CN101460015B - 用于安装至少两种类型的电子元件的方法和设备 - Google Patents
用于安装至少两种类型的电子元件的方法和设备 Download PDFInfo
- Publication number
- CN101460015B CN101460015B CN2008101838364A CN200810183836A CN101460015B CN 101460015 B CN101460015 B CN 101460015B CN 2008101838364 A CN2008101838364 A CN 2008101838364A CN 200810183836 A CN200810183836 A CN 200810183836A CN 101460015 B CN101460015 B CN 101460015B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- soldering paste
- substrate
- mask
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 238000005476 soldering Methods 0.000 claims description 104
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract 4
- 238000010992 reflux Methods 0.000 description 7
- 230000004927 fusion Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2027—Guiding means, e.g. for guiding flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070129010A KR101364538B1 (ko) | 2007-12-12 | 2007-12-12 | 적어도 2종의 전자 부품들의 실장 방법 및 실장 장치 |
KR1020070129010 | 2007-12-12 | ||
KR10-2007-0129010 | 2007-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101460015A CN101460015A (zh) | 2009-06-17 |
CN101460015B true CN101460015B (zh) | 2013-04-24 |
Family
ID=40751889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101838364A Expired - Fee Related CN101460015B (zh) | 2007-12-12 | 2008-12-09 | 用于安装至少两种类型的电子元件的方法和设备 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7694868B2 (zh) |
KR (1) | KR101364538B1 (zh) |
CN (1) | CN101460015B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112013019109A2 (pt) | 2011-01-30 | 2017-11-07 | Koninl Philips Electronics Nv | conjunto de placa de circuito impresso, método de montagem de um conjunto de placa de circuito impresso e método de desmontar um ou mais conjuntos de placa de circuito impresso |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1208368A (zh) * | 1995-05-26 | 1999-02-17 | 福姆法克特公司 | 利用牺牲基片制作互连件和接点 |
JP2000294914A (ja) * | 1999-04-06 | 2000-10-20 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP3215278B2 (ja) * | 1995-03-03 | 2001-10-02 | 株式会社東芝 | スクリーン印刷装置およびスクリーン印刷方法 |
US6472735B2 (en) * | 2000-06-21 | 2002-10-29 | Harlan R. Isaak | Three-dimensional memory stacking using anisotropic epoxy interconnections |
CN1543294A (zh) * | 2003-03-31 | 2004-11-03 | 三洋电机株式会社 | 金属掩模和使用该金属掩膜印刷无铅焊膏的方法 |
CN1764350A (zh) * | 2004-10-15 | 2006-04-26 | 播磨化成株式会社 | 树脂掩膜层的除去方法和带焊锡突起的基板的制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
JP3087706B2 (ja) * | 1997-11-10 | 2000-09-11 | 日本電気株式会社 | スクリーン印刷メタルマスク |
JP2001185842A (ja) | 1999-12-24 | 2001-07-06 | Sony Corp | 電子部品実装基板及び電子部品の実装方法 |
KR100346382B1 (ko) | 2000-02-02 | 2002-08-01 | 삼성에스디아이 주식회사 | 메탈 마스크와 상기 메탈 마스크를 사용하여 솔더 크림을도포하는 방법 |
KR20050068087A (ko) * | 2003-12-29 | 2005-07-05 | (주)아이디에스 | 다용도 인쇄용 스퀴지를 이용한 인쇄방법 및 다용도인쇄용 스퀴지 |
TWI288590B (en) | 2005-10-31 | 2007-10-11 | Unimicron Technology Corp | Method of forming solder mask and circuit board with solder mask |
-
2007
- 2007-12-12 KR KR1020070129010A patent/KR101364538B1/ko not_active IP Right Cessation
-
2008
- 2008-12-02 US US12/315,341 patent/US7694868B2/en not_active Expired - Fee Related
- 2008-12-09 CN CN2008101838364A patent/CN101460015B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3215278B2 (ja) * | 1995-03-03 | 2001-10-02 | 株式会社東芝 | スクリーン印刷装置およびスクリーン印刷方法 |
CN1208368A (zh) * | 1995-05-26 | 1999-02-17 | 福姆法克特公司 | 利用牺牲基片制作互连件和接点 |
JP2000294914A (ja) * | 1999-04-06 | 2000-10-20 | Seiko Epson Corp | 半導体装置及びその製造方法 |
US6472735B2 (en) * | 2000-06-21 | 2002-10-29 | Harlan R. Isaak | Three-dimensional memory stacking using anisotropic epoxy interconnections |
CN1543294A (zh) * | 2003-03-31 | 2004-11-03 | 三洋电机株式会社 | 金属掩模和使用该金属掩膜印刷无铅焊膏的方法 |
CN1764350A (zh) * | 2004-10-15 | 2006-04-26 | 播磨化成株式会社 | 树脂掩膜层的除去方法和带焊锡突起的基板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7694868B2 (en) | 2010-04-13 |
KR20090061970A (ko) | 2009-06-17 |
KR101364538B1 (ko) | 2014-02-18 |
US20090152329A1 (en) | 2009-06-18 |
CN101460015A (zh) | 2009-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DIGITALAL IMAGE CO., LTD. Free format text: FORMER OWNER: SAMSUNG TECHWIN CO., LTD. Effective date: 20090828 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090828 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Electronics Co., Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co., Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SAMSUNG TECHWIN CO., LTD. Effective date: 20101230 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: HAN GUO GYEONGGI SUWON CITY TO: SUWON CITY, GYEONGGI-DO, SOUTH KOREA |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20101230 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Electronics Co., Ltd. Address before: Suwon, Gyeonggi-do, South Korea Applicant before: Samsung Electronics Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20181209 |
|
CF01 | Termination of patent right due to non-payment of annual fee |