KR101027491B1 - 땜납볼 인쇄장치 - Google Patents

땜납볼 인쇄장치 Download PDF

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Publication number
KR101027491B1
KR101027491B1 KR1020090003660A KR20090003660A KR101027491B1 KR 101027491 B1 KR101027491 B1 KR 101027491B1 KR 1020090003660 A KR1020090003660 A KR 1020090003660A KR 20090003660 A KR20090003660 A KR 20090003660A KR 101027491 B1 KR101027491 B1 KR 101027491B1
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KR
South Korea
Prior art keywords
printing
screen
solder ball
substrate
flux
Prior art date
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Expired - Fee Related
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KR1020090003660A
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English (en)
Korean (ko)
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KR20090082112A (ko
Inventor
마코토 혼마
노리아키 무카이
신이치로 가와베
아키오 이가라시
Original Assignee
가부시키가이샤 히타치플랜트테크놀로지
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Publication date
Application filed by 가부시키가이샤 히타치플랜트테크놀로지 filed Critical 가부시키가이샤 히타치플랜트테크놀로지
Publication of KR20090082112A publication Critical patent/KR20090082112A/ko
Application granted granted Critical
Publication of KR101027491B1 publication Critical patent/KR101027491B1/ko
Assigned to 가부시키가이샤 히타치세이사쿠쇼 reassignment 가부시키가이샤 히타치세이사쿠쇼 권리의 전부이전등록 Assignors: 가부시키가이샤 히타치플랜트테크놀로지
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
KR1020090003660A 2008-01-25 2009-01-16 땜납볼 인쇄장치 Expired - Fee Related KR101027491B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-015215 2008-01-25
JP2008015215A JP5076922B2 (ja) 2008-01-25 2008-01-25 ハンダボール印刷装置

Publications (2)

Publication Number Publication Date
KR20090082112A KR20090082112A (ko) 2009-07-29
KR101027491B1 true KR101027491B1 (ko) 2011-04-06

Family

ID=40924698

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090003660A Expired - Fee Related KR101027491B1 (ko) 2008-01-25 2009-01-16 땜납볼 인쇄장치

Country Status (4)

Country Link
JP (1) JP5076922B2 (https=)
KR (1) KR101027491B1 (https=)
CN (1) CN101494181B (https=)
TW (1) TW200945978A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020069294A1 (en) 2018-09-28 2020-04-02 Boston Process Technologies, Inc. Multiple module chip manufacturing arrangement

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5018062B2 (ja) * 2006-12-15 2012-09-05 株式会社日立プラントテクノロジー ハンダボール印刷装置
US8424748B2 (en) * 2009-12-21 2013-04-23 Intel Corporation Solder in cavity interconnection technology
WO2013038726A1 (ja) * 2011-09-12 2013-03-21 オムロン株式会社 検査用治具
JP6069723B2 (ja) 2012-06-06 2017-02-01 澁谷工業株式会社 微小ボール搭載ワークのリペア装置
JP6109609B2 (ja) * 2013-03-14 2017-04-05 Ａｉメカテック株式会社 ハンダボール印刷機およびハンダボール印刷方法
CN104090505B (zh) * 2014-04-10 2017-02-15 广东骏亚电子科技股份有限公司 一种高精密电路板小间隙自动填补矫正方法
CN105789086B (zh) * 2014-12-24 2019-03-05 北京中电科电子装备有限公司 一种芯片双面助焊剂涂敷的装置
JP6475030B2 (ja) * 2015-01-30 2019-02-27 Ａｉメカテック株式会社 基板処理システム及び基板処理方法
JP6567290B2 (ja) 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
WO2016170573A1 (ja) * 2015-04-20 2016-10-27 ヤマハ発動機株式会社 粘性流体供給装置および部品実装装置
KR101935518B1 (ko) * 2016-02-15 2019-01-04 주식회사 이오테크닉스 레이저 솔더링 수선 공정, 레이저 솔더링 공정 및 레이저 솔더링 시스템
US10973161B2 (en) 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device
KR102640288B1 (ko) * 2017-10-19 2024-02-23 엘지디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법
WO2020090036A1 (ja) * 2018-10-31 2020-05-07 マイクロ・テック株式会社 バイブレーション装置、バイブレーション方法、スクリーン印刷装置、振動振込装置、及び、マテリアルハンドリング装置
JP7513873B2 (ja) * 2019-04-30 2024-07-10 デクセリアルズ株式会社 摺動装置
KR102696530B1 (ko) * 2019-04-30 2024-08-19 데쿠세리아루즈 가부시키가이샤 슬라이딩 대상물의 표면에 대한 슬라이딩 처리물의 공급 또는 배제 방법
JP6939950B1 (ja) * 2020-06-01 2021-09-22 住友金属鉱山株式会社 検査装置および検査方法
CN112687570B (zh) * 2020-12-28 2023-02-28 中国电子科技集团公司第十三研究所 用于陶瓷外壳焊盘焊接性能检验的试验方法
JP7107601B1 (ja) 2021-01-27 2022-07-27 Ａｉメカテック株式会社 バンプ形成装置、バンプ形成方法、ハンダボールリペア装置、及び、ハンダボールリペア方法
CN116918048A (zh) * 2021-03-09 2023-10-20 株式会社富士 良好与否判定装置及良好与否判定方法
JP7489140B2 (ja) * 2022-04-28 2024-05-23 Ａｉメカテック株式会社 検査・リペア装置
WO2024105918A1 (ja) * 2022-11-14 2024-05-23 パナソニックＩｐマネジメント株式会社 部品実装基板の製造方法および製造システム、ならびに搭載装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303102A (ja) 2005-04-19 2006-11-02 Hitachi Metals Ltd 導電性ボールの搭載装置
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP3822834B2 (ja) * 2002-04-12 2006-09-20 新日本製鐵株式会社 リペア方法及び装置
JP2006066413A (ja) * 2004-08-24 2006-03-09 Hitachi Metals Ltd 導電性ボールの搭載方法及び搭載装置並びにバンプ形成方法及びバンプ形成装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303102A (ja) 2005-04-19 2006-11-02 Hitachi Metals Ltd 導電性ボールの搭載装置
JP2008004775A (ja) * 2006-06-22 2008-01-10 Athlete Fa Kk ボール搭載装置およびその制御方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020069294A1 (en) 2018-09-28 2020-04-02 Boston Process Technologies, Inc. Multiple module chip manufacturing arrangement
EP3857592A4 (en) * 2018-09-28 2022-07-13 Boston Process Technologies, Inc. ARRANGEMENT FOR MAKING CHIPS WITH MULTIPLE MODULES

Also Published As

Publication number Publication date
JP5076922B2 (ja) 2012-11-21
KR20090082112A (ko) 2009-07-29
CN101494181B (zh) 2010-10-06
TW200945978A (en) 2009-11-01
JP2009177015A (ja) 2009-08-06
TWI378750B (https=) 2012-12-01
CN101494181A (zh) 2009-07-29

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