深圳市科伦特科技有限公司 | 软硬电路板组合式led显示屏模组 |
CN102595807B (zh) * | 2012-02-29 | 2014-10-15 | 博罗县精汇电子科技有限公司 | 软硬结合电路板的生产工艺 |
CN102883555B (zh) * | 2012-10-17 | 2015-05-06 | 无锡江南计算技术研究所 | 软硬结合板压合方法 |
CN102917547B (zh) * | 2012-11-13 | 2015-07-08 | 无锡江南计算技术研究所 | 平衡软硬结合板软板区应力的方法 |
CN102970828B (zh) * | 2012-11-30 | 2015-05-20 | 成都航天通信设备有限责任公司 | 一种刚挠结合印制电路板的制造方法 |
CN103079365B (zh) * | 2012-12-28 | 2016-04-06 | 深圳市新宇腾跃电子有限公司 | 多层柔性电路板内层线路一次成型方法 |
CN103118493B (zh) * | 2013-01-25 | 2015-05-20 | 深圳市景旺电子股份有限公司 | 一种刚挠结合板制作过程中填充块的制作方法 |
CN104244612B (zh) * | 2014-09-11 | 2017-06-27 | 深圳崇达多层线路板有限公司 | 一种在ptfe电路板上制作金属化孔的方法 |
CN104411114A (zh) * | 2014-11-14 | 2015-03-11 | 镇江华印电路板有限公司 | 多层软硬结合板的生产工艺 |
CN106154001A (zh) * | 2015-04-18 | 2016-11-23 | 肇庆恒港电力科技发展有限公司 | 一种用于低压计量箱的线路板及其制作方法 |
CN106879195A (zh) * | 2017-03-08 | 2017-06-20 | 维沃移动通信有限公司 | 一种软硬结合板制作方法以及装置 |
CN109202209A (zh) * | 2017-07-06 | 2019-01-15 | 镇江大全金属表面处理有限公司 | 一种便捷式镀锡装置 |
CN108260275B (zh) * | 2017-12-21 | 2019-09-06 | 深南电路股份有限公司 | 采用抽取式垫片结构的刚挠结合pcb及其加工方法 |
CN111800956B (zh) * | 2020-07-21 | 2021-12-17 | 博敏电子股份有限公司 | 一种线路板阻焊黑油的加工方法 |
CN113301736A (zh) * | 2021-05-21 | 2021-08-24 | 山东英信计算机技术有限公司 | 一种软硬结合板及其制作方法、电子产品 |
-
2009
- 2009-03-09 CN CN2009101059463A patent/CN101505576B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101505576A (zh) | 2009-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101505576B (zh) | 多层刚挠结合印刷线路板的制作方法 | |
CN106961808B (zh) | 下沉式高密度互连板的制作方法 | |
CN100553414C (zh) | 多层式高密度互连印刷线路板的制作方法 | |
CN106211638B (zh) | 一种超薄多层印制电路板的加工方法 | |
CN101695218B (zh) | 一种制作具有半边孔印刷电路板的方法 | |
CN103298245B (zh) | 高频电路板的制作方法以及该方法制得的电路板 | |
CN107613671A (zh) | 一种电路板镀孔的制作方法 | |
CN101146407A (zh) | 印刷电路板载板电路图形转移成型工艺 | |
CN111511120B (zh) | 一种Raised Pad制作方法 | |
CN103096645A (zh) | 多层电路板压合定位方法 | |
JP2001068816A (ja) | 銅張積層板及びその銅張積層板を用いたレーザー加工方法 | |
CN109936916A (zh) | 一种孔内塞铜块5g高频线路板及其制备方法 | |
CN104320909B (zh) | 高阶梯铜电路板及其制作方法 | |
CN108521724A (zh) | 一种高挠曲高密度柔性印刷线路板的制作方法 | |
CN103874326A (zh) | 印刷电路板和印刷电路板的制造方法 | |
CN104427762A (zh) | 埋阻印制板及其制作方法 | |
CN1972564A (zh) | 利用激光钻孔机的过孔形成方法 | |
CN105848428A (zh) | 一种在pcb上制作金属化盲孔的方法 | |
CN110351964A (zh) | 凹槽pcb电路板加工工艺 | |
CN104470234A (zh) | 一种阶梯镀铜的pcb生产方法 | |
CN104202904B (zh) | 具有侧面凹槽的电路板的压合结构及电路板的制作方法 | |
CN102308679A (zh) | 多层印刷布线板的制造方法 | |
CN115866933A (zh) | 埋铜块板制作方法及埋铜块板 | |
CN115802614A (zh) | 埋铜块电路板及其制备方法 | |
CN105657970A (zh) | 刚挠结合板及其盲埋孔塞孔方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XINYU TENGYUE ELECTRONICS CO., LTD. Free format text: FORMER NAME: SHENZHEN ZHONGXING XINYU FPC CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518105, A28, West Industrial Zone, Tam Tam, Baoan District, Guangdong, Shenzhen, Songgang Patentee after: SHENZHEN XINYU TENGYUE ELECTRONICS CO., LTD. Address before: 518105, A28, West Industrial Zone, Tam Tam, Baoan District, Guangdong, Shenzhen, Songgang Patentee before: Shenzhen Zhongxing Xinyu FPC Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220620 Address after: 343800 phase II of Wan'an County Industrial Park, Ji'an City, Jiangxi Province (in jintaiyuan Industrial Park) Patentee after: Ji'an Xinyu Tengyue Electronics Co.,Ltd. Address before: 518105, A28, West Industrial Zone, Tam Tam, Baoan District, Guangdong, Shenzhen, Songgang Patentee before: SHENZHEN XINYU TENGYUE ELECTRONICS Co.,Ltd. |