CN101501047B - 新型环氧化合物及其制备方法 - Google Patents

新型环氧化合物及其制备方法 Download PDF

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Publication number
CN101501047B
CN101501047B CN2007800302866A CN200780030286A CN101501047B CN 101501047 B CN101501047 B CN 101501047B CN 2007800302866 A CN2007800302866 A CN 2007800302866A CN 200780030286 A CN200780030286 A CN 200780030286A CN 101501047 B CN101501047 B CN 101501047B
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China
Prior art keywords
carbon atoms
group
hydrogen atom
epoxy compound
general formula
Prior art date
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Expired - Fee Related
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CN2007800302866A
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English (en)
Chinese (zh)
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CN101501047A (zh
Inventor
佐佐木信利
藤田俊雄
内田博
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Resonac Holdings Corp
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Showa Denko KK
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Publication of CN101501047A publication Critical patent/CN101501047A/zh
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934—Powdered coating composition

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
CN2007800302866A 2006-08-15 2007-08-13 新型环氧化合物及其制备方法 Expired - Fee Related CN101501047B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006221648 2006-08-15
JP221648/2006 2006-08-15
PCT/JP2007/066061 WO2008020637A1 (en) 2006-08-15 2007-08-13 Novel epoxy compound and process for production thereof

Publications (2)

Publication Number Publication Date
CN101501047A CN101501047A (zh) 2009-08-05
CN101501047B true CN101501047B (zh) 2011-12-14

Family

ID=39082158

Family Applications (1)

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CN2007800302866A Expired - Fee Related CN101501047B (zh) 2006-08-15 2007-08-13 新型环氧化合物及其制备方法

Country Status (7)

Country Link
US (1) US7880018B2 (OSRAM)
EP (1) EP2055708B1 (OSRAM)
JP (1) JP5153635B2 (OSRAM)
KR (1) KR101013394B1 (OSRAM)
CN (1) CN101501047B (OSRAM)
TW (1) TW200815492A (OSRAM)
WO (1) WO2008020637A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5266248B2 (ja) * 2007-11-07 2013-08-21 昭和電工株式会社 エポキシ基含有オルガノシロキサン化合物
JP5325206B2 (ja) * 2008-03-24 2013-10-23 昭和電工株式会社 エポキシ化合物およびその製造方法
JP5210122B2 (ja) * 2008-10-31 2013-06-12 昭和電工株式会社 接着剤用硬化性組成物
JP5149126B2 (ja) * 2008-11-07 2013-02-20 昭和電工株式会社 半導体封止用硬化性組成物
CN103154090B (zh) * 2010-08-11 2015-03-04 昭和电工株式会社 环氧硅氧烷缩合物、含有该缩合物的固化性组合物和其固化物
JP2016522978A (ja) * 2013-03-15 2016-08-04 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 粉末形態の固体シリコーン含有ホットメルト組成物の堆積及びそのカプセル化材の形成を含む光学アセンブリの製造方法
CN105669738A (zh) * 2016-01-19 2016-06-15 南昌大学 一种改性硅烷偶联剂的制备方法
WO2023008493A1 (ja) * 2021-07-29 2023-02-02 株式会社カネカ シラン化合物およびその製造方法、ポリオルガノシロキサン化合物、ハードコート組成物、ハードコーフィルムおよびその製造方法、ならびにディスプレイ
CN119798304B (zh) * 2024-12-31 2025-10-10 苏州高泰电子技术股份有限公司 一种耐高温硅烷偶联剂及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206328A (en) * 1990-02-08 1993-04-27 Shin-Etsu Chemical Co., Ltd. Process for the production of an organopolysiloxane
US6080872A (en) * 1997-12-16 2000-06-27 Lonza S.P.A. Cycloaliphatic epoxy compounds

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580430A (en) 1978-12-13 1980-06-17 Teijin Ltd Preparation of polyester
JPS58222160A (ja) * 1982-06-16 1983-12-23 Tokuyama Soda Co Ltd コ−テイング用組成物
JPH03255130A (ja) 1990-03-05 1991-11-14 Shin Etsu Chem Co Ltd エポキシ基含有オルガノポリシロキサンの製造方法
CA2481888A1 (en) * 2002-04-08 2003-10-16 Ranbaxy Laboratories Limited Alpha, omega-dicarboximide derivatives as useful uro-selective a1a adrenoceptor blockers
US7244473B2 (en) * 2003-04-22 2007-07-17 Konica Minolta Medical & Graphic, Inc. Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound
FI116844B (fi) * 2004-03-22 2006-03-15 Valtion Teknillinen Reaktiiviset kalvonmuodostajat
US20080085494A1 (en) * 2004-07-14 2008-04-10 Mader Roger M Dental Compositions Containing Oxirane Monomers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206328A (en) * 1990-02-08 1993-04-27 Shin-Etsu Chemical Co., Ltd. Process for the production of an organopolysiloxane
US6080872A (en) * 1997-12-16 2000-06-27 Lonza S.P.A. Cycloaliphatic epoxy compounds

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
John L.Wood et al.Total Synthesis of (±)-Epoxysorbicillinol.《J. Am. Chem. Soc》.2001,第123卷(第9期),2097-2098. *

Also Published As

Publication number Publication date
JPWO2008020637A1 (ja) 2010-01-07
US20100197936A1 (en) 2010-08-05
EP2055708A4 (en) 2011-01-26
CN101501047A (zh) 2009-08-05
EP2055708A1 (en) 2009-05-06
WO2008020637A1 (en) 2008-02-21
KR101013394B1 (ko) 2011-02-14
TWI362397B (OSRAM) 2012-04-21
EP2055708B1 (en) 2013-07-17
US7880018B2 (en) 2011-02-01
KR20090024827A (ko) 2009-03-09
JP5153635B2 (ja) 2013-02-27
TW200815492A (en) 2008-04-01

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Granted publication date: 20111214

Termination date: 20130813