CN101494181B - 焊料球印刷装置 - Google Patents

焊料球印刷装置 Download PDF

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Publication number
CN101494181B
CN101494181B CN2009100021295A CN200910002129A CN101494181B CN 101494181 B CN101494181 B CN 101494181B CN 2009100021295 A CN2009100021295 A CN 2009100021295A CN 200910002129 A CN200910002129 A CN 200910002129A CN 101494181 B CN101494181 B CN 101494181B
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CN
China
Prior art keywords
solder ball
printing
substrate
screen
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009100021295A
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English (en)
Chinese (zh)
Other versions
CN101494181A (zh
Inventor
本间真
向井范昭
川边伸一郎
五十岚章雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of CN101494181A publication Critical patent/CN101494181A/zh
Application granted granted Critical
Publication of CN101494181B publication Critical patent/CN101494181B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
CN2009100021295A 2008-01-25 2009-01-15 焊料球印刷装置 Expired - Fee Related CN101494181B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-015215 2008-01-25
JP2008015215 2008-01-25
JP2008015215A JP5076922B2 (ja) 2008-01-25 2008-01-25 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
CN101494181A CN101494181A (zh) 2009-07-29
CN101494181B true CN101494181B (zh) 2010-10-06

Family

ID=40924698

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009100021295A Expired - Fee Related CN101494181B (zh) 2008-01-25 2009-01-15 焊料球印刷装置

Country Status (4)

Country Link
JP (1) JP5076922B2 (https=)
KR (1) KR101027491B1 (https=)
CN (1) CN101494181B (https=)
TW (1) TW200945978A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10973161B2 (en) 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5018062B2 (ja) * 2006-12-15 2012-09-05 株式会社日立プラントテクノロジー ハンダボール印刷装置
US8424748B2 (en) * 2009-12-21 2013-04-23 Intel Corporation Solder in cavity interconnection technology
WO2013038726A1 (ja) * 2011-09-12 2013-03-21 オムロン株式会社 検査用治具
JP6069723B2 (ja) 2012-06-06 2017-02-01 澁谷工業株式会社 微小ボール搭載ワークのリペア装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
CN104090505B (zh) * 2014-04-10 2017-02-15 广东骏亚电子科技股份有限公司 一种高精密电路板小间隙自动填补矫正方法
CN105789086B (zh) * 2014-12-24 2019-03-05 北京中电科电子装备有限公司 一种芯片双面助焊剂涂敷的装置
JP6475030B2 (ja) * 2015-01-30 2019-02-27 Ａｉメカテック株式会社 基板処理システム及び基板処理方法
JP6567290B2 (ja) 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
WO2016170573A1 (ja) * 2015-04-20 2016-10-27 ヤマハ発動機株式会社 粘性流体供給装置および部品実装装置
KR101935518B1 (ko) * 2016-02-15 2019-01-04 주식회사 이오테크닉스 레이저 솔더링 수선 공정, 레이저 솔더링 공정 및 레이저 솔더링 시스템
KR102640288B1 (ko) * 2017-10-19 2024-02-23 엘지디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법
JP2022514137A (ja) * 2018-09-28 2022-02-10 ボストン プロセス テクノロジーズ，インコーポレイテッド 複数のモジュールチップ製造構成
WO2020090036A1 (ja) * 2018-10-31 2020-05-07 マイクロ・テック株式会社 バイブレーション装置、バイブレーション方法、スクリーン印刷装置、振動振込装置、及び、マテリアルハンドリング装置
JP7513873B2 (ja) * 2019-04-30 2024-07-10 デクセリアルズ株式会社 摺動装置
KR102696530B1 (ko) * 2019-04-30 2024-08-19 데쿠세리아루즈 가부시키가이샤 슬라이딩 대상물의 표면에 대한 슬라이딩 처리물의 공급 또는 배제 방법
JP6939950B1 (ja) * 2020-06-01 2021-09-22 住友金属鉱山株式会社 検査装置および検査方法
CN112687570B (zh) * 2020-12-28 2023-02-28 中国电子科技集团公司第十三研究所 用于陶瓷外壳焊盘焊接性能检验的试验方法
JP7107601B1 (ja) 2021-01-27 2022-07-27 Ａｉメカテック株式会社 バンプ形成装置、バンプ形成方法、ハンダボールリペア装置、及び、ハンダボールリペア方法
CN116918048A (zh) * 2021-03-09 2023-10-20 株式会社富士 良好与否判定装置及良好与否判定方法
JP7489140B2 (ja) * 2022-04-28 2024-05-23 Ａｉメカテック株式会社 検査・リペア装置
WO2024105918A1 (ja) * 2022-11-14 2024-05-23 パナソニックＩｐマネジメント株式会社 部品実装基板の製造方法および製造システム、ならびに搭載装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP3822834B2 (ja) * 2002-04-12 2006-09-20 新日本製鐵株式会社 リペア方法及び装置
JP2006066413A (ja) * 2004-08-24 2006-03-09 Hitachi Metals Ltd 導電性ボールの搭載方法及び搭載装置並びにバンプ形成方法及びバンプ形成装置
JP4683326B2 (ja) 2005-04-19 2011-05-18 日立金属株式会社 導電性ボールの搭載装置
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
-2.
JP特开2003-309139A 2003.10.31
JP特开2005-116950A 2005.04.28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10973161B2 (en) 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device

Also Published As

Publication number Publication date
KR101027491B1 (ko) 2011-04-06
JP5076922B2 (ja) 2012-11-21
KR20090082112A (ko) 2009-07-29
TW200945978A (en) 2009-11-01
JP2009177015A (ja) 2009-08-06
TWI378750B (https=) 2012-12-01
CN101494181A (zh) 2009-07-29

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SE01 Entry into force of request for substantive examination
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Owner name: HITACHI,LTD.

Free format text: FORMER OWNER: HITACHI PLANT TECHNOLOGIES LTD.

Effective date: 20140312

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20140312

Address after: Tokyo, Japan

Patentee after: Hitachi Ltd.

Address before: Tokyo, Japan, Japan

Patentee before: Hitachi Plant Technologies Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101006

Termination date: 20170115